DRAM

Micron First to Enable Ecosystem Partners With the Fastest, Lowest Latency High-Capacity 128GB RDIMMs Using Monolithic 32Gb DRAM

Retrieved on: 
Thursday, November 9, 2023
EPYC, LP, DRAM, CXL, AMD, HPC, Micrometre, Artificial intelligence, Intel, Ecosystem, Micron Technology, JEDEC, AI, TSV, Microsoft COM+ IMDB, DDR5, Memory, Video game, Computer data storage

“Micron continues to enable improvements to the data center ecosystem with early access to our advanced technologies and support in the design and integration of leading-edge high-capacity memory solutions.”

Key Points: 
  • “Micron continues to enable improvements to the data center ecosystem with early access to our advanced technologies and support in the design and integration of leading-edge high-capacity memory solutions.”
    Micron’s 32Gb DDR5 memory solution uses innovative die architecture choices for leading array efficiency and the densest monolithic DRAM die.
  • Voltage domain and refresh management features help optimize the power delivery network providing much-needed energy efficiency improvements.
  • Additionally, the die-dimension aspect ratio was optimized to advance the manufacturing efficiency of the 32Gb high-capacity DRAM die.
  • Micron 32Gb-DRAM die enables future expansion of the memory portfolio with enhanced bandwidth and energy-efficient MCRDIMM and JEDEC standard MRDIMM products in 128GB, 256GB and higher capacity solutions.

FormFactor, Inc. Reports 2023 Third Quarter Results

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Wednesday, November 1, 2023
Sale, DRAM, Factor of safety, FORM, GAAP, Foundry, Environment, FRT, Growth, Overalls, Silicon, Security (finance), Bank

LIVERMORE, Calif., Nov. 01, 2023 (GLOBE NEWSWIRE) -- FormFactor, Inc. (Nasdaq: FORM) today announced its financial results for the third quarter of fiscal 2023 ended September 30, 2023.

Key Points: 
  • LIVERMORE, Calif., Nov. 01, 2023 (GLOBE NEWSWIRE) -- FormFactor, Inc. (Nasdaq: FORM) today announced its financial results for the third quarter of fiscal 2023 ended September 30, 2023.
  • Gross margin for the third quarter of fiscal 2023 was 40.4%, compared with 38.7% in the second quarter of fiscal 2023, and 34.4% in the third quarter of fiscal 2022.
  • On a non-GAAP basis, gross margin for the third quarter of fiscal 2023 was 41.8%, compared with 40.6% in the second quarter of fiscal 2023, and 39.0% in the third quarter of fiscal 2022.
  • GAAP net cash provided by operating activities for the third quarter of fiscal 2023 was $20.6 million, compared to $22.5 million for the second quarter of fiscal 2023, and $24.2 million for the third quarter of fiscal 2022.

Crucial Launches Lightning-Fast Gen4 Consumer NVMe SSDs for Gamers and Creators

Retrieved on: 
Tuesday, October 31, 2023
Online, PC, DRAM, PS5, TB, Cybook Gen3, Micrometre, NAND, Data-rate units, NVM Express, Gen4 Energy, Crucial, 3D NAND, Micron Technology, SSD, CPU, Library, DIY, TLC, Video game, Computer data storage

BOISE, Idaho, Oct. 31, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced the availability of the Crucial® T500 Gen4 NVMe® SSD as an expansion of its award-winning NVMe solid-state drive (SSD) portfolio .

Key Points: 
  • BOISE, Idaho, Oct. 31, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced the availability of the Crucial® T500 Gen4 NVMe® SSD as an expansion of its award-winning NVMe solid-state drive (SSD) portfolio .
  • The Crucial T500 SSD is a best-in-class PCIe® 4.0 NVMe drive, which leverages Micron’s advanced 232-layer 3D NAND technology with industry-leading NAND I/O speeds of 2.4 gigabytes per second (GB/s) and is engineered to improve performance for console and PC gamers, photo and video editors and content creators.
  • For more information on the Crucial T500 SSD, visit www.crucial.com/T500 .
  • Micron’s Crucial brand is uniquely able to connect millions of customers to the innovation and technology that Micron has been perfecting for more than four decades.

Global Memory Market Valued at $110.16 Billion in 2022 Set to Soar with a 19.54% CAGR from 2023 to 2028 - ResearchAndMarkets.com

Retrieved on: 
Friday, November 3, 2023
Technology, Hardware, Semiconductor, Data Management, Car, DRAM, Government, Micrometre, Artificial intelligence, Growth, COVID-19, Machine learning, SSD, Cloud computing, Investment, Memory, Compound annual growth rate, Samsung, Computer data storage

The global memory market, valued at $110.16 billion in 2022, is poised for significant growth, with a projected Compound Annual Growth Rate (CAGR) of 19.54% during the forecast period from 2023 to 2028.

Key Points: 
  • The global memory market, valued at $110.16 billion in 2022, is poised for significant growth, with a projected Compound Annual Growth Rate (CAGR) of 19.54% during the forecast period from 2023 to 2028.
  • The memory market is expected to experience a temporary decline in 2023 due to inflation and weakening demand in end markets, particularly those relying on consumer spending.
  • By Demand: The memory market is categorized based on the demand for DRAM and NAND memory.
  • Meanwhile, NAND memory demand continues to grow, with SSD NAND memory leading the market due to its high performance and durability.

Kingston Technology Remains Top DRAM Module Supplier for 2022

Retrieved on: 
Wednesday, November 1, 2023
Data Management, Consumer Electronics, Technology, IOT (Internet of Things), Wearables, Mobile Technology, Semiconductor, Telecommunications, Software, Internet, Mobile, Wireless, Hardware, USD, Yoy, Face, DRAM, Kingston Technology, Technology company, Multimedia, Retail

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has been ranked top third-party DRAM module supplier in the world, according to the latest rankings by revenue from analyst firm TrendForce.

Key Points: 
  • Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has been ranked top third-party DRAM module supplier in the world, according to the latest rankings by revenue from analyst firm TrendForce.
  • TrendForce states DRAM module sales in 2022 saw a 4.6% YoY decline across the industry.
  • View the full release here: https://www.businesswire.com/news/home/20231101657732/en/
    Kingston Technology tops 2022 DRAM supplier list for the 20th consecutive year.
  • “The 2022 findings from TrendForce reflect the company’s ongoing expansion and adaptability in the face of yet another demanding business year,” said Kristy Ernt, DRAM business manager, Kingston.

DRAM Dominates the Global Memory Market with Fastest CAGR, Fueled by Demand in High-Performance Computing, AI, and Mobile Devices

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Monday, November 6, 2023
Internet of things, Car, Intelligence, DRAM, Government, Micrometre, MRAM, Artificial intelligence, Growth, COVID-19, Machine learning, SSD, Cloud computing, HBM, Investment, Memory, Compound annual growth rate, Samsung, Tourism, Computer data storage, Video game

By Type: The global memory market is segmented into three types: DRAM, NAND, and Others.

Key Points: 
  • By Type: The global memory market is segmented into three types: DRAM, NAND, and Others.
  • By Demand: The memory market is categorized based on the demand for DRAM and NAND memory.
  • Meanwhile, NAND memory demand continues to grow, with SSD NAND memory leading the market due to its high performance and durability.
  • Growth Drivers: The global memory market is expected to thrive due to the transformative impact of 5G technology, driving the demand for memory components.

UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI

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Tuesday, October 31, 2023
Electronic Design Automation, Semiconductor, Technology, Other Technology, Artificial Intelligence, Internet, Hardware, Internet of things, Digital, 3D, Intelligence, DRAM, NYSE, United Microelectronics Corporation, TSV, Comprehensive, ASE, R&D, R, Growth, EDA, ASIC, OSAT, TWSE, CMOS, Silicon, AI, UMC, Memory, Logic, Video game, Cadence, Michael Faraday, Winbond

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.

Key Points: 
  • United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.
  • The W2W 3D IC project with partner collaboration targets edge AI applications – such as home and industrial IoT, security, and smart infrastructure – requiring mid-to-high range computing power, extensive and customizable memory modules, and relatively low power consumption.
  • “This project helps us collectively to improve customer time-to-market and sustain profitable growth through the integration technologies developed to accomplish application excellence in the AI era.”
    “With the continued proliferation of edge AI applications, 3D IC design is becoming increasingly crucial for our customers.
  • As the only EDA partner in this new project, we’re working closely with Faraday and UMC to enable 3D IC designs with the Cadence Integrity 3D-IC Platform.

Designing Chips with CHIPS: West Coast Pre-Silicon Summit to Convene Industry Leaders in San Diego

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Tuesday, October 31, 2023
APS, 3D, Irwin, Software, CHIPS and Science Act, DRAM, Policy, IBM Fellow, HBT, Ammunition Design Group, Government, DTCO, UC Berkeley College of Engineering, All-star, University of California, Berkeley, Commerce, Silicon–germanium, Indiana University–Purdue University Indianapolis, NDIA, European Chips Act, College, NAI, EDA, Purdue University, IEEE, Synopsys, UCLA, Mass communication specialist, Engineering education, IP, IBM, National Advanced Youth Leadership Experience, Distinguishing, Performance, Internet, SAN, Video game, Woman, Engineering, CHIPS, Qualcomm, Salicide

SAN DIEGO, Oct. 31, 2023 /PRNewswire/ -- On 3 November, 2023, the "Designing Chips with CHIPS: West Coast Pre-Silicon Summit" will gather influential minds in the chip design and packaging industry, along with key government policy makers, for a one-day, in-person summit at Irwin M Jacobs Qualcomm Hall in Qualcomm Headquarters, San Diego, California.

Key Points: 
  • SAN DIEGO, Oct. 31, 2023 /PRNewswire/ -- On 3 November, 2023, the "Designing Chips with CHIPS: West Coast Pre-Silicon Summit" will gather influential minds in the chip design and packaging industry, along with key government policy makers, for a one-day, in-person summit at Irwin M Jacobs Qualcomm Hall in Qualcomm Headquarters, San Diego, California.
  • The summit aims to provide industry leaders, particularly those involved in the computer chip manufacturing sector, with essential insights into how the CHIPS Act will impact their businesses.
  • We are thrilled to host this summit in Region 6 and our greater San Diego area."
  • To learn more about the "Designing Chips with CHIPS: West Coast Pre-Silicon Summit" and to register for this exclusive event, please visit https://chipdesign.ieeeusa.org/ .

Montage Technology Leads in Trial Production of 3rd-Gen DDR5 RCDs

Retrieved on: 
Friday, October 27, 2023
Sale, SPD, DRAM, Electronics, Silicon bandgap temperature sensor, Samsung Electronics, Multimedia, Intel, RCD, Ecosystem, CPU, VDD, Power management, Lead, AI, DDR5, Memory, Samsung, Mobile phone, Computer data storage, Video game, DDR4, Montage

The RCD03 marks a major advancement in Montage's continued role as an innovator driving rapid DDR5 developments. This chip achieves a 14.3% speed increase over the 2nd-gen DDR5 RCD and a 33.3% increase over the 1st--gen, making it one of the fastest DDR5 memory interface solutions available today.

Key Points: 
  • SHANGHAI, Oct. 27, 2023 /PRNewswire/ -- Montage Technology, a leading data processing and interconnect IC company, today announced it has taken the lead in trial production of the 3rd-generation DDR5 Registering Clock Driver (RCD03) designed for use in DDR5 RDIMMs.
  • With its blazingly fast 6400 MT/s data rate, the RCD03 sets a new bar for DDR5 memory performance in upcoming server platforms.
  • "We are proud to spearhead the production of DDR5 RCD03 and deliver cutting-edge RCD technology to the market.
  • Montage will continue to work closely with major CPU and DRAM manufacturers to propel DDR5 technology towards widespread application," said Stephen Tai, President at Montage Technology.

SK hynix Reports Third Quarter 2023 Financial Results

Retrieved on: 
Thursday, October 26, 2023
LPDDR5, HBM, Growth, NAND, DRAM, AI, SK, TSV, Investment, Silicon, DDR5, Lead, HBM3, Through-silicon via, Video game, Computer data storage

SEOUL, South Korea, Oct. 25, 2023 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) today reported the financial results for the third quarter ended September 30, 2023. The company recorded revenues of 9.066 trillion won, operating losses of 1.792 trillion won and net losses of 2.185 trillion won in the three-month period. The operating and net margins were a negative 20% and 24%, respectively.

Key Points: 
  • - Technical prowess, competitive products help expand revenues, narrow operating losses
    - DRAM turns around from two quarters of losses, helped by brisk sales of premium products
    SEOUL, South Korea, Oct. 25, 2023 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) today reported the financial results for the third quarter ended September 30, 2023.
  • SK hynix attributed the growth in sales to increased shipments of both DRAM and NAND and a rise in the average selling price.
  • To meet new demands, SK hynix plans to increase investments in high-value flagship products such as HBM, DDR5, and LPDDR5.
  • Kim Woohyun, the chief financial officer at SK hynix, said that the company has been consolidating its position as the key player in the future AI infrastructure with its leadership in the high-performance memory market.