PCB

u-blox incorporates newest Nordic Semiconductor Bluetooth chips in two new compact modules

Retrieved on: 
Wednesday, April 10, 2024
Socs, Nordic Semiconductor, Communication, Health, Internet of things, Internet, MCU, Bluetooth Low Energy, Life, Radio, PCB, Machine learning, PSA, Printed circuit board

The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor.

Key Points: 
  • The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor.
  • They both support Bluetooth LE 5.4 and Thread/Matter technologies in a compact, power-efficient, and secure format.
  • With more than twice the processing power of previous Bluetooth LE modules, ALMA-B1 can even replace general-purpose MCUs in a compact solution.
  • u-blox (SIX:UBXN) provides semiconductor chips, modules, and IoT services that reliably locate and connect every thing.

MacroFab Announces Addition of Gordon Rapkin to Board of Directors

Retrieved on: 
Tuesday, April 9, 2024
Emory University, State Bar of Georgia, Emeritus, Syracuse University, Rapkin, Electronics, Psychology, Biochemistry, Robotics, PCB, Management

HOUSTON, April 9, 2024 /PRNewswire/ -- MacroFab Inc., the operator of North America's largest technology platform for electronics manufacturing, has announced today the appointment of Gordon Rapkin to its Board of Directors as Chairman.

Key Points: 
  • Gordon Rapkin is an experienced executive having served as the Chief Executive Officer of five different companies, as well as a corporate board member for an array of companies in the technology sector.
  • His expertise in guiding both public and private companies is invaluable as MacroFab continues to solidify its position as the premier digital platform for electronics manufacturing.
  • "MacroFab is reshaping the future of electronics manufacturing with our connected technology platform that addresses the core needs of manufacturers of all sizes," says Misha Govshteyn, CEO of MacroFab.
  • "Our team is excited to welcome Gordon Rapkin to our Board of Directors as Chairman.

A New Benchmark in Smart Mobile Audio - Goodix Technology Launches Next Generation Smart Amplifier

Retrieved on: 
Monday, April 8, 2024
Head, Noise, Tablet, Research, AI, EMI, Software, Life, Senior, Architecture, Human voice, PCB, NXP, Human, Cassette tape

Goodix Technology officially launched the new generation smart amplifier, TFA9865.

Key Points: 
  • Goodix Technology officially launched the new generation smart amplifier, TFA9865.
  • Leveraging a proprietary, full digital architecture and advanced manufacturing processes, the TFA9865 sets a new standard in audio performance.
  • The audio amplifier chip achieves unparalleled audio performance in the industry, with dimensions of just 2.2*2.
  • In 2020, this expert team joined Goodix Technology, becoming the core force of its audio product line.

A New Benchmark in Smart Mobile Audio - Goodix Technology Launches Next Generation Smart Amplifier

Retrieved on: 
Monday, April 8, 2024
Head, Noise, Tablet, Research, AI, EMI, Software, Life, Senior, Architecture, Human voice, PCB, NXP, Human, Cassette tape

Goodix Technology officially launched the new generation smart amplifier, TFA9865.

Key Points: 
  • Goodix Technology officially launched the new generation smart amplifier, TFA9865.
  • Leveraging a proprietary, full digital architecture and advanced manufacturing processes, the TFA9865 sets a new standard in audio performance.
  • The audio amplifier chip achieves unparalleled audio performance in the industry, with dimensions of just 2.2*2.
  • In 2020, this expert team joined Goodix Technology, becoming the core force of its audio product line.

Abracon Releases New Stamped Metal Embedded Niche Antennas Up to 8736 MHz

Retrieved on: 
Monday, April 8, 2024
Internet of things, Hertz, Magnetism, Antenna, News, PCB, RF

These antennas merge Abracon's innovative Niche technology with the proven performance and reliability of traditional stamped metal antennas, offering unparalleled benefits and features for a wide range of applications.

Key Points: 
  • These antennas merge Abracon's innovative Niche technology with the proven performance and reliability of traditional stamped metal antennas, offering unparalleled benefits and features for a wide range of applications.
  • The new stamped metal niche antennas from Abracon revolutionize design possibilities by allowing components to be placed underneath the antenna on the PCB, enhancing design flexibility.
  • Other notable features of Abracon's Stamped Metal Niche Antennas include high efficiency, suitability for potted antenna applications, competitive cost advantage, and design flexibility.
  • "With the next generation of stamped metal antennas, we have pushed the barrier for cost and size to another level.

Abracon Releases New Stamped Metal Embedded Niche Antennas Up to 8736 MHz

Retrieved on: 
Monday, April 8, 2024
Internet of things, Hertz, Magnetism, Antenna, News, PCB, RF

These antennas merge Abracon's innovative Niche technology with the proven performance and reliability of traditional stamped metal antennas, offering unparalleled benefits and features for a wide range of applications.

Key Points: 
  • These antennas merge Abracon's innovative Niche technology with the proven performance and reliability of traditional stamped metal antennas, offering unparalleled benefits and features for a wide range of applications.
  • The new stamped metal niche antennas from Abracon revolutionize design possibilities by allowing components to be placed underneath the antenna on the PCB, enhancing design flexibility.
  • Other notable features of Abracon's Stamped Metal Niche Antennas include high efficiency, suitability for potted antenna applications, competitive cost advantage, and design flexibility.
  • "With the next generation of stamped metal antennas, we have pushed the barrier for cost and size to another level.

Nano Dimension Announces Record 2023 Revenue of $56.3 Million and Organic Growth of 29%

Retrieved on: 
Thursday, March 21, 2024
Research, Service provider, Attention, ROI, Senior, RET, Tower Semiconductor, Initiative, AME, Share repurchase, Sale, 3D, Acquisition, G&A, Aviation, Multi, ADS, Record, Nano, Robotics, Annual general meeting, PCB, Vice president, Workforce, Patent, 3D printing, Fraunhofer Society, Marketing, Corporate development, Human, Army, Printing, Video game

WALTHAM, Mass., March 21, 2024 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”), today announced financial results for the fourth quarter and full year ended December 31st, 2023.

Key Points: 
  • Nano Dimension has a breadth of technologies and products assortment, yet narrow and focused span of synergistic vertical markets.
  • It is specifically designed to enable Nano Dimension to become operating income positive in 2025, and potentially cash flow positive earlier.
  • As an example, Q4/2023’s $14.5 million in revenue was 19% higher than the same period in the year before.
  • With close to $56.3 million of revenue, Nano Dimension is the fastest growing of the cohort of publicly traded AM / 3D printing companies (approximately 10-12).

STMicroelectronics reveals advanced ultra-low-power STM32 microcontrollers for industrial, medical, smart-metering, and consumer applications

Retrieved on: 
Tuesday, March 19, 2024
LCD, Patent, Internet of things, RED, Internet, Electronics, MCU, Motion, United States patent law, Water, Certification, PCB, DAC, Heart, STM, General-purpose, STM32, ADC, PSA, STMicroelectronics, Video game

At the heart of the smart sensors and actuators making them possible, ST’s microcontrollers manage the processes that collect, filter, analyze, and act, communicating with high-level applications in the cloud.

Key Points: 
  • At the heart of the smart sensors and actuators making them possible, ST’s microcontrollers manage the processes that collect, filter, analyze, and act, communicating with high-level applications in the cloud.
  • There are billions of these MCUs in action already and the expansion of smart living and working will demand billions more.
  • “It’s vital that these pervasive devices consume as little energy as possible as they help to minimize waste elsewhere.
  • STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere.

Vishay Intertechnology Upgrades TFBS4xx and TFDU4xx Series IR Transceiver Modules With Longer Link Distance and Improved ESD Robustness

Retrieved on: 
Wednesday, March 13, 2024
Temperature, PIN, Infrared Data Association, IRDC, ESD, Communication, Life, VSH, PCB, SIR, Vishay Intertechnology

MALVERN, Pa., March 13, 2024 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV.

Key Points: 
  • MALVERN, Pa., March 13, 2024 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV.
  • Devices in the Vishay Semiconductors TFBS4xxx and TFDU4xxx series each consist of a PIN photodiode, infrared emitter (IRED), and low power control IC in a single package.
  • And as drop-in replacements for existing devices, the modules help save costs by eliminating the need for PCB redesigns.
  • Compliant with the latest IrDA physical layer specification, TFBS4xxx and TFDU4xxx series devices are backward-compatible and are offered in top- and side-view surface-mount packages.

GOWIN Semiconductor to attend Embedded World 2024

Retrieved on: 
Wednesday, March 13, 2024
HDMI, EW, MIPI, Internet of things, SerDes, FOC, PCB, IP, Exhibition, FPGA

LONDON and GUANGZHOU, China, March 13, 2024 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA provider, is set to participate in Embedded World 2024 from April 9th to 11th in Nuremberg, Germany.

Key Points: 
  • LONDON and GUANGZHOU, China, March 13, 2024 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA provider, is set to participate in Embedded World 2024 from April 9th to 11th in Nuremberg, Germany.
  • Embedded World, hosted annually in Germany, stands as Europe's premier trade show for embedded solutions and technologies.
  • Boasting over 1000 exhibitors, it ranks among the world's largest fairs dedicated to cutting-edge embedded technologies for IoT and related market segments.
  • To schedule a meeting with GOWIN Semiconductor at Embedded World 2024, please fill out this Google Form here: https://docs.google.com/forms/d/e/1FAIpQLSfsROeh2n92rf3VWtl6-BBWNPMaem2a...
    For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/
    For more information about and to register for the conference, visit https://www.embedded-world.de/en