UFS

Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX Expo

Retrieved on: 
Monday, April 8, 2024
Automotive Manufacturing, Semiconductor, Security, IOT (Internet of Things), Manufacturing, Vehicle Technology, Automotive, Other Technology, Medical Devices, Internet, Consumer Electronics, Technology, Mobile, Wireless, Other Manufacturing, Health, General Automotive, Engineering, Health Technology, UFS, ICS, Data I/O, Connex, Original equipment manufacturer, Partnership, Internet of things, 500th, Electronics, Sale, PSV, GitHub, Graph, Data-rate units, GraphQL, Family, IPC, Silicon, MQTT, Anaheim Convention Center, Video game

Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, announced the Company has achieved a major milestone with the sale of the 500th PSV automated programming system.

Key Points: 
  • Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, announced the Company has achieved a major milestone with the sale of the 500th PSV automated programming system.
  • Demonstrations of the PSV family will be available in Data I/O’s booth #3107 at the upcoming IPC APEX Expo in Anaheim, California from April 9th – 11th at the Anaheim Convention Center.
  • The PSV family helps them address these challenges,” said Anthony Ambrose, President and CEO at Data I/O Corporation.
  • Customers attending the IPC APEX Expo in Anaheim, California can visit Data I/O’s booth in booth #3107 to see these live product demonstrations.

Phison Collaborates with MediaTek to Propel Generative AI Computing and Services

Retrieved on: 
Tuesday, March 26, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Automotive Manufacturing, Aerospace, Manufacturing, AOI, UFS, ONFI, Synthetic media, GPU, MediaTek, Assistant, Professor, SSD, MIPI, GAISF, SDA, DRAM, NVM Express, Knowledge, Blog, Carbon footprint, MultiMediaCard, AI, IEEE-SA, PCI-SIG, Life, JEDEC, Nature, Electronics, Architecture, USB, IP, Ecosystem, UFSA, Solid-state drive, Leonardo da Vinci, Multimedia, Media, Automotive industry, Generative, Medical device

Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.

Key Points: 
  • Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.
  • (Graphic: Phison)
    MediaTek DaVinci is an advanced, open platform for generative AI services, built on the Generative AI Service Framework (GAISF).
  • Phison's aiDAPTIV+ features a pioneering SSD-integrated AI computing architecture that breaks down large AI models for concurrent operation with SSDs.
  • "aiDAPTIV+ is set to revolutionize AI model fine-tuning, and MediaTek DaVinci has already made significant strides in AI services,” said Dr. Wei Lin, CTO, Phison.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

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Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Phison Announces Strategic Partnerships Deploying aiDAPTIV+ at NVIDIA GTC 2024

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Monday, March 18, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Audio, Video, Automotive Manufacturing, Manufacturing, GTC, OP, GPU, University, ASUS, MultiMediaCard, Nature, JEDEC, USB, IP, Corporation, UFS, Partnership, 2.0, PCI Express, IEEE-SA, TB, Language, ONFI, GIGABYTE, Memory, NVM Express, Knowledge, Blog, News, AI, CXL, Privacy, Architecture, UFSA, Solid-state drive, Machine learning, Automotive industry, Commodity, PC, MediaTek, SSD, MIPI, SDA, Luigi, PCI-SIG, Electronics, Graphics processing unit, MAINGEAR, Data center, Multimedia, NVIDIA, Video game

Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.

Key Points: 
  • Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.
  • "MAINGEAR's Pro AI Series workstations, driven by Phison aiDAPTIV+, empower users with large language model AI training prowess without excessive costs.
  • "We continue to uphold our partnership with Phison, aiming to foster innovation and maintain competitiveness in the market."
  • To know more about Phison, please visit Phison Website or Phison Q&A for details.

FORESEE Will Showcase Its Innovative Memory and Storage Solutions at Embedded World 2024

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Wednesday, April 3, 2024
UFS, SSD, Memory, SPI, DDR3L, SATA, NVM Express, Internet, Electronics, Research, DDR5, LPDDR5, Software design, MultiMediaCard, CXL, AI, Personal computer, Architecture, Cloud computing, Exhibition, Payment card, MCP, LPDDR

SHENZHEN, China, April 3, 2024 /PRNewswire/ -- The industry storage brand FORESEE under Longsys(301308.SZ) will showcase a full line up of innovative products and solutions at embedded world 2024, the highly anticipated embedded systems event in Nuremberg, Germany on April 9th.

Key Points: 
  • SHENZHEN, China, April 3, 2024 /PRNewswire/ -- The industry storage brand FORESEE under Longsys(301308.SZ) will showcase a full line up of innovative products and solutions at embedded world 2024, the highly anticipated embedded systems event in Nuremberg, Germany on April 9th.
  • In the micro-storage field, FORESEE will exhibit SPI NAND Flash, DDR3L, and NAND-based MCP (LPDDR4x), demonstrating its independent research and development capabilities in small-capacity storage solutions.
  • In the mobile memory sector, FORESEE will showcase industrial pSLC series microSD, industrial SD/microSD, and commercial EPLUS V30 series products.
  • With the unveiling of these advanced products and solutions, FORESEE has further strengthened its memory and storage lineup and bolstered its position in the memory market.

Unilever Food Solutions Unveils 'Future Menus 2024'

Retrieved on: 
Tuesday, March 26, 2024
Hellmann, UFS, McKinsey & Company, Generation, Taste, Face, Growth, Food system, Social media, Generation Z, Smoking, Restaurant

ROTTERDAM, Netherlands, March 26, 2024 /PRNewswire/ -- Unilever Foods Solutions (UFS) has released its annual trend report, Future Menus 2024, which sets out the eight global trends shaping the food service industry. The key shifts expected in restaurants this year include a rising demand for unexpected flavour combinations, the mainstreaming of plant-based dishes, and a focus on maximising ingredients to reduce food waste in the kitchen.1

Key Points: 
  • ROTTERDAM, Netherlands, March 26, 2024 /PRNewswire/ -- Unilever Foods Solutions (UFS) has released its annual trend report, Future Menus 2024 , which sets out the eight global trends shaping the food service industry.
  • Star Chen CEO Unilever Food Solutions said: "Unilever Food Solutions (UFS) is a business of chefs for chefs.
  • "By providing chefs with products that reduce food preparation time, whilst satisfying growing consumer appetite for on-trend dishes, UFS has seen consistent growth, now accounting for 20% of the Unilever Nutrition business," said Star Chen.
  • Gen Z Is Craving A More Sustainable Food System, McKinsey & Company, 2022.

Unilever Food Solutions Unveils 'Future Menus 2024'

Retrieved on: 
Tuesday, March 26, 2024
Hellmann, UFS, McKinsey & Company, Generation, Taste, Face, Growth, Food system, Social media, Generation Z, Smoking, Restaurant

ROTTERDAM, Netherlands, March 26, 2024 /PRNewswire/ -- Unilever Foods Solutions (UFS) has released its annual trend report, Future Menus 2024, which sets out the eight global trends shaping the food service industry. The key shifts expected in restaurants this year include a rising demand for unexpected flavour combinations, the mainstreaming of plant-based dishes, and a focus on maximising ingredients to reduce food waste in the kitchen.1

Key Points: 
  • ROTTERDAM, Netherlands, March 26, 2024 /PRNewswire/ -- Unilever Foods Solutions (UFS) has released its annual trend report, Future Menus 2024 , which sets out the eight global trends shaping the food service industry.
  • Star Chen CEO Unilever Food Solutions said: "Unilever Food Solutions (UFS) is a business of chefs for chefs.
  • "By providing chefs with products that reduce food preparation time, whilst satisfying growing consumer appetite for on-trend dishes, UFS has seen consistent growth, now accounting for 20% of the Unilever Nutrition business," said Star Chen.
  • Gen Z Is Craving A More Sustainable Food System, McKinsey & Company, 2022.

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

Retrieved on: 
Friday, March 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Arasan proudly releases its Radiation Hardened NAND Flash IP

Retrieved on: 
Thursday, March 14, 2024
UFS, ONFI, Radiation, Chronic radiation syndrome, FPGA, IP, AXI, DMA

SAN JOSE, Calif., March 14, 2024 /PRNewswire-PRWeb/ -- Arasan proudly releases its Radiation Hardened NAND Flash IP, compliant with ONFI 4.2 Specifications, ideal for mission-critical roles in defense, aerospace, and nuclear applications. This addition enhances Arasan's Mobile Storage IP portfolio, encompassing UFS IP, eMMC IP, xSPI NOR Flash IP, and SDIO/SD Card IP. The proprietary technology employed by Arasan ensures effective radiation hardening, safeguarding against ionizing radiation effects.

Key Points: 
  • Arasan, a leading provider of mobile storage and connectivity IP solutions, proudly releases its Radiation Hardened NAND Flash IP Compliant to ONFI Specifications
    SAN JOSE, Calif., March 14, 2024 /PRNewswire-PRWeb/ -- Arasan proudly releases its Radiation Hardened NAND Flash IP, compliant with ONFI 4.2 Specifications, ideal for mission-critical roles in defense, aerospace, and nuclear applications.
  • This addition enhances Arasan's Mobile Storage IP portfolio, encompassing UFS IP, eMMC IP, xSPI NOR Flash IP, and SDIO/SD Card IP.
  • Arasan, a leading provider of mobile storage and connectivity IP solutions, proudly releases its Radiation Hardened NAND Flash IP Compliant to ONFI Specifications
    The NAND Flash Controller IP facilitates reliable access to off-chip NAND flash devices, supporting all ONFI Specification modes, including the new NV-LPDDR4 mode and legacy modes like Single Data Rate, NV-DDR, NV-DDR2, and NV-DDR3.
  • Arasan offers its radiation-hardened NAND Flash Controller IP, compliant with ONFI 4.2 Specifications, for immediate licensing in ASIC and FPGA applications.

Silicon Motion Unveils 6nm UFS 4.0 Controller for AI Smartphones, Edge Computing and Automotive Applications

Retrieved on: 
Tuesday, March 12, 2024
ECC, MB, UFS, SRAM, EUV, QLC, SCSI, MIPI, Universal Flash Storage, SIMO, AI, TLC, LDPC, Data-rate units, JEDEC, Senior, UniPro, Silicon, Architecture, SAM, 2.0, TB, Marketing, Silicon Motion, UFS 3.1, IOT, Computer data storage

TAIPEI and MILPITAS, Calif., March 12, 2024 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.   Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

Key Points: 
  • The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.
  • Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.
  • The new second generation SM2753 UFS 3.1 controller solution boasts a high-speed serial-link-based MIPI M-PHY HS-Gear4 x 2-lane, and SCSI architecture model (SAM) enabling unparalleled performance.
  • Silicon Motion's latest UFS controller solutions are equipped with advanced LDPC ECC technology and SRAM data error detection and correction.