Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach
Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA ( https://www.ofcconference.org/en-us/home/ ).
- Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA ( https://www.ofcconference.org/en-us/home/ ).
- The chiplet interconnect extends ultra-high density die-to-die (D2D) connections up to 10m at multi-Tbps/mm shoreline bandwidth density and class leading sub-pJ/bit energy efficiency.
- The LightBundle chiplet interconnect extends HBM and other ultra-high performance D2D connections up to 10m while dissipating
- “At Avicena, we are excited to announce our ultra-low power scalable chiplet interconnect based on our LightBundle platform,” says Bardia Pezeshki, Founder and CEO of Avicena.