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IDTechEx Discusses AiP Market Dynamics: Drivers and Challenges in 5G and 6G

Retrieved on: 
Wednesday, April 3, 2024
Element, RFID, Physics, LTCC, Benchmarking, Growth, Communication, Electronics, Research, RF, Terahertz, Glass, Telco, High-pass filter, PCB, Wireless, Atmosphere, Hertz, Ecosystem, TBPS, Radiation pattern, AIP

BOSTON, April 3, 2024 /PRNewswire/ -- Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.

Key Points: 
  • More discussion regarding AiP technology can be found in IDTechEx's report, " Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets ".
  • Overview of AiP for 5G and 6G market and challenges:
    The AiP market is directly linked with the 5G mmWave and future 6G markets, as AiP is expected to be utilized in all 5G mmWave-based stations and 5G-enabled electronics like smartphones.
  • IDTechEx's market report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into AiP technologies for 5G mmWave and 6G, focusing on various substrate types and packaging methods.
  • 10-year granular market forecast of:
    To find out more about the IDTechEx report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", please visit www.IDTechEx.com/AiP .

IDTechEx Discusses AiP Market Dynamics: Drivers and Challenges in 5G and 6G

Retrieved on: 
Wednesday, April 3, 2024
Element, RFID, Physics, LTCC, Benchmarking, Growth, Communication, Electronics, Research, RF, Terahertz, Glass, Telco, High-pass filter, PCB, Wireless, Atmosphere, Hertz, Ecosystem, TBPS, Radiation pattern, AIP

BOSTON, April 3, 2024 /PRNewswire/ -- Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.

Key Points: 
  • More discussion regarding AiP technology can be found in IDTechEx's report, " Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets ".
  • Overview of AiP for 5G and 6G market and challenges:
    The AiP market is directly linked with the 5G mmWave and future 6G markets, as AiP is expected to be utilized in all 5G mmWave-based stations and 5G-enabled electronics like smartphones.
  • IDTechEx's market report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into AiP technologies for 5G mmWave and 6G, focusing on various substrate types and packaging methods.
  • 10-year granular market forecast of:
    To find out more about the IDTechEx report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", please visit www.IDTechEx.com/AiP .

KYOCERA AVX RELEASES NEW RES SERIES RADIAL-LEADED ALUMINUM ELECTROLYTIC CAPACITORS

Retrieved on: 
Tuesday, April 2, 2024
RES, RHA, RPA, REA, Electronics, Computer, REF, PCB, Avnet, REACH, Miniaturization, TTI, Arrow, Series, KYOCERA, Digi-Key, 1986 California Proposition 65

FOUNTAIN INN, S.C., April 2, 2024 /PRNewswire/ -- KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new RES Series radial-leaded aluminum electrolytic capacitors.

Key Points: 
  • The RES Series is the eighth series to join the extensive radial-leaded aluminum electrolytic capacitors portfolio that KYOCERA AVX released in February 2022.
  • That portfolio now offers four lines of wet aluminum electrolytic capacitors (the RES , REA , REF , and REH Series ), two lines of conductive polymer aluminum electrolytic capacitors (the RPA and RPF Series ), and two lines of hybrid aluminum electrolytic capacitors (the RHA and RHD Series ), as well as an even wider variety of part numbers available with commercial and industrial reliability levels and competitive pricing and lead times.
  • The new RES Series radial-leaded aluminum electrolytic capacitors are shipped in bulk packaging, and lead time for the series is currently 20–24 weeks.
  • For more information about KYOCERA AVX's new RES Series radial-leaded aluminum electrolytic capacitors, please visit https://www.kyocera-avx.com/products/aluminum-capacitors/res-series/ .

ShowMeCables Unveils L-com IEC Connectors, Power Entry Modules and PDUs

Retrieved on: 
Wednesday, March 27, 2024
UL, C19, CSA, C15, C18, EMI, IEC, Computer, VDE, Electronics, AC, PCB, ABS, C16, C14, C20, Electrical wiring

IRVINE, Calif., March 27, 2024 /PRNewswire-PRWeb/ -- ShowMeCables, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of L-com IEC connectors and power entry modules, IEC connector accessories, and IEC power distribution units.

Key Points: 
  • IRVINE, Calif., March 27, 2024 /PRNewswire-PRWeb/ -- ShowMeCables, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of L-com IEC connectors and power entry modules , IEC connector accessories , and IEC power distribution units .
  • "We're bringing reliable connection of AC power to critical components with these new IEC connectors, power entry modules, PDUs and accessories," said Product Line Manager Dan Rebeck.
  • ShowMeCables' new L-com mains power entry modules offer adaptable solutions to panel design.
  • "We're bringing reliable connection of AC power to critical components with these new IEC connectors, power entry modules, PDUs and accessories," said Product Line Manager Dan Rebeck.

ShowMeCables Unveils L-com IEC Connectors, Power Entry Modules and PDUs

Retrieved on: 
Wednesday, March 27, 2024
UL, C19, CSA, C15, C18, EMI, IEC, Computer, VDE, Electronics, AC, PCB, ABS, C16, C14, C20, Electrical wiring

IRVINE, Calif., March 27, 2024 /PRNewswire/ -- ShowMeCables, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of L-com IEC connectors and power entry modules, IEC connector accessories and IEC power distribution units.

Key Points: 
  • IRVINE, Calif., March 27, 2024 /PRNewswire/ -- ShowMeCables, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of L-com IEC connectors and power entry modules , IEC connector accessories and IEC power distribution units .
  • They power equipment such as computers, monitors, printers, server and networking equipment, audio and video gear, industrial machinery, and more.
  • ShowMeCables' new L-com mains power entry modules offer adaptable solutions to panel design.
  • "We're bringing reliable connection of AC power to critical components with these new IEC connectors, power entry modules, PDUs and accessories," said Product Line Manager Dan Rebeck.

Unilumin's Original LED Display Products Won Four iF Design Awards

Retrieved on: 
Tuesday, March 26, 2024
Philosophy, LED, HB, PCB, XV, Exhibition, Lumber

SHENZHEN, China, March 26, 2024 /PRNewswire/ -- Recently, four products of Unilumin's rental display Upad Series have won international iF Design Awards, which are UpadIV HB, XV Series transparent screen, tailored-made LEDskin Series, and a new product under R&D.

Key Points: 
  • SHENZHEN, China, March 26, 2024 /PRNewswire/ -- Recently, four products of Unilumin's rental display Upad Series have won international iF Design Awards, which are UpadIV HB, XV Series transparent screen, tailored-made LEDskin Series, and a new product under R&D.
  • By acclaiming the most authoritative award in the industry, Unilumin's innovative capabilities and customer-centric product design philosophy have been well recognized again.
  • UpadIV HB is undoubtedly the most 'hardcore' LED panel in the LED industry.
  • The brightness is up to 4000 cd/㎡ by adopting high current intensity LED chip packaging which is protected by waterproof glue.

Cartesian Robots Market Analysis 2024-2032, Featuring Aerotech, Bosch Rexroth, Gudel, HIRATA, Kuka, Parker Hannifin, Robostar, Samick Thk, Sepro Robotique, Shibaura Machine and Yamaha Motor

Retrieved on: 
Tuesday, March 26, 2024
Automation, Adhesive, Employment, F&B, Growth, Risk, Metal, Welding, Motion, Food, CNC, Robotics, PCB, Movement, 3D printing

Cartesian robots, also known as linear robots, rely on linear axes for movement.

Key Points: 
  • Cartesian robots, also known as linear robots, rely on linear axes for movement.
  • They comprise an overhead structure that controls the motion in the horizontal plane and a robotic arm that facilitates motion vertically.
  • In line with this, the rising utilization of cartesian robots for sorting and labeling numerous products is strengthening the market growth.
  • The report has also provided a comprehensive analysis of the competitive landscape in the global cartesian robots market.

Unilumin's Original LED Display Products Won Four iF Design Awards

Retrieved on: 
Tuesday, March 26, 2024
Philosophy, Multimedia, LED, HB, PCB, XV, Exhibition, Lumber

SHENZHEN, China, March 26, 2024 /PRNewswire/ -- Recently, four products of Unilumin's rental display Upad Series have won international iF Design Awards, which are UpadIV HB, XV Series transparent screen, tailored-made LEDskin Series, and a new product under R&D.

Key Points: 
  • SHENZHEN, China, March 26, 2024 /PRNewswire/ -- Recently, four products of Unilumin's rental display Upad Series have won international iF Design Awards, which are UpadIV HB, XV Series transparent screen, tailored-made LEDskin Series, and a new product under R&D.
  • By acclaiming the most authoritative award in the industry, Unilumin's innovative capabilities and customer-centric product design philosophy have been well recognized again.
  • UpadIV HB is undoubtedly the most 'hardcore' LED panel in the LED industry.
  • The brightness is up to 4000 cd/㎡ by adopting high current intensity LED chip packaging which is protected by waterproof glue.

Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, March 25, 2024
Polychlorinated biphenyl, Growth, Kyocera, IC, Amkor Technology, Internet of things, LG Chem, Tablet, Electronics, AI, Texas Instruments, SOP, SMT, PCB, Ceramic

They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.

Key Points: 
  • They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.
  • In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.
  • Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management.
  • This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics.

Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, March 25, 2024
Polychlorinated biphenyl, Growth, Kyocera, IC, Amkor Technology, Internet of things, LG Chem, Tablet, Electronics, AI, Texas Instruments, SOP, SMT, PCB, Ceramic

They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.

Key Points: 
  • They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.
  • In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.
  • Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management.
  • This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics.