PCB

Altair SimSolid Transforms Simulation for Electronics Industry

Retrieved on: 
Wednesday, March 20, 2024
ICS, Workflow, Electronics, Polychlorinated biphenyl, Miniaturization, PCB, AI, ECAD, ALTR

TROY, Mich., March 20, 2024 /PRNewswire/ -- Altair (Nasdaq: ALTR), a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design.

Key Points: 
  • "As the electronics industry pushes the boundaries of complexity and miniaturization, engineers have struggled with simulations that often compromise on detail for expediency.
  • Altair SimSolid will empower engineers to capture the intricate complexities of PCBs and ICs without simplification," said James R. Scapa, founder and chief executive officer, Altair.
  • Altair SimSolid eliminates these approximations to run more accurate simulations for complex problems with vast dimensional disparities."
  • As Altair SimSolid advances towards the inclusion of full-wave electromagnetics, it showcases Altair's vision of a comprehensive, multi-disciplinary simulation environment.

Altair SimSolid Transforms Simulation for Electronics Industry

Retrieved on: 
Wednesday, March 20, 2024
ICS, ALTR, Workflow, Electronics, Polychlorinated biphenyl, Miniaturization, PCB, AI, ECAD

TROY, Mich., March 20, 2024 /PRNewswire/ -- Altair (Nasdaq: ALTR), a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design.

Key Points: 
  • TROY, Mich., March 20, 2024 /PRNewswire/ -- Altair (Nasdaq: ALTR), a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design.
  • "As the electronics industry pushes the boundaries of complexity and miniaturization, engineers have struggled with simulations that often compromise on detail for expediency.
  • Altair SimSolid will empower engineers to capture the intricate complexities of PCBs and ICs without simplification," said James R. Scapa, founder and chief executive officer, Altair.
  • Altair SimSolid eliminates these approximations to run more accurate simulations for complex problems with vast dimensional disparities."

Connector Market Global Trends, Opportunities and Competitive Analysis to 2030 - Key Drivers Include Miniaturization of Electronic Devices and Increasing Electronic Content in Vehicles

Retrieved on: 
Wednesday, March 20, 2024
Growth, Communication, Transport, Internet of things, Tablet, Electronics, Research, Connected space, Amphenol, Immunity, Investment, PCB, Miniaturization, TE, Telecommunications, Printed circuit board

This market report provides a comprehensive analysis of the connector market, including market share, key players, and industry trends.

Key Points: 
  • This market report provides a comprehensive analysis of the connector market, including market share, key players, and industry trends.
  • The future of the global connector market looks promising with opportunities in the transportation, telecom / datacom, computer and peripheral, industrial, and consumer electronics industries.
  • The global connector market is expected to reach an estimated $98.2 billion by 2030 with a CAGR of 3.6% from 2024 to 2030.
  • The major drivers for this market are growth in communication and consumer electronics industries, miniaturization of electronic devices, and increasing electronic content in vehicles.

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

Retrieved on: 
Friday, March 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report: Key Parameters and Estimated Cost, Main Components, Disassembly, Master Chip and Storage, MCU, Ethernet

Retrieved on: 
Friday, March 15, 2024
MDI, DHU, LPDDR4X, CMOS, Polychlorinated biphenyl, DAB, Memory, Infineon Technologies, Qualcomm, DRAM, MCU, Renesas Electronics, IEEE, Radio, Samsung, PCB, NXP, DRM, PHY, FBGA, HD, LVCMOS, Car, AM/FM, The, Printed circuit board

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report" report has been added to ResearchAndMarkets.com's offering.
  • The publisher dismantled 8295-based cockpit domain controller of an electric sedan launched in December 2023, and produced the report SA8295P Series Based Cockpit Domain Controller Analysis and Dismantling.
  • The cockpit domain controller has two versions, high configuration and low configuration, both of which use Qualcomm SA8295P chips.
  • This article carries out a rough dismantling analysis on the DHU, involving overview, master chip, storage, MCU and radio.

Eltek Ltd. Reports Full year and Fourth Quarter 2023 Financial Results

Retrieved on: 
Monday, March 11, 2024
United States dollar, Polychlorinated biphenyl, Growth, CFO, EPS, Electronics, Education minister, Investment, PCB, Pacific Time Zone, Eastern Time Zone, Video game

Revenues for the fourth quarter of 2023 were $12.3 million compared to $10.5 million in the fourth quarter of 2022.

Key Points: 
  • Revenues for the fourth quarter of 2023 were $12.3 million compared to $10.5 million in the fourth quarter of 2022.
  • Operating profit for the fourth quarter of 2023 was $2.0 million compared to operating profit of $0.8 million in the fourth quarter of 2022.
  • Financial expenses for the fourth quarter of 2023 were $0.3 million compared to financial income of $0.1 million in the fourth quarter of 2022.
  • The financial expenses in the fourth quarter of 2023, derive primarily from the erosion of the US Dollar against the NIS during the quarter.

MKS Instruments Receives 2023 Outstanding Service Award from MFLEX

Retrieved on: 
Wednesday, February 28, 2024
Engineering, MKSI, Flexible, Trust, MKS, PCB, MKS Instruments, Printed circuit board

ANDOVER, Mass., Feb. 28, 2024 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (Nasdaq: MKSI), a global provider of technologies that transform our world, recently received the 2023 Outstanding Service Award from MFLEX, a global leader in flexible printed circuit board manufacturing and assembly.

Key Points: 
  • ANDOVER, Mass., Feb. 28, 2024 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (Nasdaq: MKSI), a global provider of technologies that transform our world, recently received the 2023 Outstanding Service Award from MFLEX, a global leader in flexible printed circuit board manufacturing and assembly.
  • The award recognizes MKS for outstanding customer support and system service in high-production manufacturing environments.
  • “We are honored to be recognized by MFLEX for our strong Service capabilities,” said John T.C.
  • “Our dedicated team understands the importance of maximizing our system performance and is committed to providing continued outstanding products, service and support to further build trust and collaboration with our customers.”
    MKS’ ESI service team was recognized by MFLEX with their 2023 Outstanding Service Award for actively working with the process engineering team to ensure maximum system uptime and productivity.

Vishay Intertechnology 80 V Symmetric Dual MOSFET Delivers Best in Class RDS(ON) in PowerPAIR® 3x3FS to Increase Power Density, Efficiency, and Thermal Performance

Retrieved on: 
Wednesday, February 28, 2024
MOSFET, Vishay Intertechnology, VSH, POL, PCB, FOM, Radio, Electric power

For power conversion in industrial and telecom applications, the Vishay Siliconix SiZF4800LDT increases power density and efficiency while enhancing thermal performance, reducing component counts, and simplifying designs.

Key Points: 
  • For power conversion in industrial and telecom applications, the Vishay Siliconix SiZF4800LDT increases power density and efficiency while enhancing thermal performance, reducing component counts, and simplifying designs.
  • The dual MOSFET released today can be used in place of two discrete devices typically specified in the PowerPAK® 1212 package, saving 50 % board space.
  • To increase power density, the MOSFET offers best in class on-resistance down to 18.5 mΩ typical at 4.5 V. This is 16 % lower than the closest competing device in the same package dimensions.
  • The device’s flip-chip technology enhances thermal dissipation, resulting in 54 % lower thermal resistance compared to competing MOSFETs.

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device

Retrieved on: 
Monday, February 26, 2024
AC/DC, LDO, Simulink, Tiantong (Satellite), Torque, USB, MOSFET, MCAF, Microcontroller, Integrated circuit, GUI, MCSK, BOM, FD, MCU, Ecosystem, FOC, BLDC, VDC, Microchip Technology, DSC, Digital signal controller, DIM, PCB, MCHP, Hertz, CPU, Electric motor

“By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space.”

Key Points: 
  • “By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space.”
    The integrated motor driver devices can be powered by a single power supply up to 29V (operation) and 40V (transient).
  • Operating between 70—100 MHz, the dsPIC DSC-based integrated motor drivers provide high CPU performance and can support efficient deployment of FOC and other advanced motor control algorithms.
  • To learn more about Microchip’s growing portfolio of integrated motor drivers visit the dsPIC DSC-Based integrated motor drivers webpage.
  • The MCSK includes a dsPIC33CK low-voltage motor control development board, a 24V three-phase BLDC motor, an AC/DC adapter, a USB cable and other accessories.

Ethernovia Unveils World’s First Single and Quad Port, 10G to 1G Automotive PHY in 7nm

Retrieved on: 
Tuesday, March 5, 2024
Technology, EV, Electric Vehicles, Semiconductor, Automotive, General Automotive, Software, Networks, Internet, Hardware, Data Management, Qualcomm Ventures, SDV, PHY, Data-rate units, Silicon, Volkswagen Group, Safety, AMD, Family, IEEE, PCB, Porsche, Partnership, Video game

“As demands for the vehicle of the future continue to rise—greater safety, full autonomy, long-range electrification and more—vehicular bandwidth demands rise commensurately,” said Ramin Shirani, Ethernovia co-founder and CEO.

Key Points: 
  • “As demands for the vehicle of the future continue to rise—greater safety, full autonomy, long-range electrification and more—vehicular bandwidth demands rise commensurately,” said Ramin Shirani, Ethernovia co-founder and CEO.
  • The single port ENT11100 and ENT11025 are now sampling to customers with the quad port devices sampling later this year.
  • The devices are the automotive semiconductor company’s first in a planned family of products encompassing a holistic hardware and software system for the next generation of centralized vehicle architecture.
  • That will include a high-bandwidth, low-latency switch in the 7nm process currently being developed in strategic partnership with leading original equipment manufacturer Continental .