HBM2

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

Retrieved on: 
Wednesday, April 3, 2024
CHIPS, HBM, Ambassador, Package, Assistant, Partnership, DRAM, Research, News, AI, Local government, Organic, Commerce, Purdue Research Park, Silicon, Architecture, HBM3, Midwestern United States, Semiconductor, Ecosystem, ChatGPT, South Korea, HBM2, Government, Dynamic random-access memory

"I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.

Key Points: 
  • "I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.
  • Senator Todd Young, a key advocate for the project, said, "SK hynix will soon be a household name in Indiana.
  • "SK hynix is the global pioneer and dominant market leader in memory chips for AI," Purdue University President Mung Chiang said.
  • It is also a monumental moment for completing the supply chain of digital economy in our country through chips advanced packaging.

SK hynix Begins Volume Production of Industry's First HBM3E

Retrieved on: 
Tuesday, March 19, 2024
HBM, Pressure, Memory, Partnership, DRAM, AI, Heat, HBM3, Ecosystem, TB, HBM2, Video game

The company expects a successful volume production of HBM3E, along with its experiences also as the industry's first provider of HBM3, to help cement its leadership in the AI memory space.

Key Points: 
  • The company expects a successful volume production of HBM3E, along with its experiences also as the industry's first provider of HBM3, to help cement its leadership in the AI memory space.
  • Global big tech companies have been increasingly requiring stronger performance of AI semiconductor and SK hynix expects its HBM3E to be their optimal choice that meets such growing expectations.
  • SK hynix's HBM3E also comes with a 10% improvement in heat-dissipation performance, compared with the previous generation, following application of the advanced MR-MUF** process.
  • Sungsoo Ryu, Head of HBM Business at SK hynix, said that mass production of HBM3E has completed the company's lineup of industry-leading AI memory products.

Apple unveils the new MacBook Pro featuring the M3 family of chips, making the world’s best pro laptop even better

Retrieved on: 
Tuesday, October 31, 2023
Technology, Hardware, Semiconductor, Consumer Electronics, Online, Name, MacBook Pro, Apple Store, Apple Music, Apple M1, Architecture, Apple Watch, IPadOS, Game, Silver, CPU, Intel Core, Recycling, HBM2, Memory, HDR, Mercury, Gold, IPad, Carbon, Remote desktop software, Apple Authorized Service Provider, TvOS, Final Cut Pro, MacBook, ICloud, Mac (computer), Ecosystem, Magic, Machine learning, GPU, IOS, M1, App Store (iOS/iPadOS), RAM, Xcode, MacOS, Intel, Apple Pay, Chemistry, Sonoma, Mac, Apple Inc., Education, Continuity, Apple TV, Magnet, Forest, Aluminium, Multimedia, IPhone, Beryllium, SDR, Student, Retina display, Computer, Collection, Video game, Cassette tape, Music, Propane, Mobile phone, Computer data storage, Apple, M3, WatchOS

Apple® today announced a new MacBook Pro® lineup featuring the all-new family of M3 chips: M3, M3 Pro, and M3 Max.

Key Points: 
  • Apple® today announced a new MacBook Pro® lineup featuring the all-new family of M3 chips: M3, M3 Pro, and M3 Max.
  • View the full release here: https://www.businesswire.com/news/home/20231030177195/en/
    Today Apple unveiled MacBook Pro featuring the next generation of M3 chips.
  • With MacBook Pro with M3 Max:
    MacBook Pro models with M3 Pro and M3 Max are available in space black, a stunning new color that’s unmistakably pro.
  • Apple, the Apple logo, MacBook Pro, Liquid Retina XDR, Mac, Final Cut Pro, Xcode, macOS, iPhone, Safari, Apple Store, Apple Trade In, and Apple TV are trademarks of Apple.

Samsung Electronics Holds Memory Tech Day 2023 Unveiling New Innovations To Lead the Hyperscale AI Era

Retrieved on: 
Friday, October 20, 2023
Data Management, Automotive, Consumer Electronics, Technology, Engineering, Sustainability, Automotive Manufacturing, Aerospace, Manufacturing, General Automotive, Environment, Semiconductor, Autonomous Driving, Vehicles, Photography, Nanotechnology, Artificial Intelligence, Audio, Video, Networks, Internet, Hardware, Electronic Design Automation, TCO, 3D, Solid-state drive, DRAM, NCF, Samsung Electronics, Data-rate units, Electronics, DDR5, Flash, TB, HPC, QLC, Apple Inc. v. Samsung Electronics Co., Socs, Multimedia, Carbon footprint, HBM3, LPDDR5X, SSD, Thermal conductivity, Imagination, HBM, AI, Detachment, UFS, Personal computer, HBM2, Workload, Samsung, Computer data storage, Printed circuit board, Mobile phone, Renewable energy

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today held its annual Memory Tech Day , showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — including the cloud, edge devices and automotive vehicles.

Key Points: 
  • Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today held its annual Memory Tech Day , showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — including the cloud, edge devices and automotive vehicles.
  • View the full release here: https://www.businesswire.com/news/home/20231020818569/en/
    Jung-Bae Lee, President and Head of Memory Business at Samsung Semiconductor, delivers opening keynote at Samsung's annual Memory Tech Day.
  • Jung-Bae Lee, President and Head of Memory Business at Samsung Electronics, used his keynote address to expand on how Samsung will overcome the challenges of the hyperscale era through innovations in new transistor structures and materials.
  • Accordingly, Samsung introduced a range of memory solutions that support high-performance, high-capacity, low-power and small form factors at the edge.

SK hynix Develops World's Best Performing HBM3E, Provides Samples to Customer for Performance Evaluation

Retrieved on: 
Monday, August 21, 2023
Graphics processing unit, HBM, SK, Information technology, DRAM, HBM3, High Bandwidth Memory, Central processing unit, NVIDIA, HPC, HBM2, Management, Video game, AI

* HBM (High Bandwidth Memory): A high-value, high-performance memory that vertically interconnects multiple DRAM chips, enabling a dramatic increase in data processing speed in comparison to earlier DRAM products.

Key Points: 
  • * HBM (High Bandwidth Memory): A high-value, high-performance memory that vertically interconnects multiple DRAM chips, enabling a dramatic increase in data processing speed in comparison to earlier DRAM products.
  • HBM3E is the extended version of the HBM3 and the 5th generation of its kind, succeeding the previous generations HBM, HBM2, HBM2E and HBM3.
  • "We look forward to continuing our collaboration with HBM3E to deliver the next generation of AI computing."
  • "By increasing the supply share of the high-value HBM products, SK hynix will also seek a fast business turnaround."

Suppliers Amp Up Production, HBM Bit Supply Projected to Soar by 105% in 2024, Says TrendForce

Retrieved on: 
Wednesday, August 9, 2023
Batteries, Other Manufacturing, Hardware, Artificial Intelligence, Technology, Semiconductor, Manufacturing, Other Technology, Graphics processing unit, HBM, ASP, SK, Table, DRAM, TSV, Machine, Overalls, Lead, Samsung, Micrometre, NVIDIA, Risk, SK Hynix, Yoy, HBM2, Dairy, Fine chemical, HBM3, AI

Forecasts based on current production plans from suppliers indicate a remarkable 105% annual increase in HBM bit supply by 2024.

Key Points: 
  • Forecasts based on current production plans from suppliers indicate a remarkable 105% annual increase in HBM bit supply by 2024.
  • TrendForce analysis indicates that 2023 to 2024 will be pivotal years for AI development, triggering substantial demand for AI Training chips and thereby boosting HBM utilization.
  • However, as the focus pivots to Inference, the annual growth rate for AI Training chips and HBM is expected to taper off slightly.
  • Looking ahead to 2024, TrendForce forecasts that due to aggressive expansion by suppliers, the HBM sufficiency ratio will rise from -2.4% to 0.6% in 2024.

SK hynix Enters Industry's First Compatibility Validation Process for 1bnm DDR5 Server DRAM

Retrieved on: 
Tuesday, May 30, 2023
HBM, Scalability, SK, DRAM, HBM3, Intel, JEDEC, HKMG, HBM2, Semiconductor, Computer data storage, DDR5, Memory

The move comes after SK hynix became the first in the industry to reach 1anm readiness and completed Intel's system validation of the 1anm DDR5, the fourth-generation of the 10nm technology.

Key Points: 
  • The move comes after SK hynix became the first in the industry to reach 1anm readiness and completed Intel's system validation of the 1anm DDR5, the fourth-generation of the 10nm technology.
  • * DDR5 products for test run in early days of development ran at 4.8Gbps, while the maximum speed of DDR5 stipulated in the JEDEC standards is 8.8Gbps
    Besides, with the adoption of high-K metal gate** process, the 1bnm DDR5 products reduce power consumption by over 20% than 1anm DDR5 products.
  • SK hynix introduced the world's first HKMG process for mobile DRAM in November and adopted the technology for its 9.6Gbps LPDDR5T mobile DRAM in January 2023
    "SK hynix expects the validation process of the 1bnm DDR5 product with Intel to go smoothly following a successful validation of our 1anm server DDR5 product compatibility with the 4th Gen Intel® Xeon® Scalable processors," Jonghwan Kim, Head of DRAM Development at SK hynix, said.
  • Meanwhile, SK hynix also said that additional validation processes to apply its 1anm DDR5, of which the first compatibility test has been already completed, onto the next generation of Intel® Xeon® Scalable platform are also underway.

SK hynix Develops Industry's First 12-Layer HBM3, Provides Samples To Customers

Retrieved on: 
Thursday, April 20, 2023
HBM, SK, DRAM, TSV, HBM3, FHD, High Bandwidth Memory, Silicon, HPC, AI, SK Hynix, Package, Through-silicon via, HBM2, GB, Sintering, Computer data storage, Printed circuit board

* HBM (High Bandwidth Memory): A high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.

Key Points: 
  • * HBM (High Bandwidth Memory): A high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.
  • SK hynix has provided samples of its 24GB HBM3 product to multiple customers that have expressed great expectation for the latest product, while the performance evaluation of the product is in progress.
  • "SK hynix was able to continuously develop a series of ultra-high speed and high capacity HBM products through its leading technologies used in the back-end process," said Sang Hoo Hong, Head of Package & Test at SK hynix.
  • "The company plans to complete mass production preparation for the new product within the first half of the year to further solidify its leadership in cutting-edge DRAM market in the era of AI."

Fujitsu provides supercomputer system to the Japan Meteorological Agency for forecasting of linear rainbands and torrential rains

Retrieved on: 
Monday, February 27, 2023
Japan Meteorological Agency, Automated Meteorological Data Acquisition System, Forecasting, AArch64, Flood, Landslide, Meteorological Administration, System 9, Weather, Life, FUJITSU, Risk, Computer, Architecture, Observation, CPU, Arm, FLOPS, SVE, Rainband, Earthquake, Rain, Temperature, Disaster, LINPACK, Wind, RIKEN, A64FX, HBM2, Memory, Fugaku, Risk management, Cryptocurrency, Computer data storage, JMA, Fujitsu

TOKYO, Feb 27, 2023 - (JCN Newswire) - Fujitsu today announced that it provided a new supercomputer system to the Japan Meteorological Agency (hereinafter JMA) (1) for use in linear rainband forecasting.

Key Points: 
  • TOKYO, Feb 27, 2023 - (JCN Newswire) - Fujitsu today announced that it provided a new supercomputer system to the Japan Meteorological Agency (hereinafter JMA) (1) for use in linear rainband forecasting.
  • The new supercomputer system is able to predict the occurrence of linear rainbands (2) which can trigger heavy rain, leading to disasters like landslides and flooding.
  • The system is based on the "FUJITSU Supercomputer PRIMEHPC FX1000" (3) hardware, which features the same A64FX CPU as the supercomputer "Fugaku," jointly developed by RIKEN (4) and Fujitsu.
  • Reaching a theoretical peak performance of about 31.1 PFLOPS (5), the new system will help the JMA to significantly improve the accuracy of its forecasting of linear rainbands.

Apple unveils M2 Pro and M2 Max: next-generation chips for next-level workflows

Retrieved on: 
Tuesday, January 17, 2023
Software, Networks, Internet, Hardware, Data Management, Consumer Electronics, Technology, Semiconductor, Apple TV, Spotlight, IOS, IPad, Handover, IPadOS, Apple Pay, MacOS, Apple Inc., NVIDIA, FaceTime, Intel Core, CPU, ICloud, Macintosh, Quadro, Intel, Xcode, Silicon, TvOS, Adobe Photoshop, Multimedia, Life, Memory, MacBook Pro, Architecture, RAM, Running, Apple Music, SSD, Neural engineering, Indian Institute of Hardware Technology, L2, HEVC, Mac App Store, App store, 30 for 30, Computer, GPU, TB, Name, HBM2, Apple Watch, GDDR6, Apple ProRes, Carbon, MacBook, Socs, IPhone, Video game console, Computer data storage, Mobile phone, WatchOS, Apple, Mac

M2 Pro brings pro performance to Mac mini® for the first time, while M2 Pro and M2 Max take the game-changing performance and capabilities of the 14-inch and 16-inch MacBook Pro® even further.

Key Points: 
  • M2 Pro brings pro performance to Mac mini® for the first time, while M2 Pro and M2 Max take the game-changing performance and capabilities of the 14-inch and 16-inch MacBook Pro® even further.
  • View the full release here: https://www.businesswire.com/news/home/20230117005535/en/
    M2 Pro and M2 Max are next-generation chips that take the breakthrough power-efficient performance of Apple silicon to new heights.
  • (Graphic: Business Wire)
    “Only Apple is building SoCs like M2 Pro and M2 Max.
  • M2 Pro and M2 Max help the new MacBook Pro and Mac mini meet Apple’s high standards for energy efficiency.