HBM2

Fujitsu provides supercomputer system to the Japan Meteorological Agency for forecasting of linear rainbands and torrential rains

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Monday, February 27, 2023
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TOKYO, Feb 27, 2023 - (JCN Newswire) - Fujitsu today announced that it provided a new supercomputer system to the Japan Meteorological Agency (hereinafter JMA) (1) for use in linear rainband forecasting.

Key Points: 
  • TOKYO, Feb 27, 2023 - (JCN Newswire) - Fujitsu today announced that it provided a new supercomputer system to the Japan Meteorological Agency (hereinafter JMA) (1) for use in linear rainband forecasting.
  • The new supercomputer system is able to predict the occurrence of linear rainbands (2) which can trigger heavy rain, leading to disasters like landslides and flooding.
  • The system is based on the "FUJITSU Supercomputer PRIMEHPC FX1000" (3) hardware, which features the same A64FX CPU as the supercomputer "Fugaku," jointly developed by RIKEN (4) and Fujitsu.
  • Reaching a theoretical peak performance of about 31.1 PFLOPS (5), the new system will help the JMA to significantly improve the accuracy of its forecasting of linear rainbands.

Apple unveils M2 Pro and M2 Max: next-generation chips for next-level workflows

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Tuesday, January 17, 2023
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M2 Pro brings pro performance to Mac mini® for the first time, while M2 Pro and M2 Max take the game-changing performance and capabilities of the 14-inch and 16-inch MacBook Pro® even further.

Key Points: 
  • M2 Pro brings pro performance to Mac mini® for the first time, while M2 Pro and M2 Max take the game-changing performance and capabilities of the 14-inch and 16-inch MacBook Pro® even further.
  • View the full release here: https://www.businesswire.com/news/home/20230117005535/en/
    M2 Pro and M2 Max are next-generation chips that take the breakthrough power-efficient performance of Apple silicon to new heights.
  • (Graphic: Business Wire)
    “Only Apple is building SoCs like M2 Pro and M2 Max.
  • M2 Pro and M2 Max help the new MacBook Pro and Mac mini meet Apple’s high standards for energy efficiency.

Apple unveils MacBook Pro featuring M2 Pro and M2 Max, with more game-changing performance and the longest battery life ever in a Mac

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Tuesday, January 17, 2023
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Apple® today announced the new 14- and 16-inch MacBook Pro® featuring M2 Pro and M2 Max, Apple’s next-generation pro silicon that brings even more power-efficient performance and battery life to pro users.

Key Points: 
  • Apple® today announced the new 14- and 16-inch MacBook Pro® featuring M2 Pro and M2 Max, Apple’s next-generation pro silicon that brings even more power-efficient performance and battery life to pro users.
  • View the full release here: https://www.businesswire.com/news/home/20230117005533/en/
    Today Apple introduced the new MacBook Pro with M2 Pro and M2 Max.
  • Available in 16- and 14-inch models, MacBook Pro delivers more performance, advanced connectivity, and the longest battery life ever in a Mac.
  • MacBook Pro with M2 Pro features a 10- or 12-core CPU with up to eight high-performance and four high-efficiency cores for up to 20 percent greater performance over M1 Pro.

SK hynix to Supply Industry's First HBM3 DRAM to NVIDIA

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Thursday, June 9, 2022
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Mass production of world's best-performing DRAM, HBM3, comes just seven months after development announcement

Key Points: 
  • Mass production of world's best-performing DRAM, HBM3, comes just seven months after development announcement
    SEOUL, South Korea, June 8, 2022 /PRNewswire/ --SK hynix Inc. (or "the company", www.skhynix.com ) announced that it began mass production of HBM3, the world's best-performing DRAM.
  • HBM3 DRAM is the 4th generation HBM product, succeeding HBM (1st generation), HBM2 (2nd generation) and HBM2E (3rd generation).
  • SK hynix will provide HBM3 for NVIDIA systems expected to ship starting in the third quarter of this year.
  • Kevin (Jongwon) Noh, president and chief marketing officer at SK hynix, states that the company has secured top-notch competitiveness in the premium DRAM market through its close work with NVIDIA.

JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard

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Thursday, January 27, 2022
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JEDEC Solid State Technology Association , the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard: JESD238 HBM3, available for download from the JEDEC website .

Key Points: 
  • JEDEC Solid State Technology Association , the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard: JESD238 HBM3, available for download from the JEDEC website .
  • HBM3 will enable the industry to reach even higher performance thresholds with improved reliability and lower energy consumption, said Mark Montierth, vice president and general manager of High-Performance Memory and Networking at Micron.
  • In collaborating with JEDEC members to develop this specification, we leveraged Microns long history of delivering advanced memory stacking and packaging solutions to optimize market-leading computing platforms.
  • With the current release of the HBM3 JEDEC standard, SK hynix is pleased to be able to provide a memory to our customers that has the highest bandwidth and the best power efficiency existing today with added robustness through adoption of an enhanced ECC scheme.

Habana Labs Announces Turnkey AI Training Solution Featuring Habana Gaudi Platform and DDN AI400X2 Storage System

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Tuesday, November 16, 2021
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TEL-AVIV, Israel and SANTA CLARA, Calif., Nov. 16, 2021 /PRNewswire/ -- Habana Labs ,an Intel Company and leading developer of AI processors, today announced the availability of a turnkey, enterprise-class AI training solution featuring the Supermicro X12 Gaudi AI Training Server with the DDN AI400X2 Storage system.

Key Points: 
  • TEL-AVIV, Israel and SANTA CLARA, Calif., Nov. 16, 2021 /PRNewswire/ -- Habana Labs ,an Intel Company and leading developer of AI processors, today announced the availability of a turnkey, enterprise-class AI training solution featuring the Supermicro X12 Gaudi AI Training Server with the DDN AI400X2 Storage system.
  • With eight Habana Gaudi purpose-built AI processors, the Supermicro X12 Gaudi AI Server provides customers with highly cost-efficient AI training, ease of use and system scalability.
  • The turnkey AI training solution comespre-configured withone, two and four X12 server options to address AI training capacity requirements.
  • To learn more about the high-efficiency combination of the Supermicro X12 Gaudi AI Server and DDN AI400X2 appliance, see the DDN whitepaper: DDN A3I Solutions with Supermicro X12 Gaudi AI Servers .

Xilinx Launches Alveo U55C, Its Most Powerful Accelerator Card Ever, Purpose-Built for HPC and Big Data Workloads

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Monday, November 15, 2021
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The Alveo U55C accelerator brings superior performance-per-watt to high performance computing (HPC) and database workloads and easily scales through the Xilinx HPC clustering solution.

Key Points: 
  • The Alveo U55C accelerator brings superior performance-per-watt to high performance computing (HPC) and database workloads and easily scales through the Xilinx HPC clustering solution.
  • View the full release here: https://www.businesswire.com/news/home/20211115005157/en/
    Xilinx Alveo U55C data center accelerator card (Photo: Business Wire)
    Purpose-built for HPC and big data workloads, the new Alveo U55C card is the companys most powerful Alveo accelerator card ever, offering the highest compute density and HBM capacity in the Alveo accelerator portfolio.
  • The Alveo U55C card combines many key features that todays HPC workloads require.
  • MPI integration allows for HPC developers to scale out Alveo data pipelining from the Xilinx Vitis unified software platform .

AMD Unveils Workload-Tailored Innovations and Products at The Accelerated Data Center Premiere

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Monday, November 8, 2021
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SANTA CLARA, Calif., Nov. 08, 2021 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) held the virtual Accelerated Data Center Premiere, launching the new AMD Instinct™ MI200 series accelerators, the world’s fastest accelerator for high performance computing (HPC) and artificial intelligence (AI) workloadsi, and provided a preview of the innovative 3rd Gen AMD EPYC™ processors with AMD 3D V-Cache. AMD also revealed new information about its next generation “Zen 4” processor core and announced the new “Zen 4c” processor core, both of which will power future AMD server processors and are designed to extend the company’s leadership products for the data center.

Key Points: 
  • AMD employees around the world are focused on building great products that push the boundaries of what is possible.
  • For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website , blog , Facebook , LinkedIn and Twitter pages.
  • AMD, the AMD Arrow logo, EPYC, AMD Instinct, Infinity Fabric and combinations thereof are trademarks of Advanced Micro Devices, Inc. PCIe is a registered trademark of PCI-SIG Corporation.
  • i MI200-01: Worlds fastest data center GPU is the AMD Instinct MI250X.

New AMD Instinct™ MI200 Series Accelerators Bring Leadership HPC and AI Performance to Power Exascale Systems and More

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Monday, November 8, 2021
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SANTA CLARA, Calif., Nov. 08, 2021 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced the new AMD Instinct™ MI200 series accelerators, the first exascale-class GPU accelerators. AMD Instinct MI200 series accelerators includes the world’s fastest high performance computing (HPC) and artificial intelligence (AI) accelerator,1 the AMD Instinct™ MI250X.

Key Points: 
  • AMD employees around the world are focused on building great products that push the boundaries of what is possible.
  • For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website , Facebook , LinkedIn and Twitter pages.
  • AMD, the AMD Arrow logo, AMD CDNA, EPYC, AMD Instinct, Infinity Fabric, Radeon Instinct, ROCm and combinations thereof are trademarks of Advanced Micro Devices, Inc. PyTorch is a trademark or registered trademark of PyTorch.
  • Calculations by AMD Performance Labs as of OCT 5th, 2020 for the AMD Instinct MI100 accelerator designed with AMD CDNA 7nm FinFET process technology at 1,200 MHz peak memory clock resulted in 1.2288 TFLOPS peak theoretical memory bandwidth performance.

SK hynix Announces Development of HBM3 DRAM

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Wednesday, October 20, 2021
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SK hynix was also the first in the industry to start mass production of HBM2E.

Key Points: 
  • SK hynix was also the first in the industry to start mass production of HBM2E.
  • SK hynix's HBM3 is not only the fastest DRAM in the world, but also comes with the biggest capacity and significantly improved level of quality.
  • SK hynix's HBM3 will be provided in two capacity types of 24GB the industry's biggest -- and 16GB.
  • "Since its launch of the world's first HBM DRAM, SK hynix has succeeded in developing the industry's first HBM3 after leading the HBM2E market," said Seon-yong Cha, Executive Vice President in charge of the DRAM development.