SOC

MediaTek Selected to Power Vewd for Automotive Platform

Thursday, October 21, 2021 - 3:41pm

Vewd, the leading provider of OTT software solutions, today announced that MediaTeks Autus I20 (MT2712) chipset was selected as the first reference platform to power Vewd for Automotive, a white-labeled, cloud-managed content aggregation and monetization solution for in-vehicle infotainment equipment providers and car manufacturers.

Key Points: 
  • Vewd, the leading provider of OTT software solutions, today announced that MediaTeks Autus I20 (MT2712) chipset was selected as the first reference platform to power Vewd for Automotive, a white-labeled, cloud-managed content aggregation and monetization solution for in-vehicle infotainment equipment providers and car manufacturers.
  • Vewd for Automotive solves key rear-seat content challenges facing manufacturers through a turnkey solution ready for deployment.
  • Available for all major operating systems, Vewd for Automotive provides the industrys most comprehensive cloud-managed content solution and service offering.
  • Vewd for Automotive is optimized for the MediaTek Autus I20 chipset which delivers a high performance, hexa-core system-on-chip (SoC) infotainment solution for car manufacturers.

Cadence Digital and Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications

Thursday, October 21, 2021 - 3:46pm

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital and custom/analog flows have achieved certification for TSMCs N3 and N4 process technologies in support of the latest Design Rule Manual (DRM).

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital and custom/analog flows have achieved certification for TSMCs N3 and N4 process technologies in support of the latest Design Rule Manual (DRM).
  • Through continued collaborations, Cadence and TSMC delivered the corresponding process design kits (PDKs) for TSMC N3 and N4 processes to accelerate mobile, AI and hyperscale computing innovation.
  • Cadence worked closely with TSMC to optimize the digital flow for TSMCs advanced N3 and N4 process technologies to help customers achieve power, performance and area (PPA) goals and speed time to market.
  • Additionally, the Cadence Genus Synthesis Solution and predictive iSpatial technology are enabled for the N3 and N4 process technologies.

Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process

Thursday, October 21, 2021 - 3:45pm

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the immediate availability of Cadence IP supporting the PCI Express (PCIe)6.0 specification on the TSMC N5 process.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the immediate availability of Cadence IP supporting the PCI Express (PCIe)6.0 specification on the TSMC N5 process.
  • The 5nm PCIe 6.0 PHY test chip silicon from Cadence demonstrated excellent electrical performance across all PCIe rates.
  • The Cadence IP for the PCIe 6.0 specification supports the companys Intelligent System Design strategy, which enables SoC design excellence.
  • Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. PCI Express and PCIe are registered trademarks of PCI-SIG.

NEWRACOM Opens Local Sales Office in Taiwan

Thursday, October 21, 2021 - 12:07pm

LAKE FOREST, Calif., Oct. 21, 2021 (GLOBE NEWSWIRE) -- NEWRACOM, a fabless semiconductor company and supplier of IoT-enabled Wi-Fi SoCs, today announces the opening of its sales office in Taipei, Taiwan (Republic of China).

Key Points: 
  • LAKE FOREST, Calif., Oct. 21, 2021 (GLOBE NEWSWIRE) -- NEWRACOM, a fabless semiconductor company and supplier of IoT-enabled Wi-Fi SoCs, today announces the opening of its sales office in Taipei, Taiwan (Republic of China).
  • This new office will closely support local customers inTaiwan and China'smarket and expand the Southeast Asian footprint.
  • Since there is the emerging demand for chipset supply, technical supports, and partnerships in those local markets, the new office will establish a foothold to promote product awareness and sales.
  • NEWRACOM is currently operating a main office in Irvine, CA, U.S., and two sales offices in Seoul, South Korea, and Taipei, Taiwan.

Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth® 5.3 Low Energy Specification

Thursday, October 21, 2021 - 1:00pm

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth 5.3 Low Energy (LE) Specification.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth 5.3 Low Energy (LE) Specification.
  • View the full release here: https://www.businesswire.com/news/home/20211021005129/en/
    RA MCU Development Supports New Bluetooth 5.3 Low Energy Specification (Graphic: Business Wire)
    The new Bluetooth 5.3 specification was released on July 13, 2021.
  • Renesas has a long history of Bluetooth development and deep expertise in the design of Bluetooth LE devices .
  • Read the blog post Whats New in Bluetooth 5.3 Low Energy for more information about the Bluetooth 5.3 LE specification.

Hyperproof raises $16.5 Million Series A to expand its compliance operations and security assurance platform

Wednesday, October 20, 2021 - 5:12pm

Hyperproof, a pioneer in Compliance and Security operations software has closed $16.5 million in Series A financing.

Key Points: 
  • Hyperproof, a pioneer in Compliance and Security operations software has closed $16.5 million in Series A financing.
  • Founded in 2018, Hyperproof has quickly become a disruptive force in the Governance Risk and Compliance (GRC) market with its unique approach to solving the most pressing challenges faced by security and compliance teams.
  • Hyperproof supports more than 50 compliance frameworks and allows compliance teams to efficiently mature their compliance program as their company grows.
  • To date, Hyperproof has delivered an innovative SaaS compliance operations platform that empower compliance, risk and security teams to stay on top of all compliance work and manage organizational risks (including vendor risks) on a continuous basis.

AuditBoard Growth Continues to Surge in 2021, Driven by Strong Customer Satisfaction

Wednesday, October 20, 2021 - 4:30pm

This positive customer sentiment has led to the company being named market leader in the G2 Grid Report for Audit Management Software for 8 consecutive quarters.

Key Points: 
  • This positive customer sentiment has led to the company being named market leader in the G2 Grid Report for Audit Management Software for 8 consecutive quarters.
  • Customer satisfaction with AuditBoards platform has accelerated top-line growth, with annual recurring revenue on the brink of $100 million and growing at a rate exceeding 60% year over year.
  • This rapid revenue growth has secured AuditBoard a spot among the top 100 fastest-growing technology companies in North America for two consecutive years, according to Deloitte.
  • We've been able to support that growth with our existing staff because we have AuditBoard," said Michael Geiger-Wolf, Director of Risk and Compliance at Ceridian.

Comprehensive audit validates Rapid4Cloud as a trusted automation platform partner

Wednesday, October 20, 2021 - 3:00pm

Rapid4Cloud has always maintained high security standards, and the SOC2 audit is an endorsement of this.

Key Points: 
  • Rapid4Cloud has always maintained high security standards, and the SOC2 audit is an endorsement of this.
  • This independent validation of security controls is crucial reassurance for customers that Rapid4Cloud is processing their data in a secure and compliant way.
  • "Obtaining the SOC 2 Type 2 certification demonstrates Rapid4Cloud's ongoing commitment to the security, availability, and integrity of our platform," Rapid4Cloud IT and Security Director Teerapat Muannum said.
  • Rapid4Cloud is the global leader in intelligent cloud automation software.

GrAI Matter Labs Named as CES 2022 Innovation Awards Honoree

Wednesday, October 20, 2021 - 2:00pm

GrAI Matter Labs (GML), a pioneer in brain-inspired ultra-low latency computing solutions, today announced that it has been named a CES 2022 Innovation Awards Honoree for the Life-Ready GrAI VIP (Vision Inference Processor) product.

Key Points: 
  • GrAI Matter Labs (GML), a pioneer in brain-inspired ultra-low latency computing solutions, today announced that it has been named a CES 2022 Innovation Awards Honoree for the Life-Ready GrAI VIP (Vision Inference Processor) product.
  • View the full release here: https://www.businesswire.com/news/home/20211020005354/en/
    This years CES Innovation Awards program received a record high number of over 1,800 submissions.
  • The CES 2022 Innovation Awards honorees, including product descriptions and photos, can be found at CES.tech/innovation .
  • Many honorees will showcase their winning products in the Innovation Awards Showcase at CES 2022.

Synopsys Expands Strategic Technology Collaboration with TSMC to Extend 3D-System Integration Solutions for Next-Generation High-Performance Computing Designs

Wednesday, October 20, 2021 - 2:05pm

By leveraging Synopsys' 3DIC Compiler platform, customers significantly advance high-capacity 3D system design through efficient access to TSMC 3DFabric-based design methodologies.

Key Points: 
  • By leveraging Synopsys' 3DIC Compiler platform, customers significantly advance high-capacity 3D system design through efficient access to TSMC 3DFabric-based design methodologies.
  • These methodologies deliver 3D chip-stacking support in the System-on-Integrated-Chips (TSMC-SoIC) technology and 2.5/3D advanced packaging support in Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS) technologies.
  • The 3DIC Compiler platform is a complete, end-to-end solution for efficient 2.5/3D multi-die design and full system integration.
  • "Our trailblazing work with TSMC on their latest 3DFabric technology enables the imagination and realization of previously unattainable levels of 3D system integration.