JEDEC

Avalanche Technology Announces Support for NASA PEMS Qualification and Screening

Retrieved on: 
Monday, April 8, 2024
PEMS, LEO, DPA, Avalanche, Risk, Swap, Aerospace, ISO9001, Software, MRAM, JEDEC, NASA, Defense

FREMONT, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, announced today the launch of a new product derivative to address the growing demand from the aerospace and defense community for extended qualification and screening solutions, particularly NASA PEMS INST-0001.

Key Points: 
  • In response to unprecedented demand for extended qualification & screening flows, Avalanche rolls out pin compatible NASA PEMS options for enabling Dual QSPI MRAM family.
  • FREMONT, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, announced today the launch of a new product derivative to address the growing demand from the aerospace and defense community for extended qualification and screening solutions, particularly NASA PEMS INST-0001.
  • "Having the ability to leverage pin compatible options for extended qualification to NASA PEMS provides additional platform scalability our customers want, and with Avalanche MRAM, the data integrity they need."
  • By extending its commanding lead with partners' own options for packaging, qualification, and screening, Avalanche gives customers choices for tailored platforms that can evolve with changing program requirements.

Phison Collaborates with MediaTek to Propel Generative AI Computing and Services

Retrieved on: 
Tuesday, March 26, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Automotive Manufacturing, Aerospace, Manufacturing, AOI, UFS, ONFI, Synthetic media, GPU, MediaTek, Assistant, Professor, SSD, MIPI, GAISF, SDA, DRAM, NVM Express, Knowledge, Blog, Carbon footprint, MultiMediaCard, AI, IEEE-SA, PCI-SIG, Life, JEDEC, Nature, Electronics, Architecture, USB, IP, Ecosystem, UFSA, Solid-state drive, Leonardo da Vinci, Multimedia, Media, Automotive industry, Generative, Medical device

Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.

Key Points: 
  • Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.
  • (Graphic: Phison)
    MediaTek DaVinci is an advanced, open platform for generative AI services, built on the Generative AI Service Framework (GAISF).
  • Phison's aiDAPTIV+ features a pioneering SSD-integrated AI computing architecture that breaks down large AI models for concurrent operation with SSDs.
  • "aiDAPTIV+ is set to revolutionize AI model fine-tuning, and MediaTek DaVinci has already made significant strides in AI services,” said Dr. Wei Lin, CTO, Phison.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Phison Announces Strategic Partnerships Deploying aiDAPTIV+ at NVIDIA GTC 2024

Retrieved on: 
Monday, March 18, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Audio, Video, Automotive Manufacturing, Manufacturing, GTC, OP, GPU, University, ASUS, MultiMediaCard, Nature, JEDEC, USB, IP, Corporation, UFS, Partnership, 2.0, PCI Express, IEEE-SA, TB, Language, ONFI, GIGABYTE, Memory, NVM Express, Knowledge, Blog, News, AI, CXL, Privacy, Architecture, UFSA, Solid-state drive, Machine learning, Automotive industry, Commodity, PC, MediaTek, SSD, MIPI, SDA, Luigi, PCI-SIG, Electronics, Graphics processing unit, MAINGEAR, Data center, Multimedia, NVIDIA, Video game

Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.

Key Points: 
  • Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.
  • "MAINGEAR's Pro AI Series workstations, driven by Phison aiDAPTIV+, empower users with large language model AI training prowess without excessive costs.
  • "We continue to uphold our partnership with Phison, aiming to foster innovation and maintain competitiveness in the market."
  • To know more about Phison, please visit Phison Website or Phison Q&A for details.

Introspect Technology Ships World's First GDDR7 Memory Test System

Retrieved on: 
Wednesday, March 27, 2024
GPU, Memory, Artificial intelligence, JEDEC, AC, Ecosystem, PHY, PAM4, SGRAM, Data-rate units, PAM, Video game

MONTREAL, March 27, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, a JEDEC® member and a leading manufacturer of test and measurement instruments, announced today that it has shipped the M5512 GDDR7 Memory Test System, the world's first commercial solution for testing JEDEC's newly minted JESD239 Graphics Double Data Rate (GDDR7) SGRAM specification. This category-creating solution enables graphics memory engineers, GPU design engineers, product engineers in both memory and GPU spaces, and system integrators to rapidly bring up new GDDR7 memory devices, debug protocol errors, characterize signal integrity, and perform detailed memory read/write functional stress testing without requiring any other tool.

Key Points: 
  • MONTREAL, March 27, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, a JEDEC ® member and a leading manufacturer of test and measurement instruments, announced today that it has shipped the M5512 GDDR7 Memory Test System , the world's first commercial solution for testing JEDEC's newly minted JESD239 Graphics Double Data Rate (GDDR7) SGRAM specification.
  • "In its quest to support the industry on GDDR7 deployment, Introspect Technology has worked tirelessly in the last few years with JEDEC members to develop the M5512 GDDR7 Memory Test System," said Dr. Mohamed Hafed, CEO at Introspect Technology.
  • The M5512 GDDR7 Memory Test System is a bench-top test and measurement instrument that builds on Introspect Technology's decades long experience in building high-performance and miniature test instruments.
  • The M5512 GDDR7 Memory Test System is part of Introspect Technology's emerging M Series product line, a series of massively parallel products for testing high data rate, high channel count devices and systems.

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

Retrieved on: 
Friday, March 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Silicon Motion Unveils 6nm UFS 4.0 Controller for AI Smartphones, Edge Computing and Automotive Applications

Retrieved on: 
Tuesday, March 12, 2024
ECC, MB, UFS, SRAM, EUV, QLC, SCSI, MIPI, Universal Flash Storage, SIMO, AI, TLC, LDPC, Data-rate units, JEDEC, Senior, UniPro, Silicon, Architecture, SAM, 2.0, TB, Marketing, Silicon Motion, UFS 3.1, IOT, Computer data storage

TAIPEI and MILPITAS, Calif., March 12, 2024 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.   Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

Key Points: 
  • The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.
  • Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.
  • The new second generation SM2753 UFS 3.1 controller solution boasts a high-speed serial-link-based MIPI M-PHY HS-Gear4 x 2-lane, and SCSI architecture model (SAM) enabling unparalleled performance.
  • Silicon Motion's latest UFS controller solutions are equipped with advanced LDPC ECC technology and SRAM data error detection and correction.

JEDEC® Publishes GDDR7 Graphics Memory Standard

Retrieved on: 
Tuesday, March 5, 2024
Mobile, Wireless, Entertainment, Hardware, Electronic Design Automation, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Engineering, Nanotechnology, Electronic Games, Other Technology, Manufacturing, ECC, Cloud, HPC, Scrub, EVP, AI, Bit, Reliability, JEDEC, Computing, Samsung, PAM, SNR, RAS, NRZ, Module (mathematics), GDDR, Memory, GPU, AMD, DRAM, LFSR, Product planning, Parity, NVIDIA, Video game

This groundbreaking new memory standard is available for free download from the JEDEC website .

Key Points: 
  • This groundbreaking new memory standard is available for free download from the JEDEC website .
  • JESD239 GDDR7 offers double the bandwidth over GDDR6, reaching up to 192 GB/s per device, and is poised to meet the escalating demand for more memory bandwidth in graphics, gaming, compute, networking and AI applications.
  • JESD239 GDDR7 is the first JEDEC standard DRAM to use the Pulse Amplitude Modulation (PAM) interface for high frequency operations.
  • “The groundbreaking GDDR7 memory standard unveiled today represents a pivotal step towards unlocking the potential of next-generation consumer, gaming, commercial, and enterprise devices,” said Joe Macri, Compute and Graphics CTO and Corporate Fellow at AMD.

Transphorm Announces Fiscal 2024 Third Quarter Results and Provides Business Update

Retrieved on: 
Tuesday, February 20, 2024
Technology, Hardware, Semiconductor, EVS, Engineering, EV, PD, AI, Renesas Electronics, Calendar, Exercise, Entrepreneurship, SMD, JEDEC, Silicon carbide, Electronics, Security (finance), Gallium nitride, Video game

Transphorm, Inc. (NASDAQ: TGAN)—a global leader in GaN, the future of next generation power systems, announced today its financial results for the third quarter of its fiscal year ending March 31, 2024 (“Q3 Fiscal 2024”).

Key Points: 
  • Transphorm, Inc. (NASDAQ: TGAN)—a global leader in GaN, the future of next generation power systems, announced today its financial results for the third quarter of its fiscal year ending March 31, 2024 (“Q3 Fiscal 2024”).
  • Reported total revenue of $4.7 million for Q3 Fiscal 2024, an increase of 4.0% over the same quarter last year and a decrease of 6.8% from the prior quarter.
  • Government revenue was $1.5 million in the quarter, an increase of 180% from the same quarter last year and flat with the prior quarter.
  • Operating expenses on a non-GAAP basis were $7.3 million in Q3 Fiscal 2024, compared to $6.4 million in the prior quarter and $6.0 million in Q3 Fiscal 2023.

Era of High-Resolution Recording Arrives: Phison Launches Specialized SSDs for Video and Surveillance Systems

Retrieved on: 
Tuesday, February 6, 2024
Technology, Semiconductor, Engineering, Security, Manufacturing, Audio, Video, Hardware, Data Management, Consumer Electronics, Nature, Multimedia, MIPI, Blog, Knowledge, PLP, Solid-state drive, Research, HDD, Noise, Flash memory, Automotive industry, MultiMediaCard, UFS, SDA, Electronics, CCTV, Temperature, SSD, USB, JEDEC, UFSA, ONFI, PCI-SIG, IP, IEEE-SA, NVM Express, TB, Computer data storage

View the full release here: https://www.businesswire.com/news/home/20240206502918/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240206502918/en/
    High-Resolution Recording Era is Here: Phison Introduces Specialized SSD Solutions for Video and Surveillance Systems (Graphic: Phison)
    According to market research data, the global shipment volume of video and surveillance systems is approximately 35 million units annually.
  • While traditional mechanical hard drives (HDDs) have a price advantage, their speed performance has gradually become insufficient to meet the demands of high-resolution video recording.
  • As a result, the demand for SSDs in high-resolution video and surveillance systems is steadily increasing.
  • For more information on Phison's specialized SSD products for video and surveillance, please refer to this link here .