Integrated circuit

Aehr Test Systems to Announce Fiscal 2020 Fourth Quarter and Full Year Financial Results on July 16, 2020

Wednesday, July 8, 2020 - 9:05pm

Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide.

Key Points: 
  • Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide.
  • Aehr Test has developed and introduced several innovative products, including the ABTSand FOX-Pfamilies of test and burn-in systems and FOX WaferPakAligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader.
  • The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems.
  • For more information, please visit Aehr Test Systems website at www.aehr.com .

Introducing Multi-Cure® 9037-F Encapsulant for Printed Circuit Board Assembly

Wednesday, July 8, 2020 - 1:00pm

TORRINGTON, Conn., July 08, 2020 (GLOBE NEWSWIRE) -- Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure 9037-F.

Key Points: 
  • TORRINGTON, Conn., July 08, 2020 (GLOBE NEWSWIRE) -- Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure 9037-F.
  • The product cures in seconds upon exposure to UV/Visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards.
  • The material features improved flexibility and resiliency for a variety of glob-top, chip-on-board, chip-on-flex, chip-on-glass, and wire-tacking/bonding applications.
  • Additional uses include encapsulation of components on circuit boards found in automotive ADAS and infotainment systems, aerospace and defense applications, and consumer electronics.

Si2 Announces 2020 Power of Partnerships Award Winners

Monday, July 6, 2020 - 3:00pm

Semiconductor design experts from industry and academia are this years winners of the Silicon Integration Initiatives Power of Partnerships Award, recognizing the Si2 team that has made the most significant contributions to the field of electronic design automation.

Key Points: 
  • Semiconductor design experts from industry and academia are this years winners of the Silicon Integration Initiatives Power of Partnerships Award, recognizing the Si2 team that has made the most significant contributions to the field of electronic design automation.
  • Led by Jerry Frenkil, Si2 director of OpenStandards , members of the Unified Power Model Working Group are being honored for developing Si2 UPM, a system-level power modeling standard which helps designers describe, analyze, and control power consumption, critical factors in reducing overall design costs and increasing chip performance.
  • Frenkil said the working group has pioneered new methods for power modeling and analysis, leading to increased power efficiency.
  • Each Si2 coalition nominates one team for the annual Power of Partnerships award, which spotlights the essential role volunteers from Si2 member companies play in Si2s continuing success and value to the industry.

Global Die Attach Equipment Market Outlook (2018 to 2027) Featuring Panasonic, West-Bond & Hybond Among Others - ResearchAndMarkets.com

Monday, July 6, 2020 - 11:05am

The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering.
  • The Global Die Attach Equipment market is expected to growing at a CAGR of 7.8% during the forecast period.
  • The die attach equipment business will benefit from assembly and packaging opportunities created by the above-mentioned trends.
  • The die attach equipment offering includes multi-chip bonders for advanced packaging through market techniques such as epoxy, soft solder bonders, etc.

3D IC Market to Reach USD 22.30 Billion by 2027 | CAGR of 16.6% | Reports And Data

Thursday, July 2, 2020 - 2:05pm

NEW YORK, July 2, 2020 /PRNewswire/ -- The global 3D IC market is expected to reach USD 22.30 Billion by 2027, according to a new report by Reports and Data.

Key Points: 
  • NEW YORK, July 2, 2020 /PRNewswire/ -- The global 3D IC market is expected to reach USD 22.30 Billion by 2027, according to a new report by Reports and Data.
  • 3D ICs (Integrated Circuits) provide technical and economic enhancements in efficiency, architecture design, form factor, power, cost, time-to-market, and risk, and thereby drives the market demand.
  • 3D IC allows for more sophisticated integrations, comprising of multi-axis accelerometers, microphones, and gyroscopes, for smartphones.
  • For the purpose of this report, Reports and Data have segmented the global 3D IC market on the basis of application, type, industry verticals, and region:

3D IC Market to Reach USD 22.30 Billion by 2027 | CAGR of 16.6% | Reports And Data

Thursday, July 2, 2020 - 2:11pm

Market Size USD 6.48 Billion in 2019, Market Growth - CAGR of 16.6%, Market Trends Growth of the gaming industry

Key Points: 
  • Market Size USD 6.48 Billion in 2019, Market Growth - CAGR of 16.6%, Market Trends Growth of the gaming industry
    NEW YORK, July 2, 2020 /PRNewswire/ -- The global 3D IC market is expected to reach USD 22.30 Billion by 2027, according to a new report by Reports and Data.
  • 3D ICs (Integrated Circuits) provide technical and economic enhancements in efficiency, architecture design, form factor, power, cost, time-to-market, and risk, and thereby drives the market demand.
  • 3D IC allows for more sophisticated integrations, comprising of multi-axis accelerometers, microphones, and gyroscopes, for smartphones.
  • For the purpose of this report, Reports and Data have segmented the global 3D IC market on the basis of application, type, industry verticals, and region:

DGAP-News: Dialog Semiconductor Plc.: Announcement related to the second interim (twelve weeks) settlement of the second tranche of shares pursuant to the share buyback programme authorised by shareholders at the annual general meeting on May 2, 2019.

Tuesday, June 30, 2020 - 6:03pm

Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things.

Key Points: 
  • Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things.
  • Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go.
  • Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization.
  • The words "anticipate," "believe," "estimate", "expect," "intend," "may," "plan," "project" and "should" and similar expressions identify forward-looking statements.

POET and Sanan IC Sign LOI to Form $50 Million Joint Venture

Tuesday, June 30, 2020 - 12:00pm

The proposed joint venture (JV) will be formed with contributions of US$50 million based on a combined commitment of cash and intellectual property from Sanan IC and intellectual property and know-how from POET.

Key Points: 
  • The proposed joint venture (JV) will be formed with contributions of US$50 million based on a combined commitment of cash and intellectual property from Sanan IC and intellectual property and know-how from POET.
  • Sanan IC is a wholly owned subsidiary of Sanan Optoelectronics Co., Ltd. (Shanghai Stock Exchange, SSE: 600703), the leading manufacturer of advanced ultra-high brightness LED epitaxial wafers and chips in the world.
  • The JV is expected to design, develop, manufacture and sell 100G, 200G and 400G optical engines with customized lasers and photodiodes from Sanan IC combined with optical interposer platform technology from POET.
  • This joint venture has the potential to have a breakthrough on technological innovation as well as product competitiveness, said Raymond Cai, Chief Executive Officer of Sanan IC.

DGAP-News: Dialog Semiconductor Announces Completion of its Acquisition of Adesto Technologies

Monday, June 29, 2020 - 2:07pm

London, United Kingdom - June 29, 2020 - Dialog Semiconductor plc (XETRA: DLG ), a leading provider of battery management, AC/DC power conversion, Wi-Fi, Bluetooth(R) low energy and Industrial integrated circuits (ICs), today announced that it has completed the acquisition of Adesto Technologies Corporation (Adesto) (NASDAQ:IOTS), a leading provider of innovative custom ICs and embedded systems for the IIoT market.

Key Points: 
  • London, United Kingdom - June 29, 2020 - Dialog Semiconductor plc (XETRA: DLG ), a leading provider of battery management, AC/DC power conversion, Wi-Fi, Bluetooth(R) low energy and Industrial integrated circuits (ICs), today announced that it has completed the acquisition of Adesto Technologies Corporation (Adesto) (NASDAQ:IOTS), a leading provider of innovative custom ICs and embedded systems for the IIoT market.
  • "This acquisition immediately adds scale to our Industrial IoT business, providing our expanded customer base with a broader portfolio of differentiated industrial products," said Jalal Bagherli, CEO of Dialog.
  • It is with great excitement that I welcome our new colleagues to Dialog following the completion of our acquisition of Adesto."
  • Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries.

Navitas Drives The Future Of Power Semiconductors

Wednesday, June 24, 2020 - 3:00pm

Now, GaN Power ICs with monolithic-integration of GaN FET, GaN digital and GaN analog circuits have driven a new generation of high-frequency, high-efficiency and very high-density power converters.

Key Points: 
  • Now, GaN Power ICs with monolithic-integration of GaN FET, GaN digital and GaN analog circuits have driven a new generation of high-frequency, high-efficiency and very high-density power converters.
  • Navitas Semiconductor Inc. is the world's first and only GaN Power IC company, founded in 2014.
  • GaN power ICs monolithically-integrate GaN power, GaN analog and GaN logic circuits to enable faster charging, higher power density and greater energy savings for mobile, consumer, enterprise, eMobility and new energy markets.
  • PCIM (Power Conversion Intelligent Motion) is Europe's leading meeting-point for experts out of the areas of Power Electronics and its applications in Intelligent Motion and Power Quality.