CXL

Samsung Demonstrates New CXL Capabilities and Introduces New Memory Module for Scalable, Composable Disaggregated Infrastructure at Memcon 2024

Retrieved on: 
Tuesday, March 26, 2024
Data Management, Semiconductor, Consumer Electronics, Technology, Software, Artificial Intelligence, Hardware, Corporation, HBM, TC, Memory, Broadcom Inc., CMM, DRAM, Red Hat, Memorandum, Red, Peaberry, AI, Samsung Electronics, CXL, Supermicro, TCO, VMware, FPGA, Samsung, Ecosystem, Persistent memory, TB, Compute Express Link, Multimedia, CPU, IMDB, AIC, Computer data storage

View the full release here: https://www.businesswire.com/news/home/20240326037385/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240326037385/en/
    Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America – Memory at Samsung Electronics, unveiled the industry's first CXL Memory Module Hybrid for Persistent Memory (CMM-H PM) during his keynote presentation at Memcon 2024.
  • Samsung also partnered with Supermicro , a global leader in Plug and Play Rack-Scale IT solutions, to demonstrate the industry’s first Rack-Level memory solution for highly scalable and composable disaggregated infrastructure.
  • On stage, Samsung and VMware by Broadcom also introduced project Peaberry, the world’s first FPGA (Field Programmable Gate Arrays)-based tiered memory solution for hypervisors called CXL Memory Module Hybrid for Tiered Memory (CMM-H TM) .
  • To learn more about Samsung Semiconductor’s advanced memory technologies and solutions, please visit: https://semiconductor.samsung.com/us/

Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024

Retrieved on: 
Monday, March 25, 2024
Mobile, Wireless, Technology, Public Relations, Investor Relations, Carriers and Services, Communications, Telecommunications, Software, Networks, Internet, Data Management, DSP, LPO, HPC, Controller, AI, CXL, PCI Express, IP, Semi, Ecosystem, Multimedia, PAM4, Silicon

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute solutions for the world’s technology infrastructure, today announced its collaboration with InnoLight Technology, the leader in data center optics, to bring a low power, low latency linear pluggable optics (LPO) demonstration to OFC 2024.

Key Points: 
  • Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute solutions for the world’s technology infrastructure, today announced its collaboration with InnoLight Technology, the leader in data center optics, to bring a low power, low latency linear pluggable optics (LPO) demonstration to OFC 2024.
  • Operating at 64 Gbps per lane, this demonstration showcases Alphawave Semi’s PCIe 6.0® subsystem (Controller + PHY) with InnoLight’s LPO OSFP optics, breaking down barriers to disaggregated networking and enabling connectivity at the datacenter scale.
  • Operating at 64 Gbps per lane, it showcases Alphawave Semi’s PCIe 6.0 subsystem (Controller + PHY) with InnoLight’s LPO OSFP optics.
  • More on Alphawave Semi’s PCIe Portfolio: Alphawave Semi’s PCI-Express and CXL Solution
    The Alphawave Semi PCIe Controller + PHY subsystem is an extremely power-efficient, low-latency, and highly reliable interface IP, having been built off the industry’s most successful PAM4 SerDes IP.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Phison Announces Strategic Partnerships Deploying aiDAPTIV+ at NVIDIA GTC 2024

Retrieved on: 
Monday, March 18, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Audio, Video, Automotive Manufacturing, Manufacturing, GTC, OP, GPU, University, ASUS, MultiMediaCard, Nature, JEDEC, USB, IP, Corporation, UFS, Partnership, 2.0, PCI Express, IEEE-SA, TB, Language, ONFI, GIGABYTE, Memory, NVM Express, Knowledge, Blog, News, AI, CXL, Privacy, Architecture, UFSA, Solid-state drive, Machine learning, Automotive industry, Commodity, PC, MediaTek, SSD, MIPI, SDA, Luigi, PCI-SIG, Electronics, Graphics processing unit, MAINGEAR, Data center, Multimedia, NVIDIA, Video game

Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.

Key Points: 
  • Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.
  • "MAINGEAR's Pro AI Series workstations, driven by Phison aiDAPTIV+, empower users with large language model AI training prowess without excessive costs.
  • "We continue to uphold our partnership with Phison, aiming to foster innovation and maintain competitiveness in the market."
  • To know more about Phison, please visit Phison Website or Phison Q&A for details.

Astera Labs Expands Widely Deployed, Field-Tested Retimer Portfolio with Industry’s Lowest Power PCIe 6.x/CXL 3.x Solution

Retrieved on: 
Tuesday, March 12, 2024
Software, Networks, Hardware, Artificial Intelligence, Data Management, Technology, Apps, Applications, Semiconductor, Cloud, Corporation, Intel, Synthetic media, GPU, HPC, Gold, AI, CXL, PCI Express, Engineering, Intelligence, Silicon, Senior, Generative, Graphics processing unit, NIC, Data center, ARM Neoverse, Ecosystem, Aries, COSMOS, AMD, Transfer (computing), Central processing unit, CPU, Rack, Video game

New Aries 6 Retimers build upon the company’s widely deployed PCIe 5.0 Retimer portfolio and expands the Intelligent Connectivity Platform that is shipping to all major hyperscalers and AI platform providers.

Key Points: 
  • New Aries 6 Retimers build upon the company’s widely deployed PCIe 5.0 Retimer portfolio and expands the Intelligent Connectivity Platform that is shipping to all major hyperscalers and AI platform providers.
  • As the first offering in Astera Labs’ PCIe 6.x portfolio, Aries 6 sets the stage for a smart PCIe 6.x connectivity backbone that is robust, scalable, and customizable.
  • The Aries Smart DSP Retimer portfolio is rigorously tested in Astera Labs’ Cloud-Scale Interop Lab and in customer platforms to ensure seamless plug-and-play interoperability with leading PCIe ecosystem silicon providers.
  • Schedule to meet with Astera Labs experts and learn how its solutions enable critical connectivity for AI and cloud infrastructure.

Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet ExpressTM (UCIeTM) Subsystem for High-Performance AI Infrastructure

Retrieved on: 
Tuesday, March 12, 2024
Networks, Internet, Hardware, Artificial Intelligence, Data Management, Technology, IOT (Internet of Things), Semiconductor, HBM, Info, Innovation, Integration, CHI, CXL, CXS, PCI Express, Multi, Marketing, OIP, Semi, Ecosystem, PHY, Multimedia, Computation, UCIe, TSMC, Silicon, Video game

This new silicon-proven Universal Chiplet Interconnect Express (UCIeTM) subsystem expands Alphawave Semi’s portfolio and leadership in connectivity silicon.

Key Points: 
  • This new silicon-proven Universal Chiplet Interconnect Express (UCIeTM) subsystem expands Alphawave Semi’s portfolio and leadership in connectivity silicon.
  • It paves the way for a robust, open chiplet ecosystem that accelerates connectivity and compute for high-performance AI systems.
  • An industry-first live demo of Alphawave Semi’s 24Gbps UCIe silicon platform on the TSMC 3nm process was recently unveiled at the Chiplet Summit in Santa Clara, CA.
  • View the full release here: https://www.businesswire.com/news/home/20240311461384/en/
    Alphawave Semi 24Gbps UCIe 3nm silicon platform (Graphic: Business Wire)
    Alphawave Semi’s 3nm UCIe complete PHY + Controller subsystem is capable of 24Gbps data rates, delivering high bandwidth density at extremely low power and low latency.

FORESEE Will Showcase Its Innovative Memory and Storage Solutions at Embedded World 2024

Retrieved on: 
Wednesday, April 3, 2024
UFS, SSD, Memory, SPI, DDR3L, SATA, NVM Express, Internet, Electronics, Research, DDR5, LPDDR5, Software design, MultiMediaCard, CXL, AI, Personal computer, Architecture, Cloud computing, Exhibition, Payment card, MCP, LPDDR

SHENZHEN, China, April 3, 2024 /PRNewswire/ -- The industry storage brand FORESEE under Longsys(301308.SZ) will showcase a full line up of innovative products and solutions at embedded world 2024, the highly anticipated embedded systems event in Nuremberg, Germany on April 9th.

Key Points: 
  • SHENZHEN, China, April 3, 2024 /PRNewswire/ -- The industry storage brand FORESEE under Longsys(301308.SZ) will showcase a full line up of innovative products and solutions at embedded world 2024, the highly anticipated embedded systems event in Nuremberg, Germany on April 9th.
  • In the micro-storage field, FORESEE will exhibit SPI NAND Flash, DDR3L, and NAND-based MCP (LPDDR4x), demonstrating its independent research and development capabilities in small-capacity storage solutions.
  • In the mobile memory sector, FORESEE will showcase industrial pSLC series microSD, industrial SD/microSD, and commercial EPLUS V30 series products.
  • With the unveiling of these advanced products and solutions, FORESEE has further strengthened its memory and storage lineup and bolstered its position in the memory market.

XConn Technologies Releases Early Production Silicon Samples of "Apollo" CXL 2.0 Switch at MemCon 2024

Retrieved on: 
Tuesday, March 26, 2024
Memorandum, SOC, Computer, Computer History Museum, Apollo, Memory, 2.0, CXL, AI, PCI Express, Samsung, 1.1, Cloud computing, Ecosystem, OAM, Silicon, Video game

MOUNTAIN VIEW, Calif., March 26, 2024 /PRNewswire/ -- XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for the future of high-performance computing and AI applications, today announced the release of early production samples for its "Apollo" CXL 2.0 switch. XConn Apollo will be the central component of a real-world use case demonstration of a CXL Memory Pool, with Samsung during MemCon 2024, March 26-27, in Mountain View, Calif.

Key Points: 
  • MOUNTAIN VIEW, Calif., March 26, 2024 /PRNewswire/ -- XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for the future of high-performance computing and AI applications, today announced the release of early production samples for its "Apollo" CXL 2.0 switch.
  • The XConn Apollo switch is the industry's first and only hybrid CXL 2.0 and PCIe Gen 5 interconnect solution.
  • "Today's release of production silicon samples of our Apollo CXL 2.0 switch marks a new milestone in our next-generation interconnect journey.
  • XConn CXL switch SoC chip is used in Samsung CMM-B (CXL Memory Module – Box)."

Accelerating Networking and Edge AI with AEWIN High Performance Network Appliances and Edge Servers Powered by AMD Siena

Retrieved on: 
Tuesday, March 26, 2024
OS, MEC, GPU, SSD, TPM, NVM Express, DDR5, Network, AI, CXL, PCI Express, TCO, 2U, NIC, Processor, EPYC, DW, AMD, Solid-state drive, Computer appliance, TDP, Video game

TAIPEI, March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.

Key Points: 
  • TAIPEI, March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.
  • Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.
  • Benefited from the Siena CPU with energy efficiency, both models feature extraordinary computing performance and short-depth design (SCB-1945: 548mm; SCB-1947A: 600mm) to achieve faster speeds for Edge Computing and Networking.
  • In addition to the GPU slots, there are 4x PCIe 5.0 x8 slots available for NIC, accelerators, or NVMe SSDs.

Accelerating Networking and Edge AI with AEWIN High Performance Network Appliances and Edge Servers Powered by AMD Siena

Retrieved on: 
Tuesday, March 26, 2024
OS, MEC, GPU, SSD, TPM, NVM Express, DDR5, Network, AI, CXL, PCI Express, TCO, 2U, NIC, Processor, EPYC, DW, AMD, Solid-state drive, Multimedia, Computer appliance, TDP, Video game

TAIPEI , March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.

Key Points: 
  • TAIPEI , March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.
  • Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.
  • Benefited from the Siena CPU with energy efficiency, both models feature extraordinary computing performance and short-depth design (SCB-1945: 548mm; SCB-1947A: 600mm) to achieve faster speeds for Edge Computing and Networking.
  • In addition to the GPU slots, there are 4x PCIe 5.0 x8 slots available for NIC, accelerators, or NVMe SSDs.