Integrated circuit

Texas Instruments board declares first quarter 2020 quarterly dividend

Thursday, January 16, 2020 - 9:10pm

DALLAS, Jan. 16, 2020 /PRNewswire/ --The board of directors of Texas Instruments Incorporated (Nasdaq: TXN) today declared a quarterly cash dividend of $0.90 per share of common stock, payable February 10, 2020, to stockholders of record on January 31, 2020.

Key Points: 
  • DALLAS, Jan. 16, 2020 /PRNewswire/ --The board of directors of Texas Instruments Incorporated (Nasdaq: TXN) today declared a quarterly cash dividend of $0.90 per share of common stock, payable February 10, 2020, to stockholders of record on January 31, 2020.
  • From connected cars and intelligent homes to self-monitoring health devices and automated factories, Texas Instruments Incorporated (TI) (Nasdaq: TXN) products are at work in virtually every type of electronic system.
  • With operations in more than 30 countries, we engineer, manufacture, test and sell analog and embedded semiconductor chips.
  • Our employees, about 30,000 worldwide, are driven by core values of integrity, innovation and commitment, and work every day to shape the future of technology.

Nepes Is Now Supplying a Highly Reliable Fan-Out Package to a Leading Wireless Chip Maker

Thursday, January 16, 2020 - 12:39am

Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker.

Key Points: 
  • Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker.
  • Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies.
  • "High Reliability Fan-out Package," supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Reliability) performance versus standard fan-out technologies by reducing physical stress on chips through sidewall protection structures.
  • Currently, only two companies, nepes included, can mass-produce this advanced package solution.

GBT Receives Early Grant of New Patent

Wednesday, January 15, 2020 - 12:00pm

AI, for both mobile and fixed solutions, is pleased to announce an early patent granting date for its communication microchip patent.

Key Points: 
  • AI, for both mobile and fixed solutions, is pleased to announce an early patent granting date for its communication microchip patent.
  • GBT received a final granting notice confirming the official patent granting date as of December 31, 2019, Patent No.
  • The patent will protect GBT as it seeks to form joint ventures with IC design houses to design next generation communications chips.
  • The patent protects future IC circuit designs that achieve a new level of security and privacy in the IoT/Device world.

UPDATE -- MoDeCH Incorporated Launches eCommerce Website To Supply And Support Downloadable SPICE Models For Analog Circuit Designers

Tuesday, January 14, 2020 - 2:00pm

was developed over the past 15 years based on various proprietary modeling technologies for analog, high speed digital, and power electronics markets.

Key Points: 
  • was developed over the past 15 years based on various proprietary modeling technologies for analog, high speed digital, and power electronics markets.
  • Search include:
    Access to the worlds largest analog simulation library with over 72,000 SPICE models such as transistors, passive components, and integrated circuits (ICs).
  • Models consist of MoDeCH proprietary models and re-distributed models from device manufacturers.
  • Based on the technologies developed in its first decade, MoDeCH has focused on developing highly accurate on-board simulation models since 2013.

Bel Will Participate in 22nd Annual Needham Growth Conference in New York City on January 15, 2020

Monday, January 13, 2020 - 8:19pm

JERSEY CITY, N.J., Jan. 13, 2020 (GLOBE NEWSWIRE) -- Bel Fuse Inc. (Bel, or, the Company) (Nasdaq:BELFA and Nasdaq:BELFB), a leading supplier of products that power, protect and connect electronic circuits, today announced that management will participate in the upcoming 22nd Annual Needham Growth Conference, being held January 14-15 at the Lotte NY Palace Hotel.

Key Points: 
  • JERSEY CITY, N.J., Jan. 13, 2020 (GLOBE NEWSWIRE) -- Bel Fuse Inc. (Bel, or, the Company) (Nasdaq:BELFA and Nasdaq:BELFB), a leading supplier of products that power, protect and connect electronic circuits, today announced that management will participate in the upcoming 22nd Annual Needham Growth Conference, being held January 14-15 at the Lotte NY Palace Hotel.
  • Investors are encouraged to contact their Needham representative or Peter Seltzberg, IR for Bel if interested in scheduling a meeting with management.
  • Bel ( www.belfuse.com ) designs, manufactures and markets a broad array of products that power, protect and connect electronic circuits.
  • These products are primarily used in the networking, telecommunications, computing, military, aerospace, transportation and broadcasting industries.

NextInput Delivers World’s First Integrated Digital Force Sensor in CSP

Tuesday, January 7, 2020 - 5:00pm

NextInput, Inc., the leader in MEMS-based sensing solutions, today announced the worlds first digital force sensor in a tiny 1.77mm2 CSP, representing a 76% footprint reduction compared to the smallest discrete solution.

Key Points: 
  • NextInput, Inc., the leader in MEMS-based sensing solutions, today announced the worlds first digital force sensor in a tiny 1.77mm2 CSP, representing a 76% footprint reduction compared to the smallest discrete solution.
  • The new DF-8600 series represents NextInputs 3rd generation sensor family, integrating a precision force sensor and an ultra-low power Digital Signal Processor (DSP).
  • Compared to ultrasonic alternatives, the NextInput DF-8600 series recognizes intent and provides lower-power consumption, all at materially lower cost.
  • NextInput is the first company in the world to bring a fully integrated, chip-scale digital force sensor to market, says Ali Foughi, NextInput CEO and Founder.

Silicon Labs and Quuppa Team Up to Deliver Best-in-Class Bluetooth Location Solution

Tuesday, January 7, 2020 - 1:07pm

The solution combines the Quuppa Intelligent Location System with Bluetooth LE asset tags using Silicon Labs' best-in-class Bluetooth system-on-chip (SoC) devices including the new EFR32BG22 SoC.

Key Points: 
  • The solution combines the Quuppa Intelligent Location System with Bluetooth LE asset tags using Silicon Labs' best-in-class Bluetooth system-on-chip (SoC) devices including the new EFR32BG22 SoC.
  • "The combination of Quuppa's turnkey infrastructure and Silicon Labs' silicon, software and tools for asset tag design provides IoT developers with a comprehensive solution that reduces the cost and complexity of developing location positioning applications," Fabio Belloni, chief customer officer at Quuppa.
  • For more information about Silicon Labs' Bluetooth direction finding silicon, software and development tools, visit silabs.com/bluetooth-direction-finding .
  • Note to editors: Silicon Labs, Silicon Laboratories, the "S" symbol, the Silicon Laboratories logo and the Silicon Labs logo are trademarks of Silicon Laboratories Inc. All other product names noted herein may be trademarks of their respective holders.

AUKEY Debuts World's Fastest Chargers At CES

Monday, January 6, 2020 - 2:00pm

LAS VEGAS, Jan. 6, 2020 /PRNewswire/ --Global technology leader AUKEY will debut the AUKEY Omnia Series at the Consumer Electronics Show (CES) in Las Vegas this week.

Key Points: 
  • LAS VEGAS, Jan. 6, 2020 /PRNewswire/ --Global technology leader AUKEY will debut the AUKEY Omnia Series at the Consumer Electronics Show (CES) in Las Vegas this week.
  • The new line of gallium nitride (GaN) chargers delivers some of the world's fastest charging speeds and will feature five power delivery (PD) chargers.
  • Designed to provide users with a smaller, lighter and more powerful mobile charging experience, the chargers in the Omnia Series are up to 66% smaller when compared with stock MacBook 13 inch chargers.
  • With the Omnia Series, AUKEY is introducingOmniaChip, a range of brand new integrated circuits (ICs) built into the five chargers in the new line.

Aehr Test Systems to Announce Second Quarter Fiscal 2020 Financial Results on January 9, 2020

Thursday, January 2, 2020 - 9:05pm

Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide.

Key Points: 
  • Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide.
  • Aehr Test has developed and introduced several innovative products, including the ABTSTNM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader.
  • The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems.
  • For more information, please visit Aehr Test Systems website at www.aehr.com .

GBT Files Continuation For Its Communication Microchip Patent

Tuesday, December 31, 2019 - 12:00pm

AI, for both mobile and fixed solutions, announced that the Company filed on December 27, 2019 a continuation application for its communication microchip patentfor its GopherInsight, in order to further protect its innovative concepts and methods.

Key Points: 
  • AI, for both mobile and fixed solutions, announced that the Company filed on December 27, 2019 a continuation application for its communication microchip patentfor its GopherInsight, in order to further protect its innovative concepts and methods.
  • The application has been assigned serial number 16727983.The patent is expected to be granted during the first quarter of 2020.
  • The comprehensive patent seeks to cover new concepts and methodologies within the communication domain, among them mobile parallel processing, network database management, radio-based private, secured communication network, airplane mode and more.
  • GBT plans to offer this technology to IC design houses once the patent is granted, and to seek partnerships within the communication IoT industry in order to create new technological advancements."