PCB

STMicroelectronics’ high-performance microcontrollers pave the way to new innovations in smart home and industrial systems

Retrieved on: 
Tuesday, March 12, 2024
Cortex, Research, Arm, PMIC, ICS, SRAM, UI, ARM Cortex-M, MPU, Algorithm, DTR, Communication, Patent, Internet of things, BOM, Internet, Electronics, MCU, 3D, Software, United States patent law, EHealth, MCE, Animation, PCB, Ecosystem, STM, General-purpose, STM32, STMicroelectronics, PSA, Family, CPU, Video game

Examples include adding richer, colorful user interfaces and performing multiple functions simultaneously, which is usually achieved with microprocessors (MPU).

Key Points: 
  • Examples include adding richer, colorful user interfaces and performing multiple functions simultaneously, which is usually achieved with microprocessors (MPU).
  • “The MCUs promise to enhance the visual performance and responsiveness of future displays, enabling more engaging and interactive user experiences.
  • In addition, power management is integrated on-chip, in contrast with typical MPU practice that requires an external power-management IC (PMIC).
  • STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere.

Baron & Budd Shareholder Scott Summy Named to Forbes List of America’s Top 200 Lawyers

Retrieved on: 
Wednesday, April 3, 2024
Professional Services, Legal, Environment, Baron, Health, BP, 3M, PFAS, Baron & Budd, P.C., Gulf of Mexico, Lawyer, History, PCB, Multimedia, Drinking water, Pharmaceutical industry

Today, the nationally recognized law firm Baron & Budd is pleased to announce that shareholder and leader of the Environmental Litigation Group, Scott Summy , has been named to the Forbes list of America’s Top 200 Lawyers .

Key Points: 
  • Today, the nationally recognized law firm Baron & Budd is pleased to announce that shareholder and leader of the Environmental Litigation Group, Scott Summy , has been named to the Forbes list of America’s Top 200 Lawyers .
  • View the full release here: https://www.businesswire.com/news/home/20240403388246/en/
    Scott Summy, Shareholder and Leader of the Environmental Litigation Group at Baron & Budd (Photo: Business Wire)
    “It is an honor to be recognized by Forbes among America’s Top Lawyers,” said Summy.
  • “For decades, I have worked alongside many talented individuals to hold companies accountable for environmental contamination concerns across the country.
  • Summy remains committed to environmental protection, leading the charge in environmental tort litigation, recognizing the ongoing importance of safeguarding clean water and the environment.

Murata’s multi-band LoRa® radio module simplifies wireless design and supply-chain management for IoT device developers

Retrieved on: 
Tuesday, April 2, 2024
Mobile, Wireless, Hardware, IOT (Internet of Things), Technology, Drones, Agritech, Other Manufacturing, Semiconductor, Satellite, Transport, Logistics, Supply Chain Management, Telecommunications, Manufacturing, FCC, Certification, CE, Murata, Internet of things, Multi, Semtech, TCXO, PCB, Ecosystem, ISM, Multimedia, Renewable energy

Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) today unveiled its groundbreaking Type 2GT module, a multi-band, low-power radio (LoRa®) module which marks a significant leap forward in the development of IoT devices requiring versatile wireless connectivity.

Key Points: 
  • Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) today unveiled its groundbreaking Type 2GT module, a multi-band, low-power radio (LoRa®) module which marks a significant leap forward in the development of IoT devices requiring versatile wireless connectivity.
  • This highly integrated module stands out by offering a comprehensive solution that caters to the complex demands of global certification standards, facilitating seamless deployment in diverse regions and industries.
  • This will significantly lower compliance barriers, fostering innovation across the IoT ecosystem to serve users in multiple geographies.
  • We invite developers, partners, and innovators to explore the potential of the Type 2GT module.

Alpha and Omega Semiconductor Announces XSPairFET™ Buck-Boost MOSFET for Higher Power USB PD 3.1 EPR Applications

Retrieved on: 
Tuesday, March 26, 2024
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Other Technology, Telecommunications, Hardware, ICS, EPR, AOS, PD, USB, PCB, MOSFET, Buck–boost transformer, Multimedia, Video game

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced its AONZ66412 XSPairFET™ MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications.

Key Points: 
  • Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced its AONZ66412 XSPairFET™ MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications.
  • The USB PD 3.1 EPR increases the USB-C maximum power up to 240W.
  • These benefits make the AONZ66412 ideal for buck-boost converters in Type-C USB 3.1 EPR applications, including notebook, USB hub, and power bank designs.
  • AONZ66412 has been tested to achieve 97% efficiency @1MHz in typical USB PD 3.1 EPR conditions of 28V input, 17.6V output, and 8A load conditions.

Tiny, Micropower Hall-Effect Switches from Diodes Incorporated Deliver Compatibility with Low-Voltage Chipsets

Retrieved on: 
Thursday, March 21, 2024
Semiconductor, Hardware, Consumer Electronics, Mobile, Wireless, Technology, Temperature, Tablet, DIOD, Type, PCB, BOP, BRP, Electronics

Diodes Incorporated (Diodes) (Nasdaq: DIOD) introduces three new Hall-effect switches, the AH1899A/B/S , which operate from a low supply voltage and at extremely low quiescent current to extend battery lifetime in mobile and portable devices.

Key Points: 
  • Diodes Incorporated (Diodes) (Nasdaq: DIOD) introduces three new Hall-effect switches, the AH1899A/B/S , which operate from a low supply voltage and at extremely low quiescent current to extend battery lifetime in mobile and portable devices.
  • They are also designed for proximity detection in digital cameras and handheld gaming consoles, as well as general contactless switching.
  • These switches, with their supply-voltage range of 1.1V to 2.0V, seamlessly integrate with state-of-the-art application chipsets operating at 1.2V, ensuring ease of use.
  • The hibernating clocking system in these switches help maximize system energy savings to extend the runtime of battery-operated devices.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

ModalAI Expands Suite of NDAA-Compliant Drone Components to Advance U.S. Drone Industry

Retrieved on: 
Tuesday, March 19, 2024
Software, Networks, Hardware, Robotics, Electronic Design Automation, Technology, Drones, Automotive, Autonomous Driving, Vehicles, Artificial Intelligence, 5G, Other Technology, Telecommunications, FPV, Embryonic stem cell, DIU, Blue, SLAM, 40A, Onsemi, Perception, SWAP, AI, UAS, Unmanned aerial vehicle, PCB, NDAA, Multimedia, Movement, Printed circuit board

ModalAI , a Blue UAS Framework drone and autopilot manufacturer, celebrated for its 16g autonomous UAS autopilot VOXL 2 , today announced availability of NDAA-compliant drone accessories.

Key Points: 
  • ModalAI , a Blue UAS Framework drone and autopilot manufacturer, celebrated for its 16g autonomous UAS autopilot VOXL 2 , today announced availability of NDAA-compliant drone accessories.
  • ModalAI is expanding its technology offerings with the addition of three ESCs and a computer vision image sensor.
  • (Photo: Business Wire)
    ModalAI has been at the forefront of manufacturing UAS components that are compliant with the NDAA ‘20 Section 848.
  • “VOXL 2 is driving the industry to advanced, state of the art UAS,” said Chad Sweet, CEO and co-founder of ModalAI.

Industry’s First 2A Schottky Rectifiers—Available in the DSN1406 from Diodes Incorporated—are Smallest in Class

Retrieved on: 
Thursday, March 14, 2024
Data Management, Consumer Electronics, Technology, Semiconductor, Security, Other Technology, Networks, Internet, Mobile, Wireless, Hardware, Electronic Design Automation, CSP, DIOD, SMB, PCB

This series of innovative high-current trench Schottky rectifiers are housed in a chip-scale package (CSP) that occupies only 0.84mm² board space.

Key Points: 
  • This series of innovative high-current trench Schottky rectifiers are housed in a chip-scale package (CSP) that occupies only 0.84mm² board space.
  • They can be employed for a variety of different purposes, serving as blocking or reverse-polarity protection diodes, boost diodes, and switching diodes.
  • The trio are the first ever 2A trench Schottky rectifiers to be designed into the X3-DSN1406-2 package, making these the industry’s smallest in their class.
  • The SDT2U30CP3 , SDT2U40CP3 , and SDT2U60CP3 rectifiers are available at unit price of $0.16, $0.17, and $0.19 respectively in 2,500 piece quantities.

e-peas showcases complete solutions for batteryless design with industry-leading ecosystem partners at Embedded World

Retrieved on: 
Thursday, April 4, 2024
Socs, PMIC, Conference, SOC, PC, Internet of things, Embedded, RF, PCB, Ecosystem, Consumer electronics

LOUVAIN-LA-NEUVE, Belgium, April 4, 2024 /PRNewswire/ -- e-peas, a leader in energy harvesting power management technology, invites engineers to its booth located Hall 4A -301 at Embedded World 2024 to see just how easy it is to use e-peas PMICs to power wirelessly connected designs using harvested ambient energy. With complete ecosystem solutions for efficient power conversion, storage, and delivery using ambient light, thermal, or RF energy, e-peas and its partners provide a single point of contact for designers looking to move towards a greener IoT with a smaller PCB footprint, downsized storage element, and maintenance-free operation.

Key Points: 
  • With complete ecosystem solutions for efficient power conversion, storage, and delivery using ambient light, thermal, or RF energy, e-peas and its partners provide a single point of contact for designers looking to move towards a greener IoT with a smaller PCB footprint, downsized storage element, and maintenance-free operation.
  • This year, e-peas will be showcasing its collaboration with several industry-leading partners in the fields of wireless Systems-on-Chip (SoCs), energy harvesting sources, and energy storage elements.
  • Geoffroy Gosset, CEO and co-founder of e-peas, stated: "e-peas PMICs ideally complement industry-leading wireless SoCs and other parts of the energy harvesting ecosystem to optimise the overall performance of our customer applications.
  • See the complete design journey from PMIC to end product on booth 4A-301 at the Embedded World Exhibition & Conference on 9-11 April at Nuremburg Messe, Germany.

e-peas showcases complete solutions for batteryless design with industry-leading ecosystem partners at Embedded World

Retrieved on: 
Thursday, April 4, 2024
Socs, PMIC, Conference, SOC, PC, Internet of things, Embedded, RF, PCB, Ecosystem, Consumer electronics

LOUVAIN-LA-NEUVE, Belgium, April 4, 2024 /PRNewswire/ -- e-peas, a leader in energy harvesting power management technology, invites engineers to its booth located Hall 4A -301 at Embedded World 2024 to see just how easy it is to use e-peas PMICs to power wirelessly connected designs using harvested ambient energy. With complete ecosystem solutions for efficient power conversion, storage, and delivery using ambient light, thermal, or RF energy, e-peas and its partners provide a single point of contact for designers looking to move towards a greener IoT with a smaller PCB footprint, downsized storage element, and maintenance-free operation.

Key Points: 
  • With complete ecosystem solutions for efficient power conversion, storage, and delivery using ambient light, thermal, or RF energy, e-peas and its partners provide a single point of contact for designers looking to move towards a greener IoT with a smaller PCB footprint, downsized storage element, and maintenance-free operation.
  • This year, e-peas will be showcasing its collaboration with several industry-leading partners in the fields of wireless Systems-on-Chip (SoCs), energy harvesting sources, and energy storage elements.
  • Geoffroy Gosset, CEO and co-founder of e-peas, stated: "e-peas PMICs ideally complement industry-leading wireless SoCs and other parts of the energy harvesting ecosystem to optimise the overall performance of our customer applications.
  • See the complete design journey from PMIC to end product on booth 4A-301 at the Embedded World Exhibition & Conference on 9-11 April at Nuremburg Messe, Germany.