ASE VIPack™ FOCoS-Bridge integrates multiple ASICs and silicon bridges to accelerate AI innovation
FOCoS-Bridge technology addresses the increasing demand for higher bandwidth and faster data transfer rates in AI and HPC applications.
- FOCoS-Bridge technology addresses the increasing demand for higher bandwidth and faster data transfer rates in AI and HPC applications.
- ASE’s FOCoS-Bridge features ultra-high density D2D interconnection with submicron L/S, enabling high bandwidth at low latency for chiplet integration.
- The use of a silicon bridge die enables a die edge linear density (wire/mm/layer) that is nearly 200x higher than the traditional organic flip chip package.
- The convergence of AI and HPC is having a strong impact on the semiconductor industry, fueling demand for innovative packaging solutions.