FOM

Vishay Intertechnology 80 V Symmetric Dual MOSFET Delivers Best in Class RDS(ON) in PowerPAIR® 3x3FS to Increase Power Density, Efficiency, and Thermal Performance

Retrieved on: 
Wednesday, February 28, 2024

For power conversion in industrial and telecom applications, the Vishay Siliconix SiZF4800LDT increases power density and efficiency while enhancing thermal performance, reducing component counts, and simplifying designs.

Key Points: 
  • For power conversion in industrial and telecom applications, the Vishay Siliconix SiZF4800LDT increases power density and efficiency while enhancing thermal performance, reducing component counts, and simplifying designs.
  • The dual MOSFET released today can be used in place of two discrete devices typically specified in the PowerPAK® 1212 package, saving 50 % board space.
  • To increase power density, the MOSFET offers best in class on-resistance down to 18.5 mΩ typical at 4.5 V. This is 16 % lower than the closest competing device in the same package dimensions.
  • The device’s flip-chip technology enhances thermal dissipation, resulting in 54 % lower thermal resistance compared to competing MOSFETs.

Fundamentals of Grid Batteries Course: Valuation, Design, Procurement, and Operations (Houston, United States - April 2-3, 2024) - ResearchAndMarkets.com

Retrieved on: 
Wednesday, February 28, 2024

The "In-Depth Seminar: Grid Batteries: Valuation, Design, Procurement, and Operations" training has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "In-Depth Seminar: Grid Batteries: Valuation, Design, Procurement, and Operations" training has been added to ResearchAndMarkets.com's offering.
  • The instructor runs a consulting practice and has many examples of the items in the training to show.
  • Where applicable the Acelerex Grid Analytics planning tools will be used for examples for BESS modeling and simulations.
  • Available financing options for ESS plants with application mapping - added with case studies - for utilities, commercial industrial, and residential.

Vishay Intertechnology 30 V N-Channel MOSFET With Source Flip Technology Delivers Best in Class RDS(ON) Down to 0.71 mΩ in PowerPAK® 1212-F

Retrieved on: 
Wednesday, February 14, 2024

Featuring source flip technology in the 3.3 mm by 3.3 mm PowerPAK® 1212-F package, the Vishay Siliconix SiSD5300DN provides best in class on-resistance of 0.71 mΩ at 10 V and on-resistance times gate charge — a critical figure of merit (FOM) for MOSFETs used in switching applications — of 42 mΩ*nC.

Key Points: 
  • Featuring source flip technology in the 3.3 mm by 3.3 mm PowerPAK® 1212-F package, the Vishay Siliconix SiSD5300DN provides best in class on-resistance of 0.71 mΩ at 10 V and on-resistance times gate charge — a critical figure of merit (FOM) for MOSFETs used in switching applications — of 42 mΩ*nC.
  • Occupying the same footprint as the PowerPAK 1212-8S, the device released today offers 18 % lower on-resistance to increase power density, while its source flip technology reduces thermal resistance by 63 °C/W to 56 °C/W.
  • PowerPAK 1212-F source flip technology reverses the usual proportions of the ground and source pads, extending the area of the ground pad to provide a more efficient thermal dissipation path and thus promoting cooler operation.
  • At the same time, the PowerPAK 1212-F minimizes the extent of the switching area, which helps to reduce the impact of trace noise.

Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package

Retrieved on: 
Wednesday, January 24, 2024

Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.

Key Points: 
  • Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.
  • AOS’ new top and bottom cooling DFN 5x6 package is designed to achieve the highest heat transfer between the exposed top contact and heat sink due to its large surface contact area construction.
  • The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS’ standard DFN 5x6 package, eliminating the need to modify existing PCB layouts.
  • “Cooling the power MOSFET in high power design can be challenging, and AOS has successfully addressed this essential issue with our advanced top exposed package design.

Foran Announces Size of Previously Announced Brokered Private Placement of C$200 Million

Retrieved on: 
Wednesday, November 29, 2023

VANCOUVER, British Columbia, Nov. 29, 2023 (GLOBE NEWSWIRE) -- Foran Mining Corporation (TSX: FOM) (OTCQX: FMCXF) (“Foran” or the “Company”) is pleased to announce that in connection with the previously announced private placement on November 27, 2023 (the “Offering”), the Company together with BMO Capital Markets as sole bookrunner and co-lead agent together with Eight Capital and National Bank Financial as co-lead agents, on behalf of a syndicate of agents (together the “Agents”), have sized the Offering at C$200 million.

Key Points: 
  • The net proceeds of the Offering will be used for exploration and development of the Company’s mineral projects in Saskatchewan, and for working capital and general corporate purposes.
  • The securities issued pursuant to the Offering shall be subject to a four-month plus one day hold period commencing on the day of the closing of the Offering under applicable Canadian securities laws.
  • This release does not constitute an offer for sale of securities in the United States.
  • FOR ADDITIONAL INFORMATION & MEDIA ENQUIRIES:

Foran Announces C$200 Million Brokered Private Placement

Retrieved on: 
Monday, November 27, 2023

VANCOUVER, British Columbia, Nov. 27, 2023 (GLOBE NEWSWIRE) -- Foran Mining Corporation (TSX: FOM) (OTCQX: FMCXF) (“Foran” or the “Company”) is pleased to announce that it has entered into an agreement with BMO Capital Markets as sole bookrunner and co-lead agent together with Eight Capital and National Bank Financial as co-lead agents, on behalf of a syndicate of agents (together the “Agents”) pursuant to which the Company has launched a proposed private placement (the “Offering”) for aggregate gross proceeds of up to approximately C$200 million. 

Key Points: 
  • The net proceeds of the Offering will be used for exploration and development of the Company’s mineral projects in Saskatchewan, and for working capital and general corporate purposes.
  • The securities issued pursuant to the Offering shall be subject to a four-month plus one day hold period commencing on the day of the closing of the Offering under applicable Canadian securities laws.
  • This release does not constitute an offer for sale of securities in the United States.
  • FOR ADDITIONAL INFORMATION & MEDIA ENQUIRIES:

Grid Batteries Seminar: Focus on Valuation, Design, Procurement, and Operations (Houston, United States - December 5-6, 2023)

Retrieved on: 
Thursday, November 23, 2023

- Commercial values include microgrid, demand Charge Reduction - Peak demand shaving, optimizing RE use on site, resiliency - backup power for Utility outages, etc.

Key Points: 
  • - Commercial values include microgrid, demand Charge Reduction - Peak demand shaving, optimizing RE use on site, resiliency - backup power for Utility outages, etc.
  • - Policy case studies with Energy Storage CA, MA, NY and others
    - Case studies on various BESS plant focus on utility scale.
  • - Analysis and methodology for the system value of electricity storage vs. other flexibility (ocgt, ccgt, engine, etc) options
    - Competition for Battery Energy Storage?
  • - Methodology to identify and determine energy storage services and sizing for various applications for the benefits of system - with exercise.

Over 50 advanced manufacturing innovations to launch at Industrial Transformation ASIA-PACIFIC 2023

Retrieved on: 
Tuesday, October 10, 2023

"Recent disruptions have placed a greater impetus for manufacturers and businesses in the global supply chain to adopt new technological innovations and sustainable solutions to remain competitive.

Key Points: 
  • "Recent disruptions have placed a greater impetus for manufacturers and businesses in the global supply chain to adopt new technological innovations and sustainable solutions to remain competitive.
  • Global industry leaders, decision makers and key players in the region's business ecosystem will be joining the robust three-day conference programme at ITAP 2023, with highlights such as the Industrial Transformation Forum, the invitation-only Future of Manufacturing (FOM) CXO Summit, and the Industrial Innovation Stage.
  • Additionally, visitors to the Siemens booth at ITAP 2023 can meet with the winners from Siemens' "This is Industrial Edge" competition, who will be showcasing solutions that can either improve manufacturing processes and/or sustainability, using Industrial Edge products.
  • To check out the key topics and speakers at this year's ITAP, click here (https://ter.li/z5ai0h).

Grid Batteries Seminar: Focus on Valuation, Design, Procurement, and Operations (Houston, United States - December 5-6, 2023) - ResearchAndMarkets.com

Retrieved on: 
Thursday, October 12, 2023

- Commercial values include microgrid, demand Charge Reduction - Peak demand shaving, optimizing RE use on site, resiliency - backup power for Utility outages, etc.

Key Points: 
  • - Commercial values include microgrid, demand Charge Reduction - Peak demand shaving, optimizing RE use on site, resiliency - backup power for Utility outages, etc.
  • - Policy case studies with Energy Storage CA, MA, NY and others
    - Case studies on various BESS plant focus on utility scale.
  • - Analysis and methodology for the system value of electricity storage vs. other flexibility (ocgt, ccgt, engine, etc) options
    - Competition for Battery Energy Storage?
  • - Methodology to identify and determine energy storage services and sizing for various applications for the benefits of system - with exercise.

Magnachip Unveils New 8th-Generation 150V MXT MV MOSFETs

Retrieved on: 
Tuesday, October 10, 2023

SEOUL, South Korea, Oct. 10, 2023 /PRNewswire/ -- Magnachip Semiconductor Corporation ("Magnachip" or "Company") (NYSE: MX) announced today the launch of two new 150V *MXT MV Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), using its 8th-generation trench MOSFET technology.

Key Points: 
  • SEOUL, South Korea, Oct. 10, 2023 /PRNewswire/ -- Magnachip Semiconductor Corporation ("Magnachip" or "Company") (NYSE: MX) announced today the launch of two new 150V *MXT MV Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), using its 8th-generation trench MOSFET technology.
  • These newly released 8th-generation 150V MXT MV MOSFETs (MDES15N056PTRH, MDU150N113PTVRH) were developed by leveraging Magnachip's cutting-edge trench MOSFET technology.
  • "Following the introduction of five 8th-generation 200V and 150V MOSFETs last year, we are pleased to now release two additional 150V MXT MV MOSFET product offerings in new packages," said YJ Kim, CEO of Magnachip.
  • "Magnachip will continue to expand its high-efficiency MXT MOSFET product portfolio, including new releases based on 180nm microfabrication technology in the near future."