Dynamic random-access memory

Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

Retrieved on: 
Wednesday, April 3, 2024
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The facility will also develop future generations of chips and house an advanced packaging R&D line.

Key Points: 
  • The facility will also develop future generations of chips and house an advanced packaging R&D line.
  • “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
  • “We believe this project will lay the foundation for a new Silicon Heartland; a semiconductor ecosystem centered in the Midwest Triangle.
  • The IEDC also committed up to $45 million through the Industrial Development Grant Fund to support infrastructure improvements surrounding the new plant.

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

Retrieved on: 
Wednesday, April 3, 2024
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"I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.

Key Points: 
  • "I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.
  • Senator Todd Young, a key advocate for the project, said, "SK hynix will soon be a household name in Indiana.
  • "SK hynix is the global pioneer and dominant market leader in memory chips for AI," Purdue University President Mung Chiang said.
  • It is also a monumental moment for completing the supply chain of digital economy in our country through chips advanced packaging.

Dynamic Random Access Memory (DRAM) Market to grow by USD 163.03 billion from 2022 to 2027, Growth Driven by Growth of smart cities- Technavio

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Sunday, September 24, 2023
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The potential growth difference for the dram market from 2022 to 2027 is USD 163.03 billion.

Key Points: 
  • The potential growth difference for the dram market from 2022 to 2027 is USD 163.03 billion.
  • The growth of smart cities is one of the key drivers supporting the growth of the dynamic random access memory market.
  • Get deeper insights into the market size, current market scenario, future growth opportunities, major growth driving factors, the latest trends, and more.
  • Buy the full report here
    Various upcoming and improved technologies that offer price benefits are one of the significant challenges restricting market growth.

Growth Opportunities in Wearables, Artificial Intelligence, Quantum Computing and 5G Communication: Featuring Chiplet Interconnects, Stroke Detection Wearables, Energy-Efficient ICs & More

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Wednesday, May 17, 2023
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DUBLIN, May 17, 2023 /PRNewswire/ -- The "Growth Opportunities in Wearables, Artificial Intelligence, Quantum Computing and 5G Communication" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, May 17, 2023 /PRNewswire/ -- The "Growth Opportunities in Wearables, Artificial Intelligence, Quantum Computing and 5G Communication" report has been added to ResearchAndMarkets.com's offering.
  • The Microelectronics Technology Opportunity Engine focuses on innovations related to hardware modules for space shuttles, flexible batteries for wearables, chiplet interconnects, stroke detection wearables, wearable rings for glucose monitoring, energy-efficient ICs, a processor for quantum computing, efficient FPGAs and DRAM, quantum computing hardware, power supply architecture for ICs, AI processors, GaN HEMT, and RF for 5G communication.
  • The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis.
  • Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables.

SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023

Retrieved on: 
Monday, December 26, 2022
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Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy.

Key Points: 
  • Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy.
  • SK hynix is confident that its products to be displayed at the CES 2023 will meet customers' such needs with outstanding performance per watt* and performance.
  • *HBM (High Bandwidth Memory): High-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.
  • SK hynix will also present the immersion cooling* technology of SK enmove, which specializes in energy efficiency.

SK hynix Develops MCR DIMM - World's Fastest Server Memory Module

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MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5.

Key Points: 
  • MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5.
  • SK hynix designed the product in a way that enables simultaneous operation of two ranks by utilizing the data buffer* installed onto the MCR DIMM based on Intel's MCR technology.
  • "SK hynix delivered another technological evolution for DDR5 by developing the world's fastest MCR DIMM," Ryu said.
  • SK hynix expects the market for the MCR DIMM to expand driven by high performance computing that will take advantage of the increased memory bandwidth.

SK hynix to Build M15X Fab in Cheongju

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Tuesday, September 6, 2022
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A total of 15 trillion won will be injected over the next five years to build the fab and set up production facilities.

Key Points: 
  • A total of 15 trillion won will be injected over the next five years to build the fab and set up production facilities.
  • The fab will be a two-story building equivalent to a combination of M11 and M12 in size.
  • SK hynix has so far solidified its leadership in the memory market through preemptive and bold investments despite rapid changes in business environment.
  • The plan to build the M15X comes as SK hynix prepares for the next upturn expected to come in 2025.

SK hynix Develops World's Highest 238-Layer 4D NAND Flash

Retrieved on: 
Tuesday, August 2, 2022
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World's first 238-layer 512Gb TLC 4D NAND developed in July; expected to begin mass production in the first half of 2023

Key Points: 
  • World's first 238-layer 512Gb TLC 4D NAND developed in July; expected to begin mass production in the first half of 2023
    Providing highest, smallest NAND product while remarkably improving productivity, data transfer speed and power efficiency
    SEOUL, South Korea, Aug. 2, 2022 /PRNewswire/ --SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has developed the industry's highest 238-layer NAND Flash product.
  • "SK hynix secured global top-tier competitiveness in perspective of cost, performance and quality by introducing the 238-layer product based on its 4D NAND technologies," said Jungdal Choi, Head of NAND Development at SK hynix in his keynote speech during the event.
  • * Flash Memory Summit (FMS): The world's biggest conference for NAND Flash industry taking place in Santa Clara every year.
  • Since development of the 96-layer NAND product in 2018, SK hynix has introduced a series of 4D products that outperform existing 3D products.

IPValue Management Affiliate Grants License to SK hynix to Patent Portfolio Acquired from Cypress Semiconductor

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Wednesday, June 22, 2022
Legal, Technology, Semiconductor, Patent Law, Engineering, Professional Services, Manufacturing, Hardware, Data Management, Consumer Electronics, ECC, SK, HBM, Patent, DRAM, TLC, LLL, Dynamic random-access memory, NVDIMM, MLC, Solid-state drive, Cypress Semiconductor, Infineon Technologies, IP, Samsung Electronics, SONOS, QLC, Computer data storage

IPValue Management, Inc. (IPValue) today announced that Longitude Licensing Ltd. (LLL) has granted SK hynix Inc. (SK hynix) a worldwide, non-exclusive patent license for the patent portfolio of Longitude Flash Memory Solutions, Ltd. (LFMS).

Key Points: 
  • IPValue Management, Inc. (IPValue) today announced that Longitude Licensing Ltd. (LLL) has granted SK hynix Inc. (SK hynix) a worldwide, non-exclusive patent license for the patent portfolio of Longitude Flash Memory Solutions, Ltd. (LFMS).
  • SK hynix is a top tier semiconductor supplier offering Dynamic Random Access Memory chips, Flash memory chips, CMOS Image Sensors, and SSDs for a wide range of distinguished customers globally.
  • We are pleased to have licensed the LFMS patent portfolio to SK hynix on mutually agreeable terms.
  • SK hynix follows other major semiconductor vendors, including Samsung Electronics, Co., Ltd. and Micron Technology, Inc., as a licensee of the LFMS patent portfolio.

SK hynix to Supply Industry's First HBM3 DRAM to NVIDIA

Retrieved on: 
Thursday, June 9, 2022
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Mass production of world's best-performing DRAM, HBM3, comes just seven months after development announcement

Key Points: 
  • Mass production of world's best-performing DRAM, HBM3, comes just seven months after development announcement
    SEOUL, South Korea, June 8, 2022 /PRNewswire/ --SK hynix Inc. (or "the company", www.skhynix.com ) announced that it began mass production of HBM3, the world's best-performing DRAM.
  • HBM3 DRAM is the 4th generation HBM product, succeeding HBM (1st generation), HBM2 (2nd generation) and HBM2E (3rd generation).
  • SK hynix will provide HBM3 for NVIDIA systems expected to ship starting in the third quarter of this year.
  • Kevin (Jongwon) Noh, president and chief marketing officer at SK hynix, states that the company has secured top-notch competitiveness in the premium DRAM market through its close work with NVIDIA.