LPDDR

DFI Introduces QCS051 Industrial Motherboard

Retrieved on: 
Tuesday, April 9, 2024
Automation, HDMI, DFI, Temperature, Longevity, Qualcomm, M.2, Box, ESG, Power, AGV, RAM, AMR, LPDDR, Multimedia, Video game

TAIPEI, April 9, 2024 /PRNewswire/ -- DFI, the world's leading brand in embedded motherboards and industrial computers, today announced the launch of its latest innovation, the DFI QCS051 Industrial Motherboard, at Embedded World. Crafted to address the intricate needs of modern industrial automation, the QCS051 integrates the Qualcomm® QCS6490 processor, offering versatility for advanced applications such as Autonomous Mobile Robotics (AMR), Automated Guided Vehicles (AGV), and Box PCs.  Market analysis forecasts the burgeoning potential of AGVs and AMRs to soar to around $20 billion by 2028, accompanied by an anticipated installation base of 2.7 million robots. This surge is chiefly propelled by the logistics and manufacturing domains.

Key Points: 
  • TAIPEI, April 9, 2024 /PRNewswire/ -- DFI , the world's leading brand in embedded motherboards and industrial computers, today announced the launch of its latest innovation, the DFI QCS051 Industrial Motherboard, at Embedded World .
  • The QCS051 is a compact 2.5-inch Pico-ITX industrial motherboard designed for space-constrained environments, powered by the robust QCS6490 processor.
  • "In the era of integrating AI applications and emphasizing ESG sustainability, we proudly introduce the DFI QCS051 Industrial Motherboard powered by Qualcomm Technologies, offering balanced solutions with improved performance per watt.
  • "Powered by the QCS6490 processor, the QCS051 Industrial Motherboard represents a significant advancement in industrial automation technology," stated Dev Singh, vice president, business development and head of building, enterprise & industrial automation, Qualcomm Technologies, Inc. "We are proud to collaborate with DFI to deliver smarter, more efficient automation systems that empower businesses to thrive."

FORESEE Will Showcase Its Innovative Memory and Storage Solutions at Embedded World 2024

Retrieved on: 
Wednesday, April 3, 2024
UFS, SSD, Memory, SPI, DDR3L, SATA, NVM Express, Internet, Electronics, Research, DDR5, LPDDR5, Software design, MultiMediaCard, CXL, AI, Personal computer, Architecture, Cloud computing, Exhibition, Payment card, MCP, LPDDR

SHENZHEN, China, April 3, 2024 /PRNewswire/ -- The industry storage brand FORESEE under Longsys(301308.SZ) will showcase a full line up of innovative products and solutions at embedded world 2024, the highly anticipated embedded systems event in Nuremberg, Germany on April 9th.

Key Points: 
  • SHENZHEN, China, April 3, 2024 /PRNewswire/ -- The industry storage brand FORESEE under Longsys(301308.SZ) will showcase a full line up of innovative products and solutions at embedded world 2024, the highly anticipated embedded systems event in Nuremberg, Germany on April 9th.
  • In the micro-storage field, FORESEE will exhibit SPI NAND Flash, DDR3L, and NAND-based MCP (LPDDR4x), demonstrating its independent research and development capabilities in small-capacity storage solutions.
  • In the mobile memory sector, FORESEE will showcase industrial pSLC series microSD, industrial SD/microSD, and commercial EPLUS V30 series products.
  • With the unveiling of these advanced products and solutions, FORESEE has further strengthened its memory and storage lineup and bolstered its position in the memory market.

Introspect Technology Launches Protocol Analyzer to Accelerate Validating and Debugging of LPDDR5 and LPDDR5x Memory Interfaces

Retrieved on: 
Wednesday, January 31, 2024
Memory, DDR5, LPDDR, Pop, BERT, CPU, DUT, Introspection, Packaging and labeling, LPDDR5, DDR

SANTA CLARA, Calif., Jan. 31, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, a leading manufacturer of electronic test and measurement instruments for high-speed digital applications, proudly unveils the SV7M-LPDDR5PA Protocol Analyzer, a significant solution to advance validating and debugging of LPDDR5 and LPDDR5x memory interfaces. This release provides a complete toolkit performing true system level protocol analysis of DDR memory traffic, a radical departure from current industry convention.

Key Points: 
  • SANTA CLARA, Calif., Jan. 31, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, a leading manufacturer of electronic test and measurement instruments for high-speed digital applications, proudly unveils the SV7M-LPDDR5PA Protocol Analyzer , a significant solution to advance validating and debugging of LPDDR5 and LPDDR5x memory interfaces.
  • This release provides a complete toolkit performing true system level protocol analysis of DDR memory traffic, a radical departure from current industry convention.
  • "Built around the device under test (DUT) and deploying active probe technology, this protocol analyzer prioritizes in-place testing.
  • Visit Introspect Technology at DesignCon from January 31-February 1, 2024, at booth #960 for a live demo or, send an email to [email protected] .

Lexar Enterprise Will Showcase its Product Portfolio of OEM and Commercial Solutions at CES 2024

Retrieved on: 
Tuesday, January 9, 2024
Payment card, M.2, PCI Express, Lexar, M.2 SSD, OEM, LPDDR, Memory module, Msata, UFS, POS, USB, SSD, Medicine, Government, BGA, Ratio, Portable, SATA, Sale, U.2, Venetian, CMO, Solid-state drive, Television, Tablet, CES, MultiMediaCard, Education, Computer data storage

SAN JOSE, Calif., Jan. 9, 2024 /PRNewswire-PRWeb/ --

Key Points: 
  • Mobile Memory products that Lexar Enterprise will showcase include commercial and industrial grade microSD cards, SD cards, USB flash drives, and Portable SSDs.
  • Lexar Enterprise will also showcase their SSD lineup which includes SATA and PCIe drives in 2.5", U.2, mSATA, M.2, and BGA form factors.
  • "We are excited to bring the Lexar focus on quality, performance, compatibility, and reliability to our new Lexar Enterprise division and to share our portfolio of enterprise products at CES," said Joel Boquiren, CMO, Lexar Americas.
  • "Lexar Enterprise expands on this solid foundation by offering our broad product portfolio to the OEM market in the Americas, providing world-class solutions for a variety of memory- and data-intensive applications."

DEEPX Making High-Performance, Low-Power AI Servers A Reality with DX-H1 Launch at CES 2024

Retrieved on: 
Wednesday, December 20, 2023
Ecosystem, Attention, Computer, Booth, Component, Computer hardware, DX, AI, Internet, GPU, PCI Express, Carbon, CES, LPDDR, Graphics processing unit, HBM, Medical device

LAS VEGAS, Dec. 20, 2023 /PRNewswire/ -- DEEPX (CEO, Lokwon Kim), an original AI semiconductor technology company, is set to make waves at CES 2024 by introducing the DX-H1 — a cutting-edge PCIe card designed to accelerate AI server performance while reducing energy consumption. Honored with the CES 2024 Innovation Award in the Computer Hardware and Components category, DX-H1 is widely anticipated to attract significant attention as it leaves a notable impact on the high-performance AI server market during this global launch.

Key Points: 
  • To explore DX-H1's industry-leading power-to-performance efficiency, join DEEPX at Booth #8953, North Hall during CES 2024.
  • As an advanced AI inferential solution, DEEPX's DX-H1 prioritizes performance, power efficiency, and cost-effectiveness.
  • The AI server market relies on power-intensive GPUs, whose high energy consumption leads to substantial carbon emissions.
  • DEEPX: Advancing AI with high performance, low energy solutions
    DEEPX leads the market for low-power AI solutions, achieving the world's highest power-to-performance ratio through proprietary advancements in model efficiency.

MediaTek's New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones

Retrieved on: 
Wednesday, November 22, 2023
Cortex, FP16, MediaTek, LLM Communications, MCQ, Life, Architecture, APU, FPS, Multimedia, Algorithm, TSMC, CPU, SOC, Photography, Memory, INT, MC6, DORA, LPDDR, Temperature, 3GPP, Diffusion, Arm, Mobile phone, Video game, Internet service provider, Online shopping

DUBAI, UAE, Nov. 22, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.

Key Points: 
  • DUBAI, UAE, Nov. 22, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.
  • As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.
  • With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset.
  • "The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency."

MediaTek's New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones

Retrieved on: 
Wednesday, November 22, 2023
Cortex, FP16, MediaTek, LLM, MCQ, Life, Architecture, APU, FPS, Algorithm, TSMC, CPU, SOC, Photography, Memory, INT, MC6, DORA, LPDDR, Temperature, 3GPP, Diffusion, Arm, Mobile phone, Video game, Internet service provider

DUBAI, UAE, Nov. 22, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.

Key Points: 
  • DUBAI, UAE, Nov. 22, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.
  • As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.
  • With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset.
  • Dimensity 8300 will power 5G devices launching in the global market before the end of 2023.

MediaTek's New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones

Retrieved on: 
Tuesday, November 21, 2023
Cortex, FP16, MediaTek, LLM, MCQ, Life, Architecture, APU, FPS, Algorithm, TSMC, CPU, SOC, Photography, Memory, INT, MC6, DORA, LPDDR, Temperature, 3GPP, Diffusion, Arm, Mobile phone, Video game, Online shopping, Internet service provider

HSINCHU, Nov. 21, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones. As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.

Key Points: 
  • HSINCHU, Nov. 21, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.
  • As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.
  • With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset.
  • Dimensity 8300 will power 5G devices launching in the global market before the end of 2023.

Samsung Electronics’ Industry-First LPCAMM Ushers In Future of Memory Modules

Retrieved on: 
Tuesday, September 26, 2023
Semiconductor, Data Management, Consumer Electronics, Technology, Networks, Hardware, Data-rate units, Samsung Electronics, DRAM, Electronics, Samsung, Multimedia, PC, Apple Inc. v. Samsung Electronics Co., Personal computer, LPDDR, Intel, Ecosystem, TCO, Video game

Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed system verification through Intel’s platform.

Key Points: 
  • Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed system verification through Intel’s platform.
  • View the full release here: https://www.businesswire.com/news/home/20230926496109/en/
    Samsung has developed the industry’s first Low Power Compression Attached Memory Module (LPCAMM) form factors.
  • LPCAMM overcomes the shortcomings of both LPDDR and So-DIMMs, addressing the increased demand for more efficient yet compact devices.
  • LPCAMM offers a solution to these challenges, creating significant potential for it to become the solution of choice for future data centers and servers.

SK hynix Starts Mass Production of Industry's First 24GB LPDDR5X DRAM

Retrieved on: 
Friday, August 11, 2023
SK, OPPO, DRAM, Metal gate, Smartphone, Head, Internet of things, FHD, SK Hynix, PC, Marketing, Tablet, Internet, Joint Electronics Type Designation System, LPDDR5X, LPDDR, HPC, JEDEC, AI, HKMG, GB, Mobile phone, Cryptocurrency, Sintering

SK hynix, in January, developed LPDDR5T, which is an upgraded product of LPDDR5X prior to the development of the 8th generation LPDDR6, and is currently processing customer validation.

Key Points: 
  • SK hynix, in January, developed LPDDR5T, which is an upgraded product of LPDDR5X prior to the development of the 8th generation LPDDR6, and is currently processing customer validation.
  • "The company integrated the High-K Metal Gate (HKMG) process in the 24 GB LPDDR5X package, enabling the product to deliver outstanding power efficiency and performance," said SK hynix.
  • SK hynix had become the industry's first to integrate the process in mobile DRAM in Nov. 2022.
  • OPPO's latest flagship smartphone 'Oneplus Ace 2 Pro', which features SK hynix's 24GB LPDDR5X package, was launched on August 10th.