Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package
Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.
- Designers have long trusted AOS power semiconductors as essential components that help them meet a wide variety of high-performance application requirements.
- AOS’ new top and bottom cooling DFN 5x6 package is designed to achieve the highest heat transfer between the exposed top contact and heat sink due to its large surface contact area construction.
- The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS’ standard DFN 5x6 package, eliminating the need to modify existing PCB layouts.
- “Cooling the power MOSFET in high power design can be challenging, and AOS has successfully addressed this essential issue with our advanced top exposed package design.