LPDDR

Samsung Introduces Three New Logic Solutions to Power the Next Generation of Automobiles

Retrieved on: 
Tuesday, November 30, 2021
Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20211129005641/en/
    Samsung's newest logic chips for automotive applications.
  • The Exynos Auto V7 is the newest addition to Samsungs automotive-brand processor lineup and is designed for in-vehicle infotainment systems.
  • The S2VPS01 regulates and rectifies the flow of electrical power, allowing reliable and robust in-vehicle infotainment system performance.
  • The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions.

ISSI’s 4Gb DDR3 with On-chip ECC is now ASIL-B Certified

Retrieved on: 
Thursday, November 4, 2021

MILPITAS, Calif., Nov. 04, 2021 (GLOBE NEWSWIRE) -- ISSIs 4Gb DDR3 with on-chip ECC has been ASIL-B certified by SGS corporation.

Key Points: 
  • MILPITAS, Calif., Nov. 04, 2021 (GLOBE NEWSWIRE) -- ISSIs 4Gb DDR3 with on-chip ECC has been ASIL-B certified by SGS corporation.
  • The 4Gb DDR3 with on-chip ECC is now in mass production.
  • ISSI offers 4Gb DDR3 with on-chip ECC in x8 and x16 data widths.
  • This is where ISSI's 4Gb DDR3 with on-chip ECC comes in.

JEDEC Board Selects Samsung Memory Business President as Recipient of its 2022 Distinguished Executive Leadership Award

Retrieved on: 
Wednesday, November 3, 2021

The JEDEC Board of Directors passed a resolution yesterday at its November board meeting naming Jung-Bae Lee, Ph.D. and president of the Memory Business at Samsung Electronics, as the recipient of its Distinguished Executive Leadership Award for 2022.

Key Points: 
  • The JEDEC Board of Directors passed a resolution yesterday at its November board meeting naming Jung-Bae Lee, Ph.D. and president of the Memory Business at Samsung Electronics, as the recipient of its Distinguished Executive Leadership Award for 2022.
  • Jung-Bae Lee is one of the brightest minds in the semiconductor industry, said Desi Rhoden, Executive Vice President at Montage Technology and JEDEC Memory Committee Chair.
  • Dr. Lee is the ultimate example of the type of leader for which the JEDEC Distinguished Executive Leadership Award was created to honor and recognize.
  • As Samsungs memory business chief, Lee is now responsible for all of the companys memory products and technologies, worldwide.

Upgrading FORESEE nMCP (NAND-based MCP) to Promote Construction of the Global 5G Market

Retrieved on: 
Sunday, October 31, 2021

With this in mind, storage enterprises are increasingly tasking themselves with vigorous research and development of Multi-Chip Packaging (MCP) storage products.

Key Points: 
  • With this in mind, storage enterprises are increasingly tasking themselves with vigorous research and development of Multi-Chip Packaging (MCP) storage products.
  • In order to put the minds of industry customers at ease, he FORESEE R&D team has conducted rigorous standard testing on nMCP series products.
  • The FORESEE nMCP has passed strict reliability tests (such as HTOL and HTSL for three lots) in accordance with the JEDEC standard.
  • FORESEE will continue to provide industry customers with highly reliable storage products with diversified storage capacities.

Renesas Unveils Automotive Gateway Solution Based on New R-Car S4 SoCs and PMICs for Next-Generation Vehicle Computers

Retrieved on: 
Wednesday, October 6, 2021

The solution also dramatically improves development efficiency by enabling software reusability and including the new best-in-class PMICs designed to work seamlessly with the R-Car S4.

Key Points: 
  • The solution also dramatically improves development efficiency by enabling software reusability and including the new best-in-class PMICs designed to work seamlessly with the R-Car S4.
  • As an automotive market leader, we have addressed these challenges with our new R-Car S4 solution, and global OEMs have already begun to design next-generation systems with this solution.
  • The Renesas R-Car S4 is one of the first products in Renesas 4th-generation R-Car Family.
  • Renesas will provide the evaluation boards as a Winning Combination solution featuring the R-Car S4 device, the RAA271041 and RAA271005 PMICs, and a Renesas timing IC (Autoclock RC2121x).

SmartDV Provides Broad Portfolio of Memory Modeling, Design and Verification Solutions

Retrieved on: 
Tuesday, September 14, 2021

SAN JOSE, Calif., Sept. 14, 2021 (GLOBE NEWSWIRE) -- SmartDV Technologies , the leader in Design and Verification Intellectual Property (IP), today unveiled its broad portfolio of memory Design and Verification solutions including Memory Models, Verification IP and Design IP available for most memory types and derivatives.

Key Points: 
  • SAN JOSE, Calif., Sept. 14, 2021 (GLOBE NEWSWIRE) -- SmartDV Technologies , the leader in Design and Verification Intellectual Property (IP), today unveiled its broad portfolio of memory Design and Verification solutions including Memory Models, Verification IP and Design IP available for most memory types and derivatives.
  • The SmartDV portfolio provides memory controller Design IP for all derivatives of DDR, LPDDR and Flash and supports the DDR PHY Interface (DFI) specification.
  • SmartDV offers its memory models complete with a Memory Verification IP suite that incorporates the Controller Verification IP agent and Memory Model with its slave interface.
  • The SmartDV Controller Verification IP agent helps verify an actual memory DUT and the SmartDV Memory Model helps verifying a Memory Controller DUT.

FORESEE Embedded Storage: Propagating Smart Wearables

Retrieved on: 
Tuesday, August 10, 2021

Smart wearables integrate numerous technologies such as multimedia, sensing, identification, wireless communication and storage to provide user interaction, lifestyle and entertainment features, health monitoring and more.

Key Points: 
  • Smart wearables integrate numerous technologies such as multimedia, sensing, identification, wireless communication and storage to provide user interaction, lifestyle and entertainment features, health monitoring and more.
  • The rapid development of smart wearables can be attributed to the exhaustive progress and integration of the industrial chain.
  • Thanks to its continued investment in R&D, FORESEE (a Longsys brand focusing on industrial storage) has provided the smart wearable industry with two brilliant embedded storage solutions: ePOP and nMCP.
  • As a brand focusing on the development of core components for smart wearables, what marvelous things will FORESEE achieve in the future?

JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications

Retrieved on: 
Wednesday, July 28, 2021

JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-5B, Low Power Double Data Rate 5 (LPDDR5).

Key Points: 
  • JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-5B, Low Power Double Data Rate 5 (LPDDR5).
  • Taken together, LPDDR5 and LPDDR5X are designed to significantly boost memory speed and efficiency for a variety of uses including mobile devices, such as 5G smartphones and artificial intelligence (AI) applications.
  • Developed by JEDECs JC-42.6 Subcommittee for Low Power Memories, JESD209-5B is available for download from the JEDEC website .
  • LPDDR5Xs higher speed interface will open doors to new 5G and AI use cases, delivering better user experiences across memory-intensive applications such as gaming, photography and streaming media.

Alliance Memory 8Gb LPDDR4X SDRAM Offers ~50% Reduction in Power Consumption Compared to LPDDR4 Devices

Retrieved on: 
Wednesday, July 14, 2021

Offering an extension to the companys fourth-generation LPDDR4 SDRAMs, the 8Gb AS4C256M32MD4V-062BAN offers ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.

Key Points: 
  • Offering an extension to the companys fourth-generation LPDDR4 SDRAMs, the 8Gb AS4C256M32MD4V-062BAN offers ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.
  • Alliance Memorys LPDDR4X SDRAM provides a reliable drop-in, pin-for-pin-compatible replacement for numerous similar solutions in high-bandwidth, high-performance memory system applications eliminating the need for costly redesigns and part requalification.
  • Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets.
  • Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, and regional offices in Europe, Asia, Canada, and South America.

Faraday Announces LPDDR4/4X in Samsung 14LPC Process

Retrieved on: 
Tuesday, June 29, 2021

Faradays newly launched LPDDR4/4X solution, verified in conjunction with Faraday LPDDR4/4X Controller, is compliant with JEDEC standard and supports DFI 4.0.

Key Points: 
  • Faradays newly launched LPDDR4/4X solution, verified in conjunction with Faraday LPDDR4/4X Controller, is compliant with JEDEC standard and supports DFI 4.0.
  • We are pleased to launch the LPDDR4/4X solution in the highly cost-effective Samsung 14LPC process, said Flash Lin, COO of Faraday Technology.
  • Faraday has accumulated abundance of DDR3/4 and LPDDR3/4 success cases in nodes ranging from 55nm to 28nm across numerous applications.
  • Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certified to ISO 9001 and ISO 26262.