PHY

Broadcom Delivers Industry’s First 51.2-Tbps Co-Packaged Optics Ethernet Switch Platform for Scalable AI Systems

Retrieved on: 
Thursday, March 14, 2024
Cloud, Logic, HBM, Optics, CMOS, Bailly, Application-specific integrated circuit, CPO, Partnership, Broadcom Inc., Copper, GVP, Graphics processing unit, PALO, Investment, Exhibition, PHY, ByteDance, TBPS, AVGO, Silicon photonics, Silicon, Video game

The product integrates eight silicon photonics based 6.4-Tbps optical engines with Broadcom’s best-in-class StrataXGS® Tomahawk®5 switch chip.

Key Points: 
  • The product integrates eight silicon photonics based 6.4-Tbps optical engines with Broadcom’s best-in-class StrataXGS® Tomahawk®5 switch chip.
  • The optical interconnect is critical for both front-end and back-end networks in large scale generative AI clusters.
  • Today, pluggable optical transceivers consume approximately 50% of system power and constitute more than 50% of the cost of a traditional switch system.
  • “Our partnership with Broadcom to design systems with highly integrated co-packaged optics will enable a more power efficient future network.

Keysight Becomes Validated Test Tool Provider for FiRa® 2.0 Technical and Test Specifications

Retrieved on: 
Wednesday, April 3, 2024
Data Management, Technology, Manufacturing, Semiconductor, Telecommunications, Software, Networks, Internet, Engineering, Hardware, Electronic Design Automation, UWB, AOA, Certification, Fira, RF, DUT, Time of flight, PHY, Medical device

Keysight Technologies, Inc. (NYSE: KEYS) has had a test tool validated for the FiRa 2.0 Certification release, covering physical layer (PHY) conformance testing.

Key Points: 
  • Keysight Technologies, Inc. (NYSE: KEYS) has had a test tool validated for the FiRa 2.0 Certification release, covering physical layer (PHY) conformance testing.
  • The latest FiRa PHY Technical and Test Specifications introduce enhancements to the performance and interoperability test requirements for ultra-wideband (UWB) device conformance tests.
  • To assist device makers with meeting the challenges of testing against FiRa 2.0 specifications , Keysight introduced support for FiRa 2.0 test cases in its UWB Test Solution .
  • As a FiRa validated test tool for the new specifications, the UWB Test Solution provides a wrap-around toolset covering the full design lifecycle from R&D to certification to manufacturing.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Vecima Partners with LICA to Elevate Elsat's Network Infrastructure in the Czech Republic

Retrieved on: 
Monday, March 18, 2024
Telecommunications, Software, Networks, Internet, Audio, Video, Hardware, Technology, Carriers and Services, DAA, RMD, Partnership, EAC, Senior, Architecture, TSX, Vecima Networks, Ecosystem, LICA, VCM, PHY

(further as LICA) is deploying Vecima's Entra® SC-1D and Entra® Access Controller (EAC) solutions for Elsat, spol.

Key Points: 
  • (further as LICA) is deploying Vecima's Entra® SC-1D and Entra® Access Controller (EAC) solutions for Elsat, spol.
  • (further as Elsat), a provider of telecommunications services in the Czech Republic.
  • The deployment for Elsat gives LICA a launching point as it introduces Vecima's technology to the Czech Republic in the form of an innovative Remote MACPHY Device (RMD) Distributed Access Architecture (DAA) application.
  • “LICA is proud to partner with Vecima to bring its industry-leading DAA solutions to operators in the Czech Republic,” said Peter Link, CEO at LICA.

Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet ExpressTM (UCIeTM) Subsystem for High-Performance AI Infrastructure

Retrieved on: 
Tuesday, March 12, 2024
Networks, Internet, Hardware, Artificial Intelligence, Data Management, Technology, IOT (Internet of Things), Semiconductor, HBM, Info, Innovation, Integration, CHI, CXL, CXS, PCI Express, Multi, Marketing, OIP, Semi, Ecosystem, PHY, Multimedia, Computation, UCIe, TSMC, Silicon, Video game

This new silicon-proven Universal Chiplet Interconnect Express (UCIeTM) subsystem expands Alphawave Semi’s portfolio and leadership in connectivity silicon.

Key Points: 
  • This new silicon-proven Universal Chiplet Interconnect Express (UCIeTM) subsystem expands Alphawave Semi’s portfolio and leadership in connectivity silicon.
  • It paves the way for a robust, open chiplet ecosystem that accelerates connectivity and compute for high-performance AI systems.
  • An industry-first live demo of Alphawave Semi’s 24Gbps UCIe silicon platform on the TSMC 3nm process was recently unveiled at the Chiplet Summit in Santa Clara, CA.
  • View the full release here: https://www.businesswire.com/news/home/20240311461384/en/
    Alphawave Semi 24Gbps UCIe 3nm silicon platform (Graphic: Business Wire)
    Alphawave Semi’s 3nm UCIe complete PHY + Controller subsystem is capable of 24Gbps data rates, delivering high bandwidth density at extremely low power and low latency.

Introspect Technology Ships World's First GDDR7 Memory Test System

Retrieved on: 
Wednesday, March 27, 2024
GPU, Memory, Artificial intelligence, JEDEC, AC, Ecosystem, PHY, PAM4, SGRAM, Data-rate units, PAM, Video game

MONTREAL, March 27, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, a JEDEC® member and a leading manufacturer of test and measurement instruments, announced today that it has shipped the M5512 GDDR7 Memory Test System, the world's first commercial solution for testing JEDEC's newly minted JESD239 Graphics Double Data Rate (GDDR7) SGRAM specification. This category-creating solution enables graphics memory engineers, GPU design engineers, product engineers in both memory and GPU spaces, and system integrators to rapidly bring up new GDDR7 memory devices, debug protocol errors, characterize signal integrity, and perform detailed memory read/write functional stress testing without requiring any other tool.

Key Points: 
  • MONTREAL, March 27, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, a JEDEC ® member and a leading manufacturer of test and measurement instruments, announced today that it has shipped the M5512 GDDR7 Memory Test System , the world's first commercial solution for testing JEDEC's newly minted JESD239 Graphics Double Data Rate (GDDR7) SGRAM specification.
  • "In its quest to support the industry on GDDR7 deployment, Introspect Technology has worked tirelessly in the last few years with JEDEC members to develop the M5512 GDDR7 Memory Test System," said Dr. Mohamed Hafed, CEO at Introspect Technology.
  • The M5512 GDDR7 Memory Test System is a bench-top test and measurement instrument that builds on Introspect Technology's decades long experience in building high-performance and miniature test instruments.
  • The M5512 GDDR7 Memory Test System is part of Introspect Technology's emerging M Series product line, a series of massively parallel products for testing high data rate, high channel count devices and systems.

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

Retrieved on: 
Friday, March 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report: Key Parameters and Estimated Cost, Main Components, Disassembly, Master Chip and Storage, MCU, Ethernet

Retrieved on: 
Friday, March 15, 2024
MDI, DHU, LPDDR4X, CMOS, Polychlorinated biphenyl, DAB, Memory, Infineon Technologies, Qualcomm, DRAM, MCU, Renesas Electronics, IEEE, Radio, Samsung, PCB, NXP, DRM, PHY, FBGA, HD, LVCMOS, Car, AM/FM, The, Printed circuit board

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report" report has been added to ResearchAndMarkets.com's offering.
  • The publisher dismantled 8295-based cockpit domain controller of an electric sedan launched in December 2023, and produced the report SA8295P Series Based Cockpit Domain Controller Analysis and Dismantling.
  • The cockpit domain controller has two versions, high configuration and low configuration, both of which use Qualcomm SA8295P chips.
  • This article carries out a rough dismantling analysis on the DHU, involving overview, master chip, storage, MCU and radio.

Ethernovia Unveils World’s First Single and Quad Port, 10G to 1G Automotive PHY in 7nm

Retrieved on: 
Tuesday, March 5, 2024
Technology, EV, Electric Vehicles, Semiconductor, Automotive, General Automotive, Software, Networks, Internet, Hardware, Data Management, Qualcomm Ventures, SDV, PHY, Data-rate units, Silicon, Volkswagen Group, Safety, AMD, Family, IEEE, PCB, Porsche, Partnership, Video game

“As demands for the vehicle of the future continue to rise—greater safety, full autonomy, long-range electrification and more—vehicular bandwidth demands rise commensurately,” said Ramin Shirani, Ethernovia co-founder and CEO.

Key Points: 
  • “As demands for the vehicle of the future continue to rise—greater safety, full autonomy, long-range electrification and more—vehicular bandwidth demands rise commensurately,” said Ramin Shirani, Ethernovia co-founder and CEO.
  • The single port ENT11100 and ENT11025 are now sampling to customers with the quad port devices sampling later this year.
  • The devices are the automotive semiconductor company’s first in a planned family of products encompassing a holistic hardware and software system for the next generation of centralized vehicle architecture.
  • That will include a high-bandwidth, low-latency switch in the 7nm process currently being developed in strategic partnership with leading original equipment manufacturer Continental .

Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips

Retrieved on: 
Thursday, February 29, 2024
HPC, MAC, Architecture, AI, Socs, Silicon, SystemVerilog, Marketing, PHY, Universal Verification Methodology, Product management, Ethernet Alliance, Bit, Keysight, Risk, SNPS, Ecosystem, IP, SOC, Machine learning, Error correction code, PCS, Verification, Internet service provider

SUNNYVALE, Calif., Feb. 29, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today delivered a dramatic increase in bandwidth and throughput for data-intensive AI workloads with the industry's first complete 1.6T Ethernet IP solution. Hyperscale data centers, a backbone in the era of pervasive intelligence, require high-bandwidth, low-latency chips and interfaces to process petabytes of data quickly. Synopsys' new 1.6T Ethernet IP solution enables design teams to create the industry's fastest chips for AI and data center networking applications.

Key Points: 
  • Synopsys' new 1.6T Ethernet IP solution enables design teams to create the industry's fastest chips for AI and data center networking applications.
  • Synopsys' comprehensive IP solution, including new 1.6T MAC and PCS Ethernet controllers, 224G Ethernet PHY IP , and verification IP, accelerates time to market for AI and HPC networking chips.
  • The complete 1.6T Ethernet IP solution optimizes hyperscale data center energy efficiency by reducing interconnect power consumption by up to 50% compared to existing SoC implementations.
  • The Synopsys 1.6T Ethernet solution, including all components – 1.6T MAC and PCS Controller IP, 224G PHY IP for advanced processes, and Verification IP for 1.6T Ethernet – are available now.