Micrometre

Micron Debuts World’s First Quad-Port SSD to Accelerate Data-Rich Autonomous and AI-Enabled Vehicle Workloads

Retrieved on: 
Tuesday, April 9, 2024
IOV, Micrometre, Temperature, SLC, Socs, Vibration, SOC, Algorithm, Original equipment manufacturer, SSD, Shock, Embedded, DRAM, ADAS, AI, PCI Express, TLC, Micron Technology, VM, Telemetry, IVI, Architecture, OEM, VMS, Ecosystem, IOPS, Solid-state drive, Privacy, Map, Hacking, SR-IOV

The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe® Generation 4 interface and ruggedized automotive design.

Key Points: 
  • The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe® Generation 4 interface and ruggedized automotive design.
  • With these features, the automotive-grade SSD provides the ecosystem with data center-level flexibility and power.
  • This support for multi-host workloads is essential as today’s automotive SoCs increasingly use VMs to multitask across different functions, from autonomous driving to vehicle-to-vehicle communication.
  • The company is showcasing a demo of the SSD at Embedded World in Nuremberg, Germany from April 9-11 at booth 5-109.

2024 COMPUTEX Forum to Focus on Artificial Intelligence Delving into the Realm of Generative AI through Application and Hardware Innovation

Retrieved on: 
Monday, April 8, 2024
COMPUTEX, Micrometre, Taipei Nangang Exhibition Center, Synthetic media, Artificial intelligence of things, International, Forum, AWS, NVIDIA, Generative, Medical device

In line with this year's theme, "Connecting AI," the COMPUTEX Forum is slated to center around the "Let's Talk Generative AI."

Key Points: 
  • In line with this year's theme, "Connecting AI," the COMPUTEX Forum is slated to center around the "Let's Talk Generative AI."
  • International AI experts will delve into AI application deployment and crucial hardware innovation.
  • Importantly, it will analyze the vast opportunities for innovation in generative AI applications and explore potential business prospects for 2024.
  • Moreover, it will analyze how the innovative application of Generative AI in 2024 can maximize possibilities for innovation and business opportunities.

Micron Technology, Inc. Reports Results for the Second Quarter of Fiscal 2024

Retrieved on: 
Wednesday, March 20, 2024
GAAP, EPS, Micron Technology, Micrometre

BOISE, Idaho, March 20, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) today announced results for its second quarter of fiscal 2024, which ended February 29, 2024.

Key Points: 
  • BOISE, Idaho, March 20, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) today announced results for its second quarter of fiscal 2024, which ended February 29, 2024.
  • GAAP net income of $793 million, or $0.71 per diluted share
    Non-GAAP net income of $476 million, or $0.42 per diluted share
    “Micron delivered fiscal Q2 results with revenue, gross margin and EPS well above the high-end of our guidance range — a testament to our team’s excellent execution on pricing, products and operations,” said Sanjay Mehrotra, President and CEO of Micron Technology.
  • “Our preeminent product portfolio positions us well to deliver a strong fiscal second half of 2024.
  • We believe Micron is one of the biggest beneficiaries in the semiconductor industry of the multi-year opportunity enabled by AI.”

Global Hybrid Memory Cube and High-Bandwidth Memory Industry Research 2023-2033: Increasing Focus on Energy-Efficient Technology Solutions and Growing Applications of Edge-Based Technologies - ResearchAndMarkets.com

Retrieved on: 
Monday, April 1, 2024
Telecommunications, Software, Networks, Artificial Intelligence, Data Management, Technology, IOT (Internet of Things), Security, Micrometre, HBM, Data wrangling, GPU, Memory, Name, Internet of things, HPC, Artificial intelligence, AI, Graphics processing unit, HMC, AMD, Region, Machine learning, Hybrid Memory Cube, NVIDIA, Video game

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors.

Key Points: 
  • Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors.
  • Hybrid memory cubes and high-bandwidth memory offer significant memory bandwidth improvements, particularly beneficial for GPUs in graphics rendering and parallel computing.
  • What are the major patents filed by the companies active in the global hybrid memory cube and high-bandwidth memory market?
  • What is the future outlook for the hybrid memory cube and high-bandwidth memory market in terms of growth potential and technological advancements?

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

InsurSec Leader At-Bay Appoints Martina Trucco as Chief Marketing Officer

Retrieved on: 
Wednesday, March 13, 2024
Apps, Applications, Technology, Insurance, Security, Fintech, Business, Professional Services, Small Business, Software, Hewlett Packard Enterprise, Micrometre, Growth, Memory, Risk, HP Labs, Luigi, Marketing, MDR, Multimedia, Clari, HP, Corporation

At-Bay , the InsurSec provider for the digital age, today announced the appointment of Martina Trucco as its Chief Marketing Officer.

Key Points: 
  • At-Bay , the InsurSec provider for the digital age, today announced the appointment of Martina Trucco as its Chief Marketing Officer.
  • Since joining At-Bay in September 2022, Trucco has overseen the company’s emergence as the leading innovator of insurance and security (InsurSec) and transformed its marketing and communications strategy.
  • Before joining At-Bay, she was Vice President of Corporate Marketing at Clari, a fast-growth revenue technology unicorn.
  • Previously, Trucco led Global Communications and Marketing at Micron, one of the world’s largest memory and storage innovators.

HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce

Retrieved on: 
Wednesday, March 13, 2024
Environment, Apps, Applications, Technology, Semiconductor, Professional Services, Sustainability, Audio, Video, Green Technology, Data Analytics, Artificial Intelligence, Micrometre, Certification, HBM, Blog, News, Table, Plant, Samsung, HBM3, AMD, Video game

TrendForce highlights that the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3.

Key Points: 
  • TrendForce highlights that the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3.
  • The current HBM3 supply for NVIDIA’s H100 solution is primarily met by SK hynix, leading to a supply shortfall in meeting burgeoning AI market demands.
  • Samsung’s entry into NVIDIA’s supply chain with its 1Znm HBM3 products in late 2023, though initially minor, signifies its breakthrough in this segment.
  • It’s worth noting that Micron has not yet entered the HBM supply market, leaving SK hynix and Samsung as key players.

Exascend Pushing Storage Beyond Boundaries At Embedded World 2024

Retrieved on: 
Wednesday, April 3, 2024
Micrometre, Temperature, Vibration, SSD, BGA, Shock, Embedded, Humidity, MultiMediaCard, LDPC, Booth, Payment card, CFexpress, Printed circuit board

TAIPEI, April 3, 2024 /PRNewswire/ -- Exascend, a service-oriented provider of innovative storage and memory solutions, is set to showcase its latest innovations at Embedded World 2024 in Nuremberg, Germany from April 9-11. Renowned for pushing the boundaries of storage technology, Exascend invites attendees to explore the possibilities of "Storage Beyond Boundaries" at Booth 1-422.

Key Points: 
  • TAIPEI, April 3, 2024 /PRNewswire/ -- Exascend , a service-oriented provider of innovative storage and memory solutions, is set to showcase its latest innovations at Embedded World 2024 in Nuremberg, Germany from April 9-11.
  • Renowned for pushing the boundaries of storage technology, Exascend invites attendees to explore the possibilities of "Storage Beyond Boundaries" at Booth 1-422.
  • In a testament to its collaboration with industry leaders in innovative storage solutions, Exascend will also feature a showcase area at Micron's booth, highlighting storage solutions tailored for cinematography, automotive, and mission-critical applications.
  • Additional Onsite Showcases at Exascend's Booth 1-422:
    Industrial removable storage solutions including CFexpress, CFast, SD, and microSD cards
    Don't miss the opportunity to explore Exascend's innovative storage solutions and advancements at Embedded World 2024.

Global Hybrid Memory Cube and High-Bandwidth Memory Industry Research Report 2023-2033 Featuring Market Leaders - AMD, Micron, NVIDIA, IBM, HPE, Samsung and Intel Among Others

Retrieved on: 
Thursday, March 28, 2024
Micrometre, HBM, Data wrangling, GPU, Memory, Name, Internet of things, HPC, Artificial intelligence, AI, Graphics processing unit, HMC, AMD, Region, Machine learning, Hybrid Memory Cube, NVIDIA, Video game

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors.

Key Points: 
  • Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors.
  • How does the supply chain function in the global hybrid memory cube and high-bandwidth memory market?
  • What are the major patents filed by the companies active in the global hybrid memory cube and high-bandwidth memory market?
  • What is the future outlook for the hybrid memory cube and high-bandwidth memory market in terms of growth potential and technological advancements?

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

Retrieved on: 
Friday, March 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage