KGD

MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

Retrieved on: 
Thursday, February 1, 2024

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, today announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone.

Key Points: 
  • MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, today announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone.
  • The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables.
  • View the full release here: https://www.businesswire.com/news/home/20240201593558/en/
    MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP (Graphic: Business Wire)
    MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers.
  • Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption.

Winbond introduces the next generation 8Mb Serial Flash for edge devices in space constrained IoT applications

Retrieved on: 
Monday, June 19, 2023

"The Internet of Things is expanding to 50 billion connected devices by 2023," said Alan Niebel, president of WebFeet Research, an independent market-research firm.

Key Points: 
  • "The Internet of Things is expanding to 50 billion connected devices by 2023," said Alan Niebel, president of WebFeet Research, an independent market-research firm.
  • "Winbond's 3V 8Mb Serial Flash is suitable for both automotive and IoT segments.
  • Overall, IoT is poised to grow in this new connected world with all shipments of Serial Flash totaling 12.9B units worldwide by 2027".
  • The company has been supporting the requirements of customers using the 8Mb Serial Flash with the existing generation of W25QxxDV series for several years in applications including instrumentation, networking, PC, printer, automotive and gaming.

MaxLinear and ColorChip Announce Collaboration on a Complete Line of Optical and Active Electrical Interconnect Solutions

Retrieved on: 
Monday, March 6, 2023

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs that enable next generation fiber-optic modules for data center, metro, and wireless transport networks, and ColorChip , a leading supplier of optical transceivers, DACs, and active electrical cables, today announced the availability of a complete line of optical and electrical interconnect solutions for data center applications based on MaxLinear’s 5nm Keystone family of DSPs.

Key Points: 
  • MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs that enable next generation fiber-optic modules for data center, metro, and wireless transport networks, and ColorChip , a leading supplier of optical transceivers, DACs, and active electrical cables, today announced the availability of a complete line of optical and electrical interconnect solutions for data center applications based on MaxLinear’s 5nm Keystone family of DSPs.
  • View the full release here: https://www.businesswire.com/news/home/20230306005292/en/
    MaxLinear and ColorChip Announce Collaboration on a Complete Line of Optical and Active Electrical Interconnect Solutions (Graphic: Business Wire)
    By leveraging the high-performance, high-density, and industry leading power consumption of the Keystone 5nm IP, ColorChip believes it can offer customers a full line of 400G, 800G, and 1.6T solutions with best-in-class power consumption.
  • “We are now leveraging these capabilities to enable a broad range of optical and electrical interconnect solutions for our customers with best-in-class power consumption and performance.”
    “ColorChip has been a strong partner for MaxLinear, quickly building best-in-class solutions for our mutual customers,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear.
  • “Their broad range of manufacturing capabilities and technologies for both optical modules and electrical cable assembly make them an ideal partner for MaxLinear and our end customers, delivering a complete set of solutions for all interconnect needs.”
    Visit MaxLinear at OCF 2023 from March 7-9 at booth 2207 to learn more about these innovative, best-in-class solutions.

MaxLinear Announces Production Availability of 5nm Keystone 800G PAM4 DSP Solutions for Hyperscale Cloud Deployments

Retrieved on: 
Thursday, March 2, 2023

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, today announced the production availability of the Keystone family of DSPs, the industry’s first 5nm CMOS 800Gbps PAM4 DSP for hyperscale data center applications.

Key Points: 
  • MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, today announced the production availability of the Keystone family of DSPs, the industry’s first 5nm CMOS 800Gbps PAM4 DSP for hyperscale data center applications.
  • View the full release here: https://www.businesswire.com/news/home/20230302005368/en/
    MaxLinear Announces Production Availability of 5nm Keystone 800G PAM4 DSP Solutions for Hyperscale Cloud Deployments (Graphic: Business Wire)
    An ongoing surge in the use of cloud services to increase productivity and improve customer experiences underlies the growth of hyperscale data centers.
  • “The extremely low power consumption and small form factors of Keystone solutions enable both 7Watt 400G optical module designs and 13Watt 800G designs.
  • With the power advantages of 5nm CMOS technology, we are directly addressing our customers’ critical needs for low power, highly integrated, high performance interconnect solutions in next generation hyperscale cloud networks.”
    The Keystone 5nm DSP family has been designed to address both 400G and 800G applications.

Winbond joins UCIe Consortium to support high-performance chiplet interface standardisation

Retrieved on: 
Wednesday, February 15, 2023

TAICHUNG, Taiwan, Feb. 15, 2023 /PRNewswire/ -- Winbond has joined the UCIe™ (Universal Chiplet Interconnect Express™) Consortium, the industry Consortium dedicated to advancing UCIe technology.

Key Points: 
  • TAICHUNG, Taiwan, Feb. 15, 2023 /PRNewswire/ -- Winbond has joined the UCIe™ (Universal Chiplet Interconnect Express™) Consortium, the industry Consortium dedicated to advancing UCIe technology.
  • By joining the UCIe Consortium, Winbond supports interconnect standardization that simplifies system-on-chip (SoC) design and eases 2.5D/3D back-end-of-line (BEOL) assembly.
  • Winbond has been committed to providing the best product solution, and by joining the UCIe Consortium is positioned deliver standardized 3D DRAM and 2.5D/3D BEOL services to customers.
  • "We're excited to welcome Winbond to the UCIe Consortium," said Dr Debendra Das Sharma, Chairman UCIe Consortium.

Howard University Selects DC-Based Minority-Owned Firm and Nation's Largest African American Architecture Firm to Design Future Home of the Chadwick A. Boseman College of Fine Arts

Retrieved on: 
Tuesday, November 1, 2022

WASHINGTON, Nov. 1, 2022 /PRNewswire/ -- Howard University has chosen Washington D.C.-based KGD and national architecture firm Moody Nolan to serve as design partners for the future Center for Fine Arts and Communications, a new state-of-the-art academic facility that will house the Chadwick A. Boseman College of Fine Arts.

Key Points: 
  • These projects represent the University's evolving and innovative academic offerings," said Wayne A. I. Frederick, M.D., MBA, president of Howard University.
  • In addition to the Chadwick A. Boseman College of Fine Arts, the Center for Fine Arts & Communications will also be home to the Cathy Hughes School of Communications, Howard University's television and radio stations, WHUR/WHUT.
  • KGD and Moody Nolan's design for the project will further enhance academic excellence, inspire new knowledge and serve the Howard community.
  • visit www.kgdarchitecture.com
    Founded in 1867, Howard University is a private, research university that is comprised of 13 schools and colleges.

Diverse Design Teams Selected to Advance Howard University’s Capital Projects

Retrieved on: 
Wednesday, October 12, 2022

Notable for the substantial levels of diversity and alumni involvement among firm leadership and staff, the selected teams offer an array of local and national expertise to advance Howards major capital projects.

Key Points: 
  • Notable for the substantial levels of diversity and alumni involvement among firm leadership and staff, the selected teams offer an array of local and national expertise to advance Howards major capital projects.
  • These facilities are major components of the Universitys latest Campus Master Plan and will advance Howards educational mission.
  • For its design, Howard strategically selected a team composed of Perkins&Will, R. McGhee & Associates, and KDA.
  • Soon, Howard will announce critical support teams to advance these groundbreaking projects, including owners representation and pre-construction services.

Aehr Test Systems CEO to Present at the EU Power Semiconductor Executive Summit in Munich, Germany on September 19, 2022

Retrieved on: 
Wednesday, September 14, 2022

FREMONT, Calif., Sept. 14, 2022 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announcedthat President and CEO Gayn Erickson will be a speaker at the EU Power Semiconductor Executive Summit (EU PSES) taking place September 19-20, 2022 at the Hilton Munich Park in Munich, Germany.

Key Points: 
  • FREMONT, Calif., Sept. 14, 2022 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announcedthat President and CEO Gayn Erickson will be a speaker at the EU Power Semiconductor Executive Summit (EU PSES) taking place September 19-20, 2022 at the Hilton Munich Park in Munich, Germany.
  • The EU Power Semiconductor Executive Summit brings together power semiconductor professionals from around the globe, providing opportunities to learn from and engage with industry leaders.
  • Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in semiconductor devices in wafer level, singulated die, and package part form, and has installed over 2,500 systems worldwide.
  • For more information, please visit Aehr Test Systems website at www.aehr.com .

QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template

Retrieved on: 
Thursday, June 16, 2022

SAN JOSE, Calif., June 16, 2022 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, and eTopus, a leader in high speed, low latency, low power connectivity IP, today announced the industry's first disaggregated eFPGA-enabled chiplet template solution. Based on QuickLogic's Australis™ eFPGA IP Generator and industry-leading chiplet interfaces from eTopus, the template delivers unprecedented design flexibility and bandwidth for high performance applications.

Key Points: 
  • Based on QuickLogic's Australis eFPGA IP Generator and industry-leading chiplet interfaces from eTopus, the template delivers unprecedented design flexibility and bandwidth for high performance applications.
  • eFPGA LUT counts will start at 200K with additional functionality available in block RAM and Digital Signal Processing (DSP) blocks.
  • "We are very excited to support QuickLogic's dis-aggregated eFPGA chiplet template solution," said Harry Chan, CEO of eTopus.
  • The QuickLogic logo and QuickLogic are registered trademarks of QuickLogic Corporation.

AP Memory launches brand-new product series of 512Mb Ultra-High-Speed (UHS) and 32Mb Ultra-Low-Swing (ULS) PSRAM

Retrieved on: 
Monday, June 6, 2022

AP Memory rolls out AP351216C/AP351208, to further expand the density of AP Memory's UHS products series to 512Mb, and AP43208B, the industry's first ultra-low power 32Mb ULS product.

Key Points: 
  • AP Memory rolls out AP351216C/AP351208, to further expand the density of AP Memory's UHS products series to 512Mb, and AP43208B, the industry's first ultra-low power 32Mb ULS product.
  • AP Memory is the first in the industry to introduce UHS/ULS PSRAM memory.
  • AP Memory's UHS/ULS product series enable design simplification while meeting form factor constraints and upgrade system and function performance of compacted IoT applications.
  • To know more about the UHS/ULS product, please refer to www.apmemory.com
    AP Memory is a fabless DRAM and IP product company.