PCB

Fibocom Announces MediaTek-powered 5G RedCap Module FM330 Series to Lead 5G Expansion at MWC Barcelona 2024

Retrieved on: 
Monday, February 26, 2024
Cortex, Tao, Internet, Microsoft Windows, USB, Partnership, T300, MWC, Linux, Redcap, PC, MediaTek, Communication, M.2, Android, Arm, MBB, Tablet, PCB, LTE-M, Mobile World Congress

BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Key Points: 
  • Fibocom announces the launch of the industry-first T300-based 5G RedCap Module FM330 series in collaboration with MediaTek during MWC Barcelona 2024.
  • The FM330 series is positioned to expand the 5G landscape to a broader range, covering consumer-level, enterprise-level and industrial-level scenarios.
  • Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G.
  • Learn more about Fibocom's RedCap module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

AmberSemi Showcases Its Power Products with ST Embedded Solutions

Retrieved on: 
Monday, February 26, 2024
Microprocessor, STM32, Silicon, AC-DC, APEC, Telemetry, SPI, Hall, Communication, Conference, Amber, Physics, BOM, STMicroelectronics, MCU, Electricity, Electronics, Enabling, VDC, PCB, AC, Electric motor

LONG BEACH, Calif., Feb. 26, 2024 /PRNewswire/ -- Amber Semiconductor, Inc. announced a reference design for brushless motor applications using AmberSemi's breakthrough AC to DC conversion semiconductor system to power ST's STM32 microcontrollers. This reference design will be demonstrated at the Applied Power Electronics Conference in Long Beach, CA (Feb 25-29, 2024). 

Key Points: 
  • This reference design will be demonstrated at the Applied Power Electronics Conference in Long Beach, CA (Feb 25-29, 2024).
  • The reference design takes a direct AC input through AmberSemi's patented AC Direct DC Enabler™ technology and powers the ST microcontroller, gate drivers and Hall sensors for brushless motor applications.
  • "We are excited to showcase with ST, a global, market-leading semiconductor company,  a reference design around our breakthrough technologies at APEC 2024," said Thar Casey, CEO at AmberSemi.
  • "The timing of this reference design, as we enter the commercialization phase for our first semiconductor products, could not be more ideal.

Sivers Semiconductors launches new state-of-the-art 28 GHz 5G mmWave RF Module at Mobile World Congress 2024

Retrieved on: 
Monday, February 26, 2024
Storm, FWA, Mobile, Wireless, MWC, MIMO, NXP, Hertz, High-pass filter, RF, Radio frequency, Sivers, PCB, DBm, Modem, Mobile phone

NEW YORK , Feb. 26, 2024 /PRNewswire/ -- Sivers Semiconductors AB (STO:SIVE) today announced the commercial launch of its state-of-the-art new low-cost Radio Frequency (RF) Module BFM02803, covering the 5G FR2 mmWave bands N257, N258, and N261 (from 24.25 GHz to 29.5 GHz).

Key Points: 
  • NEW YORK , Feb. 26, 2024 /PRNewswire/ -- Sivers Semiconductors AB (STO:SIVE) today announced the commercial launch of its state-of-the-art new low-cost Radio Frequency (RF) Module BFM02803, covering the 5G FR2 mmWave bands N257, N258, and N261 (from 24.25 GHz to 29.5 GHz).
  • Module BFM02803 – presented at the Mobile World Congress (MWC) 2024 – is optimized for high-performance, high-power Fixed Wireless Access (FWA) applications and enables to differentiate and meet the requirements of large-scale manufacturing of FWA products.
  • The BFM02803 supports 2x2 MIMO with dual-layer polarization in both downlink and uplink for channels up to 1.2 GHz.
  • More information about this state-of-the-art 28GHz 5G mmWave RF module and live-demonstration will be presented at Sivers Semiconductors stand #5E2 in Hall 5 from February 26th to March 1st, 2024.

L-com Unveils IEC Connectors, Power Entry Modules and PDUs

Retrieved on: 
Thursday, February 22, 2024
Computer, ABS, C20, C18, CSA, C14, C16, UL, C15, Electronics, IEC, C19, VDE, PCB, EMI, AC, Electrical wiring

IRVINE, Calif., Feb. 22, 2024 /PRNewswire-PRWeb/ -- L-com, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of IEC connectors and power entry modules, IEC connector accessories and IEC power distribution units.

Key Points: 
  • IRVINE, Calif., Feb. 22, 2024 /PRNewswire-PRWeb/ -- L-com, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of IEC connectors and power entry modules , IEC connector accessories and IEC power distribution units .
  • "We're bringing reliable connection of AC power to critical components with these new IEC connectors, power entry modules, PDUs and accessories," said Product Line Manager Dan Rebeck.
  • Faulty power connections can become a thing of the past with the new line of IEC connectors.
  • "We're bringing reliable connection of AC power to critical components with these new IEC connectors, power entry modules, PDUs and accessories," said Product Line Manager Dan Rebeck.

L-com Unveils IEC Connectors, Power Entry Modules and PDUs

Retrieved on: 
Thursday, February 22, 2024
Computer, ABS, C20, C18, CSA, C14, C16, UL, C15, Electronics, IEC, C19, VDE, PCB, EMI, AC, Electrical wiring

IRVINE, Calif., Feb. 22, 2024 /PRNewswire/ -- L-com, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of IEC connectors and power entry modules, IEC connector accessories and IEC power distribution units.

Key Points: 
  • IRVINE, Calif., Feb. 22, 2024 /PRNewswire/ -- L-com, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has just introduced new lines of IEC connectors and power entry modules , IEC connector accessories and IEC power distribution units .
  • They power equipment such as computers, monitors, printers, server and networking equipment, audio and video gear, industrial machinery, and more.
  • Faulty power connections can become a thing of the past with the new line of IEC connectors.
  • "We're bringing reliable connection of AC power to critical components with these new IEC connectors, power entry modules, PDUs and accessories," said Product Line Manager Dan Rebeck.

Global and China New Energy Vehicle Electric Drive and Power Domain Industry Report 2023 - OEMs Working Harder to Independently Develop and Manufacture Electric Drive Systems

Retrieved on: 
Thursday, February 15, 2024
Écu, RTE, Architecture, OEM, VMD, ECU, SOA, UDS, Original equipment manufacturer, BYD, VCU, Great Wall Motor, NIO, ZF, Communication, BMS, BorgWarner, FOTA, MCU, Geely, EEA, Huawei, Volkswagen, Nidec, PCB, Software, Video game

DUBLIN, Feb. 15, 2024 /PRNewswire/ -- The "New Energy Vehicle Electric Drive and Power Domain Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Feb. 15, 2024 /PRNewswire/ -- The "New Energy Vehicle Electric Drive and Power Domain Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.
  • Electric drive and power domain research: electric drive assembly evolves to integration and domain control
    To follow the development trend for electrified and lightweight vehicles, new energy vehicle electric drive assembles tend to be highly integrated.
  • OEMs work harder to independently develop and manufacture electric drive systems.
  • 1.1 Mainstream Electric Drive Integration Solution: Three-in-one
    1.2 Future Electric Drive Integration Trend: All-in-one Deep Integration
    4.2 China Passenger Car Power Domain Controller Market Size, 2022-2025E

Global and China New Energy Vehicle Electric Drive and Power Domain Industry Research Report 2023 Featuring 6 International Powertrain Controller and Solution Suppliers and 11 Chinese Suppliers - ResearchAndMarkets.com

Retrieved on: 
Thursday, February 15, 2024
Alternative Energy, Energy, EV, Electric Vehicles, Automotive, Écu, RTE, Architecture, OEM, VMD, ECU, SOA, UDS, Original equipment manufacturer, BYD, VCU, Great Wall Motor, NIO, ZF, Communication, BMS, BorgWarner, FOTA, MCU, Geely, EEA, Huawei, Volkswagen, Nidec, PCB, Software, Video game

The "New Energy Vehicle Electric Drive and Power Domain Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "New Energy Vehicle Electric Drive and Power Domain Industry Report, 2023" report has been added to ResearchAndMarkets.com's offering.
  • Electric drive and power domain research: electric drive assembly evolves to integration and domain control
    To follow the development trend for electrified and lightweight vehicles, new energy vehicle electric drive assembles tend to be highly integrated.
  • DCU3000, a vehicle power domain controller launched by Tianjin Yidingfeng Powertrain, integrates control functions such as VCU, BMS, and thermal management.
  • 1.1 Mainstream Electric Drive Integration Solution: Three-in-one
    1.2 Future Electric Drive Integration Trend: All-in-one Deep Integration
    4.2 China Passenger Car Power Domain Controller Market Size, 2022-2025E

CHASM® Advanced Materials Announces Major Production Expansion of AgeNT® Transparent Antenna Solutions

Retrieved on: 
Thursday, February 15, 2024
FWA, Research, Wireless, Mobile World Congress, Electronics, MWC, Advanced Materials, Communication, Carbon, Privacy, PCB, Environment, Partnership

CANTON, Mass., Feb. 15, 2024 /PRNewswire-PRWeb/ -- CHASM Advanced Materials, a pioneer in carbon nanotube material solutions, has announced a major scale-up in the production of customized transparent antennas based on its AgeNT® transparent antenna technology, following successful market introduction last year. This expansion is in response to growing global demand and CHASM's commitment to innovation in connectivity technologies. The company will make the announcement at the MWC Barcelona 2024 exhibition (Hall 1, Booth 1C84), the world's largest connectivity event, Feb. 26-29 in Barcelona, Spain.

Key Points: 
  • CANTON, Mass., Feb. 15, 2024 /PRNewswire-PRWeb/ -- CHASM Advanced Materials, a pioneer in carbon nanotube material solutions, has announced a major scale-up in the production of customized transparent antennas based on its AgeNT® transparent antenna technology, following successful market introduction last year.
  • This expansion is in response to growing global demand and CHASM's commitment to innovation in connectivity technologies.
  • The production expansion is bolstered by CHASM's strategic partnership with Kundisch/Phoenix Mecano, a leader in precision fabrication of printed electronics devices.
  • The AgeNT® transparent antenna solution, utilizing cutting-edge carbon nanotube/copper micromesh technology, offers efficacy on par with low-loss, ceramic PCB-based antenna options.

Renesas to Acquire PCB Design Software Leader Altium to Make Electronics Design Accessible to Broader Market and Accelerate Innovation

Retrieved on: 
Wednesday, February 14, 2024
Hardware, Electronic Design Automation, Semiconductor, Security, Data Management, Manufacturing, Consumer Electronics, Technology, Audio, Video, General Automotive, Automotive, Software, Networks, Internet, Engineering, Acquisition, Electronics, Overalls, Scheme, Deleveraging, ASX, Digitalization, Ecosystem, Altium Designer, ECAD, Hand, PCB, ALU, VWAP, Video game

The current electronics system design flow is a complicated and iterative process that involves multiple stakeholders and design steps, from component selection and evaluation to simulation and PCB physical design.

Key Points: 
  • The current electronics system design flow is a complicated and iterative process that involves multiple stakeholders and design steps, from component selection and evaluation to simulation and PCB physical design.
  • The company has grown into a global market leader with the most popular PCB software tool in use today.
  • With the addition of the world’s first digital platform for design and realization of electronics hardware, Altium 365, Altium’s leading PCB design software creates seamless collaboration across the entire PCB design process.
  • In June 2023, Renesas announced that it had standardized development of all PCB design on the Altium 365 cloud-based platform from Altium.

Vishay Intertechnology 30 V N-Channel MOSFET With Source Flip Technology Delivers Best in Class RDS(ON) Down to 0.71 mΩ in PowerPAK® 1212-F

Retrieved on: 
Wednesday, February 14, 2024
MOSFET, FOM, Welding, Radio, BMS, Vishay Intertechnology, VSH, BLDC, Tablet, PCB, Printed circuit board

Featuring source flip technology in the 3.3 mm by 3.3 mm PowerPAK® 1212-F package, the Vishay Siliconix SiSD5300DN provides best in class on-resistance of 0.71 mΩ at 10 V and on-resistance times gate charge — a critical figure of merit (FOM) for MOSFETs used in switching applications — of 42 mΩ*nC.

Key Points: 
  • Featuring source flip technology in the 3.3 mm by 3.3 mm PowerPAK® 1212-F package, the Vishay Siliconix SiSD5300DN provides best in class on-resistance of 0.71 mΩ at 10 V and on-resistance times gate charge — a critical figure of merit (FOM) for MOSFETs used in switching applications — of 42 mΩ*nC.
  • Occupying the same footprint as the PowerPAK 1212-8S, the device released today offers 18 % lower on-resistance to increase power density, while its source flip technology reduces thermal resistance by 63 °C/W to 56 °C/W.
  • PowerPAK 1212-F source flip technology reverses the usual proportions of the ground and source pads, extending the area of the ground pad to provide a more efficient thermal dissipation path and thus promoting cooler operation.
  • At the same time, the PowerPAK 1212-F minimizes the extent of the switching area, which helps to reduce the impact of trace noise.