NVM Express

Greenliant Samples High Reliability NVMe NANDrive™ BGA SSDs to Aerospace, Defense, Industrial, Transportation Customers

Retrieved on: 
Wednesday, April 10, 2024
Transport, BGA, SATA, LTA, NVM Express, PATA, PCI Express, TLC, Solid-state drive, PX, Marketing, TBW

Greenliant Samples High Reliability NVMe NANDrive™ BGA SSDs to Aerospace, Defense, Industrial, Transportation Customers

Key Points: 
  • Greenliant Samples High Reliability NVMe NANDrive™ BGA SSDs to Aerospace, Defense, Industrial, Transportation Customers
    NVMe NANDrive Provides High Endurance, Fast Performance and Advanced Security
    SANTA CLARA, CA / ACCESSWIRE / March 26, 2024 / Greenliant is now sampling its new NVMe NANDrive™ ball grid array (BGA) solid state drives (SSDs) to customers requiring reliable, high performance data storage for embedded systems used in high stress, extreme environments.
  • NVMe NANDrive EX Series SSDs are available in 20 GB, 40 GB, 80 GB and 160 GB capacities.
  • Benefits of NVMe NANDrive SSDs include:
    Greenliant is sampling NVMe NANDrive EX and PX series SSDs to early engagement customers now, and expects to start volume production in the second half of 2024.
  • For more information about high reliability NVMe NANDrive (GLS85LE) products, contact a Greenliant channel partner, https://www.greenliant.com/sales .

EQS-News: Greenliant to Show New eMMC and NVMe NANDrive™ BGA SSDs at embedded world 2024

Retrieved on: 
Wednesday, April 10, 2024
BGA, Msata, SATA, NVM Express, Transport, MultiMediaCard, TLC, TB, Solid-state drive, Computer data storage

SANTA CLARA, CALIF. and NUREMBERG, GERMANY – APRIL 02, 2024 – Greenliant will highlight its new high endurance EX Series and budget friendly PX / VX Series NVMe and eMMC NANDrive™ ball grid array (BGA) solid state drives (SSDs) for aerospace, defense, industrial and transportation applications at embedded world 2024 in Nuremberg, Germany, April 9-11, in hall 4A, booth 606.

Key Points: 
  • SANTA CLARA, CALIF. and NUREMBERG, GERMANY – APRIL 02, 2024 – Greenliant will highlight its new high endurance EX Series and budget friendly PX / VX Series NVMe and eMMC NANDrive™ ball grid array (BGA) solid state drives (SSDs) for aerospace, defense, industrial and transportation applications at embedded world 2024 in Nuremberg, Germany, April 9-11, in hall 4A, booth 606.
  • Designed using Greenliant EnduroSLC™ Technology, eMMC and NVMe NANDrive EX Series offer superior data retention and ultra-high endurance of 75,000, 150,000 or 400,000 program-erase (P/E) cycles.
  • Operating between -40 and +85 degrees Celsius, NANDrive EX Series SSDs are ideal for write intensive workloads and high stress environments.
  • The NVMe NANDrive PX Series supports industrial temperatures (-40°C to +95°C) and provides endurance of 5,000 P/E cycles.

Other World Computing Launches SoftRAID 8 Setting a New Standard for Reliability, Speed and Data Safeguards

Retrieved on: 
Wednesday, March 20, 2024
Failure, OS, Apple, RAID 4, Mac, APFS, RAID, NVM Express, MacOS, Windows 2.0x, PCI Express, Software, Windows Server, SMART, USB, HDD, Multimedia, USB4, OWC, Silicon, Computer data storage

SoftRAID 8 introduces two simplified tiers, Standard and Premium, that provide essential data access, integrity, and updates.

Key Points: 
  • SoftRAID 8 introduces two simplified tiers, Standard and Premium, that provide essential data access, integrity, and updates.
  • SoftRAID Standard, a new free version, enables full access to RAID volumes, guaranteeing seamless full read/write data access.
  • Additionally, SoftRAID Standard provides access to the most recent updates and upgrades, offering a comprehensive toolkit for efficient RAID volume management across OS versions.
  • SoftRAID Premium offers a free 30-day trial, with access to all SoftRAID Premium features - disk checking, monitoring, and easy volume creation.

Pliops Unlocks Limitless Potential of AI at NVIDIA GTC 2024

Retrieved on: 
Monday, March 18, 2024
Honey, HBM, GTC, GPU, Cooper pair, Memory, Acceleration, RAG, SAN, NVM Express, DBS, AI, Honey badger, Graphics processing unit, Investment, XDP, Solid-state drive, Dell, NVIDIA, Central processing unit, Gen, CPU

Pliops , a leading provider of data processors for cloud and enterprise data centers, will be on hand at NVIDIA GTC this week to tackle these challenges head on.

Key Points: 
  • Pliops , a leading provider of data processors for cloud and enterprise data centers, will be on hand at NVIDIA GTC this week to tackle these challenges head on.
  • Pliops XDP-AccelKV universal data acceleration engine significantly minimizes the scalability challenges of AI/Gen AI applications.
  • The memory capacity and bandwidth limitations of GPUs to load AI/Gen AI models prevent them from fully utilizing their computational power.
  • It extends HBM memory with fast storage to enable terabytes-scale AI applications to run on a single GPU.

OSS Wins U.S. Intelligence AI Project for Liquid Immersion-Cooled Storage Server at the Edge

Retrieved on: 
Tuesday, March 12, 2024
Department of Defence, Intel, SDS, Intelligence, Navy, OSS, NVM Express, HPC, Electronics, Artificial intelligence, Acquisition, AI, Water, Centauri, Solid-state drive, Machine learning, Defense, Video game

Procured through a global defense prime contractor, the win represents the first liquid immersion-cooled high-performance compute solution for a U.S. intelligence agency mobile ground station application and a new intelligence community end user for OSS.

Key Points: 
  • Procured through a global defense prime contractor, the win represents the first liquid immersion-cooled high-performance compute solution for a U.S. intelligence agency mobile ground station application and a new intelligence community end user for OSS.
  • OSS will integrate two 3U-SDS units into a liquid immersion-cooled system which will be a part of a deployable ground station at the edge.
  • The custom storage accelerator system will be ruggedized for the harshest of edge environments.
  • The OSS SDS storage system is also available for commercial and industrial use and can be ordered directly from OSS sales engineers at [email protected] or +1 (877) 438-2724.

Phison Collaborates with MediaTek to Propel Generative AI Computing and Services

Retrieved on: 
Tuesday, March 26, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Automotive Manufacturing, Aerospace, Manufacturing, AOI, UFS, ONFI, Synthetic media, GPU, MediaTek, Assistant, Professor, SSD, MIPI, GAISF, SDA, DRAM, NVM Express, Knowledge, Blog, Carbon footprint, MultiMediaCard, AI, IEEE-SA, PCI-SIG, Life, JEDEC, Nature, Electronics, Architecture, USB, IP, Ecosystem, UFSA, Solid-state drive, Leonardo da Vinci, Multimedia, Media, Automotive industry, Generative, Medical device

Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.

Key Points: 
  • Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+ , will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.
  • (Graphic: Phison)
    MediaTek DaVinci is an advanced, open platform for generative AI services, built on the Generative AI Service Framework (GAISF).
  • Phison's aiDAPTIV+ features a pioneering SSD-integrated AI computing architecture that breaks down large AI models for concurrent operation with SSDs.
  • "aiDAPTIV+ is set to revolutionize AI model fine-tuning, and MediaTek DaVinci has already made significant strides in AI services,” said Dr. Wei Lin, CTO, Phison.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Phison Announces Strategic Partnerships Deploying aiDAPTIV+ at NVIDIA GTC 2024

Retrieved on: 
Monday, March 18, 2024
Software, Hardware, Data Management, Consumer Electronics, Technology, Artificial Intelligence, Semiconductor, Security, Engineering, Audio, Video, Automotive Manufacturing, Manufacturing, GTC, OP, GPU, University, ASUS, MultiMediaCard, Nature, JEDEC, USB, IP, Corporation, UFS, Partnership, 2.0, PCI Express, IEEE-SA, TB, Language, ONFI, GIGABYTE, Memory, NVM Express, Knowledge, Blog, News, AI, CXL, Privacy, Architecture, UFSA, Solid-state drive, Machine learning, Automotive industry, Commodity, PC, MediaTek, SSD, MIPI, SDA, Luigi, PCI-SIG, Electronics, Graphics processing unit, MAINGEAR, Data center, Multimedia, NVIDIA, Video game

Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.

Key Points: 
  • Phison Electronics (8299TT), a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR , and MediaTek.
  • "MAINGEAR's Pro AI Series workstations, driven by Phison aiDAPTIV+, empower users with large language model AI training prowess without excessive costs.
  • "We continue to uphold our partnership with Phison, aiming to foster innovation and maintain competitiveness in the market."
  • To know more about Phison, please visit Phison Website or Phison Q&A for details.

FORESEE Will Showcase Its Innovative Memory and Storage Solutions at Embedded World 2024

Retrieved on: 
Wednesday, April 3, 2024
UFS, SSD, Memory, SPI, DDR3L, SATA, NVM Express, Internet, Electronics, Research, DDR5, LPDDR5, Software design, MultiMediaCard, CXL, AI, Personal computer, Architecture, Cloud computing, Exhibition, Payment card, MCP, LPDDR

SHENZHEN, China, April 3, 2024 /PRNewswire/ -- The industry storage brand FORESEE under Longsys(301308.SZ) will showcase a full line up of innovative products and solutions at embedded world 2024, the highly anticipated embedded systems event in Nuremberg, Germany on April 9th.

Key Points: 
  • SHENZHEN, China, April 3, 2024 /PRNewswire/ -- The industry storage brand FORESEE under Longsys(301308.SZ) will showcase a full line up of innovative products and solutions at embedded world 2024, the highly anticipated embedded systems event in Nuremberg, Germany on April 9th.
  • In the micro-storage field, FORESEE will exhibit SPI NAND Flash, DDR3L, and NAND-based MCP (LPDDR4x), demonstrating its independent research and development capabilities in small-capacity storage solutions.
  • In the mobile memory sector, FORESEE will showcase industrial pSLC series microSD, industrial SD/microSD, and commercial EPLUS V30 series products.
  • With the unveiling of these advanced products and solutions, FORESEE has further strengthened its memory and storage lineup and bolstered its position in the memory market.

AMD Showcases AEWIN High-Density Edge Computing Server at Embedded World 2024

Retrieved on: 
Tuesday, April 2, 2024
DTLS, SSL/TLS, OS, QAT, IPMI, CRPS, Total cost, Memory, Embedded, RAID, Common, NVM Express, DDR5, PCI Express, AI, BMC, OCP, Solid-state drive, AMD, IPsec, TDP, CPU, Video game

TAIPEI, April 2, 2024 /PRNewswire/ -- AEWIN is glad to share with you that our High-Density Edge Computing Server, BAS-6101A, powered by Single AMD Zen4 Genoa or Zen4c Bergamo CPU is selected is displayed by AMD at Embedded World 2024.

Key Points: 
  • TAIPEI, April 2, 2024 /PRNewswire/ -- AEWIN is glad to share with you that our High-Density Edge Computing Server, BAS-6101A, powered by Single AMD Zen4 Genoa or Zen4c Bergamo CPU is selected is displayed by AMD at Embedded World 2024.
  • The BAS-6101A supports the latest AMD Bergamo CPU with up to 128 cores (~100% increased) and 400W TDP (~28% increased) to enable the extreme computing power pursued in the market.
  • With its short-depth design of 600mm for easy deployment at the edge, the system is suitable for diverse Edge AI applications.
  • Learn more about AEWIN BAS-6101A at AMD's booth at Embedded World 2024 or contact AEWIN sales at any time!