DRAM

Micron Debuts World’s First Quad-Port SSD to Accelerate Data-Rich Autonomous and AI-Enabled Vehicle Workloads

Retrieved on: 
Tuesday, April 9, 2024
IOV, Micrometre, Temperature, SLC, Socs, Vibration, SOC, Algorithm, Original equipment manufacturer, SSD, Shock, Embedded, DRAM, ADAS, AI, PCI Express, TLC, Micron Technology, VM, Telemetry, IVI, Architecture, OEM, VMS, Ecosystem, IOPS, Solid-state drive, Privacy, Map, Hacking, SR-IOV

The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe® Generation 4 interface and ruggedized automotive design.

Key Points: 
  • The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe® Generation 4 interface and ruggedized automotive design.
  • With these features, the automotive-grade SSD provides the ecosystem with data center-level flexibility and power.
  • This support for multi-host workloads is essential as today’s automotive SoCs increasingly use VMs to multitask across different functions, from autonomous driving to vehicle-to-vehicle communication.
  • The company is showcasing a demo of the SSD at Embedded World in Nuremberg, Germany from April 9-11 at booth 5-109.

Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

Retrieved on: 
Wednesday, April 3, 2024
CHIPS, Technology policy, Incentive, Naval Surface Warfare Center, Carbon, Commerce, Purdue Research Park, Investment, Policy, HBM, Duke Energy, Partnership, Research, News, AI, Architecture, Semiconductor, NSWC, South Korea, SK Hynix, Dynamic random-access memory, Engineering, Assistant, Recycling, DRAM, Organic, Silicon, Graphics processing unit, United States Commercial Service, Ecosystem, Purdue University, Renewable energy

The facility will also develop future generations of chips and house an advanced packaging R&D line.

Key Points: 
  • The facility will also develop future generations of chips and house an advanced packaging R&D line.
  • “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
  • “We believe this project will lay the foundation for a new Silicon Heartland; a semiconductor ecosystem centered in the Midwest Triangle.
  • The IEDC also committed up to $45 million through the Industrial Development Grant Fund to support infrastructure improvements surrounding the new plant.

Redis Acquires Speedb to Supercharge End-to-End Application Performance at Lower Cost

Retrieved on: 
Thursday, March 21, 2024
Synthetic media, Organization, SSD, DRAM, Acquisition, RAM, LLM, Work, Generative, Sales

Redis will leverage Speedb to enhance real-time data processing and power low-latency user experiences, all while guaranteeing unmatched cost performance for all applications where speed is critical, including generative AI applications.

Key Points: 
  • Redis will leverage Speedb to enhance real-time data processing and power low-latency user experiences, all while guaranteeing unmatched cost performance for all applications where speed is critical, including generative AI applications.
  • Taking full advantage of the advancements in SSD storage and transfer rates that Speedb leverages, Redis will serve the full spectrum of performance and cost requirements for enterprise applications where DRAM is not required – empowering developers across the Redis ecosystem to utilize Redis in more use cases.
  • To better support these intensive workflows for development teams, Redis developed Redis Vector Library (RedisVL), which offers a streamlined client that enables the use of Redis in AI-driven tasks.
  • “Over the past two years, we’ve worked hand-in-hand with the Redis team to build integrated solutions that support development teams in optimizing both application performance and cost,” said Adi Gelvan, co-founder and CEO of Speedb.

Advantest to Exhibit Latest Test Solutions at SEMICON China, March 20-22 in Shanghai

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Tuesday, March 12, 2024
IEEE 802.11be, PKG, Socs, ICS, RDK, OTA, Silicon carbide, SOC, LCD, Conference, WiGig, Gallium nitride, Internet of things, WLBI, DRAM, HPC, Integrated circuit, AI, Wi-Fi, IP, CREA, CP, Future, Advantest, CIS, Printed circuit board

TOKYO, March 12, 2024 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions at SEMICON China 2024 on March 20-22 at the Shanghai New International Exhibit Center (SNIEC).

Key Points: 
  • TOKYO, March 12, 2024 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions at SEMICON China 2024 on March 20-22 at the Shanghai New International Exhibit Center (SNIEC).
  • In a unique application-based exhibit, Advantest will highlight how its test technology enables leading-edge innovations in high-performance computing (HPC), AI, automotive, IoT and 5G.
  • Advantest aims to develop test technology that supports a safe, secure and sustainable society, showcasing its sustainability initiatives at this year's event.
  • Wide-ranging DRAM turn-key test solutions, including wafer-level burn-in, DRAM wafer test, core final test, and at-speed interface test.

SMART Modular Technologies Introduces Zefr ZDIMM Memory Modules with Ultra-High Reliability for Demanding Compute Applications

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Tuesday, March 26, 2024
Apps, Applications, Technology, Semiconductor, Security, Other Technology, Software, Internet, Hardware, Electronic Design Automation, Data Management, SGH, DRAM, DDR4, HPC, DDR5, Multimedia, SMART

SMART Modular Technologies, Inc. (“SMART”) , a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products, introduces its ultra-high reliability memory solution, Zefr™ ZDIMM™ memory modules.

Key Points: 
  • SMART Modular Technologies, Inc. (“SMART”) , a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products, introduces its ultra-high reliability memory solution, Zefr™ ZDIMM™ memory modules.
  • View the full release here: https://www.businesswire.com/news/home/20240326690949/en/
    SMART Modular’s Zefr ZDIMM ultra-high reliability memory modules are ideally suited for data centers, hyperscalers, high performance computing (HPC) platforms and other environments that run large memory applications.
  • ZDIMM modules undergo a screening process that replicates real-world conditions which ensures the robustness and resilience of ZDIMM modules in the most demanding computing scenarios.
  • Zefr, ZDIMM, the stylized “S” and “SMART” as well as “SMART Modular Technologies” are trademarks or registered trademarks of SMART Modular Technologies, Inc. All other trademarks and registered trademarks are the properties of their respective owners.

Samsung Demonstrates New CXL Capabilities and Introduces New Memory Module for Scalable, Composable Disaggregated Infrastructure at Memcon 2024

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Tuesday, March 26, 2024
Data Management, Semiconductor, Consumer Electronics, Technology, Software, Artificial Intelligence, Hardware, Corporation, HBM, TC, Memory, Broadcom Inc., CMM, DRAM, Red Hat, Memorandum, Red, Peaberry, AI, Samsung Electronics, CXL, Supermicro, TCO, VMware, FPGA, Samsung, Ecosystem, Persistent memory, TB, Compute Express Link, Multimedia, CPU, IMDB, AIC, Computer data storage

View the full release here: https://www.businesswire.com/news/home/20240326037385/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240326037385/en/
    Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America – Memory at Samsung Electronics, unveiled the industry's first CXL Memory Module Hybrid for Persistent Memory (CMM-H PM) during his keynote presentation at Memcon 2024.
  • Samsung also partnered with Supermicro , a global leader in Plug and Play Rack-Scale IT solutions, to demonstrate the industry’s first Rack-Level memory solution for highly scalable and composable disaggregated infrastructure.
  • On stage, Samsung and VMware by Broadcom also introduced project Peaberry, the world’s first FPGA (Field Programmable Gate Arrays)-based tiered memory solution for hypervisors called CXL Memory Module Hybrid for Tiered Memory (CMM-H TM) .
  • To learn more about Samsung Semiconductor’s advanced memory technologies and solutions, please visit: https://semiconductor.samsung.com/us/

Phison Collaborates with MediaTek to Propel Generative AI Computing and Services

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Tuesday, March 26, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Automotive Manufacturing, Aerospace, Manufacturing, AOI, UFS, ONFI, Synthetic media, GPU, MediaTek, Assistant, Professor, SSD, MIPI, GAISF, SDA, DRAM, NVM Express, Knowledge, Blog, Carbon footprint, MultiMediaCard, AI, IEEE-SA, PCI-SIG, Life, JEDEC, Nature, Electronics, Architecture, USB, IP, Ecosystem, UFSA, Solid-state drive, Leonardo da Vinci, Multimedia, Media, Automotive industry, Generative, Medical device

Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.

Key Points: 
  • Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.
  • (Graphic: Phison)
    MediaTek DaVinci is an advanced, open platform for generative AI services, built on the Generative AI Service Framework (GAISF).
  • Phison's aiDAPTIV+ features a pioneering SSD-integrated AI computing architecture that breaks down large AI models for concurrent operation with SSDs.
  • "aiDAPTIV+ is set to revolutionize AI model fine-tuning, and MediaTek DaVinci has already made significant strides in AI services,” said Dr. Wei Lin, CTO, Phison.

Rochester Electronics and Intelligent Memory Ensure the Availability of Legacy Storage Solutions

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Monday, March 25, 2024
Software, Other Manufacturing, Hardware, Engineering, Technology, Apps, Applications, Semiconductor, Manufacturing, SLC, SDRAM, Longevity, Partnership, DRAM, DDR5, Rochester Electronics, MultiMediaCard, Intelligence, Marketing, Electronics, Multimedia, Availability, Computer data storage

Rochester Electronics, LLC and Intelligent Memory have joined forces to ensure the continued availability of mature and legacy DRAM and NAND storage solutions tailored for industrial and embedded applications.

Key Points: 
  • Rochester Electronics, LLC and Intelligent Memory have joined forces to ensure the continued availability of mature and legacy DRAM and NAND storage solutions tailored for industrial and embedded applications.
  • View the full release here: https://www.businesswire.com/news/home/20240325645193/en/
    Rochester Electronics and Intelligent Memory Ensure the Availability of Legacy Storage Solutions (Photo: Business Wire)
    Intelligent Memory has been the trusted provider of reliable and high-quality memory products for over three decades, serving and fulfilling the enduring, shifting needs of industrial applications.
  • In a landscape where leading-edge memory manufacturers no longer focus on supporting legacy memories, customers with end-of-life microprocessors still require low-density storage solutions.
  • Customers are now able to purchase a range of Intelligent Memory devices, including DRAM, non-volatile NAND/SLC NAND, and low-density eMMC products, through Rochester.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

Retrieved on: 
Wednesday, April 3, 2024
CHIPS, HBM, Ambassador, Package, Assistant, Partnership, DRAM, Research, News, AI, Local government, Organic, Commerce, Purdue Research Park, Silicon, Architecture, HBM3, Midwestern United States, Semiconductor, Ecosystem, ChatGPT, South Korea, HBM2, Government, Dynamic random-access memory

"I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.

Key Points: 
  • "I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.
  • Senator Todd Young, a key advocate for the project, said, "SK hynix will soon be a household name in Indiana.
  • "SK hynix is the global pioneer and dominant market leader in memory chips for AI," Purdue University President Mung Chiang said.
  • It is also a monumental moment for completing the supply chain of digital economy in our country through chips advanced packaging.