SK Hynix

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

Retrieved on: 
Wednesday, April 3, 2024
CHIPS, Second Continental Congress, HBM, Congress, MediaTek, Federation, Partnership, Technology policy, SK Hynix, Saab, Research, I-65, News, Rolls-Royce, AI, Social responsibility, Semiconductor, Bayer, Silicon, Workforce, ChatGPT, Purdue Research Park, Policy

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.

Key Points: 
  • WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.
  • “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
  • “SK hynix is the global pioneer and dominant market leader in memory chips for AI,” Purdue President Mung Chiang said.
  • This historic announcement is the next step in Purdue University’s persistent pursuit of semiconductor excellence as part of the Purdue Computes initiative.

Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

Retrieved on: 
Wednesday, April 3, 2024
CHIPS, Technology policy, Incentive, Naval Surface Warfare Center, Carbon, Commerce, Purdue Research Park, Investment, Policy, HBM, Duke Energy, Partnership, Research, News, AI, Architecture, Semiconductor, NSWC, South Korea, SK Hynix, Dynamic random-access memory, Engineering, Assistant, Recycling, DRAM, Organic, Silicon, Graphics processing unit, United States Commercial Service, Ecosystem, Purdue University, Renewable energy

The facility will also develop future generations of chips and house an advanced packaging R&D line.

Key Points: 
  • The facility will also develop future generations of chips and house an advanced packaging R&D line.
  • “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
  • “We believe this project will lay the foundation for a new Silicon Heartland; a semiconductor ecosystem centered in the Midwest Triangle.
  • The IEDC also committed up to $45 million through the Industrial Development Grant Fund to support infrastructure improvements surrounding the new plant.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

New Omdia Research Reveals 2023 Semiconductor Market Revenue down 9% from 2022

Retrieved on: 
Wednesday, March 27, 2024
Intel, HBM, COVID, Growth, Intelligence, Samsung Electronics, AI, Electronics, Graphics processing unit, Samsung, Semiconductor, NVIDIA, SK Hynix, Car, Micron Technology

Demand has softened due to macroeconomic factors, while semiconductor component supply has increased," comments Cliff Leimbach, Senior Research Analyst at Omdia .

Key Points: 
  • Demand has softened due to macroeconomic factors, while semiconductor component supply has increased," comments Cliff Leimbach, Senior Research Analyst at Omdia .
  • NVIDIA has been the clear winner in this space, more than doubling its semiconductor revenue from 2022 to $49 billion in 2023.
  • In 2023, the automotive segment exerted greater influence in the semiconductor market as it increased its revenue growth to over 15% in 2023 to over $75 billion.
  • "NVIDIA's rapid growth in semiconductor revenue has placed them as the second largest semiconductor company by revenue in 2023, trailing Intel.

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

Retrieved on: 
Friday, March 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

SK hynix Unveils Roadmap for Use of Recycled Materials

Retrieved on: 
Tuesday, February 6, 2024
Carbon, Nature, Copper, Tin, ESG, ISO, Recycling, SK Hynix, Wood, Gold, Carbon neutrality, Sale

*Recycled Materials: Materials extracted, recovered and reprocessed from pre-consumer waste generated in the manufacturing process before arrival at end users or from post-consumer waste disposed of after use.

Key Points: 
  • *Recycled Materials: Materials extracted, recovered and reprocessed from pre-consumer waste generated in the manufacturing process before arrival at end users or from post-consumer waste disposed of after use.
  • Through this roadmap, SK hynix aims to raise the proportion of recycled materials used in the products currently manufactured by the company to 25% by 2025 and more than 30% (based on weight) by 2030.
  • As part of the plan, SK hynix will start with essential metals for semiconductor production, such as copper, tin, and gold, and replace them with recycled materials.
  • "These materials are not an offer for sale of the securities of SK hynix Inc. in the United States.

SK hynix Reports Financial Results for 2023, 4Q23

Retrieved on: 
Wednesday, January 24, 2024
HBM3, Landing slot, DRAM, ASP, CFO, Memory, AI, Memory module, Investment, App Store (iOS/iPadOS), DDR5, Dram, SK Hynix, Computer data storage

SEOUL, South Korea, Jan. 24, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it recorded an operating profit of 346 billion won in the fourth quarter of last year amid a recovery of the memory chip market, marking the first quarter of profit following four straight quarters of losses.

Key Points: 
  • (Based on K-IFRS)
    SK hynix said that the overall memory market conditions improved in the last quarter of 2023 with demand for AI server and mobile applications increasing and average selling price (ASP) rising.
  • "We recorded the first quarterly profit in a year following efforts to focus on profitability," it said.
  • For the year of 2024, SK hynix will focus on improving profitability and efficiency through sales of value-added products, while minimizing an increase in capital expenditure for a stable operation of the business.
  • "We achieved a remarkable turnaround, marking the first operating profit in the fourth quarter following a protracted downturn, thanks to our technological leadership in the AI memory space," said Kim Woohyun, Vice President and Chief Financial Officer (CFO) at SK hynix.

Cardumen Capital raises $120 Million consolidating its position as one of Israel's most active early-stage Deep Tech investors

Retrieved on: 
Wednesday, January 17, 2024
Entrepreneurship, Proposition, Insight Partners, Principal, Associate, Citibank, Microsoft, Software as a service, Vimeo, Credit Suisse, Big, Wix, Fund, Samsung, TEL, ICT, Information, Big data, Marketing, General partnership, SK Hynix, Yigal Arnon, Bank

Cardumen Capital has invested in 32 Israeli companies in AI, Cybersecurity, Big Data, and Information Communication Technologies (ICT).

Key Points: 
  • Cardumen Capital has invested in 32 Israeli companies in AI, Cybersecurity, Big Data, and Information Communication Technologies (ICT).
  • The company will continue investing in pre-seed and seed Israeli software and hardware companies at the forefront of the technological revolution.
  • Cardumen Capital aims to be the most active investor on the cap table.
  • Cardumen Capital supports and works closely with entrepreneurs in anything from business development to fundraising.

The Future is ALL ON: CES 2024 Opens, Showcasing the Latest Innovations in AI, Sustainability and Mobility

Retrieved on: 
Tuesday, January 9, 2024
Valeo, Theme, Gen, Samsung, TCL, Electronics, AWS, Virtual reality, Apple, Play therapy, Indy Autonomous Challenge, Sony, Consumer Technology Association, Food, Policy, Volkswagen, Stroke, Hieronimus, Recycling, EssilorLuxottica, Caterpillar, Artificial intelligence, CTA, KIA, Generation Z, B2C, Innovation, Panasonic, Water, Hyundai, CES, Internet, LG Electronics, Beauty, Patient, Partnership, Android, Red Bull Racing, Ultra-high-definition television, News, SK Hynix, Consumer electronics

Before the show even began, the most discussed topics were artificial intelligence, entertainment and office hardware, plus gaming and e-sports.

Key Points: 
  • Before the show even began, the most discussed topics were artificial intelligence, entertainment and office hardware, plus gaming and e-sports.
  • "CES is where business and policy converge, and there's no place like it for building B2B and B2C connections."
  • Attendees from across the globe travel to CES to do business efficiently and discover what's next in tech.
  • The CES App has everything you need to plan for and navigate CES.

The Future is ALL ON: CES 2024 Opens, Showcasing the Latest Innovations in AI, Sustainability and Mobility

Retrieved on: 
Tuesday, January 9, 2024
Valeo, Theme, Gen, Samsung, TCL, Electronics, AWS, Virtual reality, Apple, Play therapy, Indy Autonomous Challenge, Sony, Consumer Technology Association, Food, Policy, Volkswagen, Stroke, Recycling, EssilorLuxottica, Caterpillar, Artificial intelligence, CTA, KIA, Generation Z, B2C, Innovation, Panasonic, Water, Hyundai, CES, Internet, LG Electronics, Beauty, Patient, Partnership, Android, Red Bull Racing, Ultra-high-definition television, News, SK Hynix, Consumer electronics

CES 2024 brings together exhibitors, attendees and media to display and dream up the technology of tomorrow.

Key Points: 
  • CES 2024 brings together exhibitors, attendees and media to display and dream up the technology of tomorrow.
  • Before the show even began, the most discussed topics were artificial intelligence, entertainment and office hardware, plus gaming and e-sports.
  • "CES is where business and policy converge, and there's no place like it for building B2B and B2C connections."
  • Founding partners include Lenovo, LG Electronics, Panasonic, Samsung and Sony Electronics Inc.
    Visit CES.tech to get live updates and streams from CES 2024.