DTCO

Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry’s Latest GAA Process Technology

Retrieved on: 
Tuesday, February 20, 2024
Data Management, Semiconductor, Technology, Nanotechnology, Mobile, Wireless, Artificial Intelligence, Hardware, Cortex, Head, Architecture, AI, Silicon, Gen, SVP, Samsung Electronics, Partnership, Growth, Samsung, GM, PPA, GAA, Synthetic media, Fin field-effect transistor, Arm, Electronics, DTCO, FET, CPU, Mobile phone

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology.

Key Points: 
  • Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology.
  • This initiative is built on years of partnership with millions of devices shipped with Arm CPU intellectual property (IP) on various process nodes offered by Samsung Foundry.
  • This collaboration sets the stage for a series of announcements and planned innovation between Samsung and Arm.
  • Through this collaboration, Samsung and Arm are accelerating access to the optimized implementation of the next generation Cortex-X CPU on Samsung’s latest GAA process technology, enabling the next generation of product innovations with industry leading performance.

Samsung Electronics Collaborates with Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry’s Latest GAA Process Technology

Retrieved on: 
Tuesday, February 20, 2024
Semiconductor, Hardware, Technology, Artificial Intelligence, Software, Cortex, Head, Architecture, AI, Silicon, Gen, SVP, Samsung Electronics, Partnership, Growth, Samsung, GM, PPA, GAA, Synthetic media, Fin field-effect transistor, Arm, Electronics, DTCO, FET, CPU, Mobile phone

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced a collaboration to deliver optimized next generation Arm® Cortex™-X CPU developed on Samsung Foundry’s latest Gate-All-Around (GAA) process technology.

Key Points: 
  • Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced a collaboration to deliver optimized next generation Arm® Cortex™-X CPU developed on Samsung Foundry’s latest Gate-All-Around (GAA) process technology.
  • This initiative is built on years of partnership with millions of devices shipped with Arm CPU intellectual property (IP) on various process nodes offered by Samsung Foundry.
  • This collaboration sets the stage for a series of announcements and planned innovation between Samsung and Arm.
  • Through this collaboration, Samsung and Arm are accelerating access to the optimized implementation of the next generation Cortex-X CPU on Samsung’s latest GAA process technology, enabling the next generation of product innovations with industry leading performance.

Designing Chips with CHIPS: West Coast Pre-Silicon Summit to Convene Industry Leaders in San Diego

Retrieved on: 
Tuesday, October 31, 2023
APS, 3D, Irwin, Software, CHIPS and Science Act, DRAM, Policy, IBM Fellow, HBT, Ammunition Design Group, Government, DTCO, UC Berkeley College of Engineering, All-star, University of California, Berkeley, Commerce, Silicon–germanium, Indiana University–Purdue University Indianapolis, NDIA, European Chips Act, College, NAI, EDA, Purdue University, IEEE, Synopsys, UCLA, Mass communication specialist, Engineering education, IP, IBM, National Advanced Youth Leadership Experience, Distinguishing, Performance, Internet, SAN, Video game, Woman, Engineering, CHIPS, Qualcomm, Salicide

SAN DIEGO, Oct. 31, 2023 /PRNewswire/ -- On 3 November, 2023, the "Designing Chips with CHIPS: West Coast Pre-Silicon Summit" will gather influential minds in the chip design and packaging industry, along with key government policy makers, for a one-day, in-person summit at Irwin M Jacobs Qualcomm Hall in Qualcomm Headquarters, San Diego, California.

Key Points: 
  • SAN DIEGO, Oct. 31, 2023 /PRNewswire/ -- On 3 November, 2023, the "Designing Chips with CHIPS: West Coast Pre-Silicon Summit" will gather influential minds in the chip design and packaging industry, along with key government policy makers, for a one-day, in-person summit at Irwin M Jacobs Qualcomm Hall in Qualcomm Headquarters, San Diego, California.
  • The summit aims to provide industry leaders, particularly those involved in the computer chip manufacturing sector, with essential insights into how the CHIPS Act will impact their businesses.
  • We are thrilled to host this summit in Region 6 and our greater San Diego area."
  • To learn more about the "Designing Chips with CHIPS: West Coast Pre-Silicon Summit" and to register for this exclusive event, please visit https://chipdesign.ieeeusa.org/ .

Primarius to Showcase DTCO-Enabled EDA Solutions at DAC Powered by Next-Generation SPICE and FastSPICE Technology

Retrieved on: 
Thursday, July 6, 2023
DRAM, SPICE, Flash, EDA, Ageing, AC, Design Automation Conference, Moscone Center, Device, SRAM, PDK, PCell, DTCO, Conference, DAC, Cassette tape, Mobile phone, Computer data storage

“Visitors to our DAC booth will see the breadth of solutions to ensure designers meet time-to-market windows and optimize their designs for better yield, power, performance and area,” remarks Dr. Lianfeng Yang, President at Primarius Technologies.

Key Points: 
  • “Visitors to our DAC booth will see the breadth of solutions to ensure designers meet time-to-market windows and optimize their designs for better yield, power, performance and area,” remarks Dr. Lianfeng Yang, President at Primarius Technologies.
  • NanoSpice X shows significant new improvements in large post-layout SPICE simulation for full-chip analog designs with complicated digital circuits where huge power and ground nets slowed SPICE simulation previously.
  • Both circuit analysis solutions offer comprehensive high-yield and signal integrity analysis, aging and EM/IR simulation and advanced circuit checking capabilities.
  • To arrange a meeting or demonstration of the Primarius Technologies product portfolio, send email to: [email protected] .

Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design

Retrieved on: 
Wednesday, April 12, 2023
Apps, Applications, Mobile, Wireless, Technology, Semiconductor, Software, Networks, Hardware, Electronic Design Automation, Data Management, Consumer Electronics, IDM, Heart, Arm, Internet of things, Intel, SOC, Multigate device, Internet, GAA, CPU, Socs, U.S, Silicon, PPAC, DTCO, Video game, EU

Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process.

Key Points: 
  • Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process.
  • This collaboration will enable a more balanced global supply chain for foundry customers working in mobile SoC design on Arm-based CPU cores.
  • IFS and Arm will undertake design technology co-optimization (DTCO), in which chip design and process technologies are optimized together to improve power, performance, area and cost (PPAC) for Arm cores targeting Intel 18A process technology.
  • IFS and Arm will develop a mobile reference design, allowing demonstration of the software and system knowledge for foundry customers.

Samsung Begins Chip Production Using 3nm Process Technology with GAA Architecture

Retrieved on: 
Thursday, June 30, 2022
Semiconductor, Hardware, Electronic Design Automation, Nanotechnology, Technology, Efficiency, Will Power (performer), DTCO, Design technology, Architecture, Apple Inc. v. Samsung Electronics Co., Samsung, Samsung Electronics, Electronics, IC, Gate, FinFET, Technology, Environment, PPA, Metal gate, Time, Leadership, GAA, Ansys, Nanowire, Multimedia, EUV, Semiconductor, Mobile phone, Synopsys

Samsung Electronics Co., Ltd., the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture.

Key Points: 
  • Samsung Electronics Co., Ltd., the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture.
  • View the full release here: https://www.businesswire.com/news/home/20220629005894/en/
    Samsung Foundry's begins chip production with 3nm GAA architecture.
  • Samsungs proprietary technology utilizes nanosheets with wider channels, which allow higher performance and greater energy efficiency compared to GAA technologies using nanowires with narrower channels.
  • Utilizing the 3nm GAA technology, Samsung will be able to adjust the channel width of the nanosheet in order to optimize power usage and performance to meet various customer needs.

Primarius Unveils Custom Design Environment, Circuit Simulation and Design Enablement Solutions at DAC

Retrieved on: 
Wednesday, June 29, 2022
Ageing, Design Automation Conference, DAC, DTCO, Nanocell, Noise, GLOBE, AC, SDEP, PCell, SPICE, Data analysis, Moscone Center, SAN, Bias, Library, Environment, Technology, Kurdistan, RTN, Organization, GUI, FS, Solution, EDA, PDK, Sigma, Conference, Algorithm, Mobile phone, Computer data storage

SAN JOSE, Calif., June 29, 2022 (GLOBE NEWSWIRE) -- Primarius Technologies will unveil its flexible and scalable design environment for custom memory and analog/mixed-signal IC design and new circuit simulation and design enablement solutions during the Design Automation Conference (DAC) July 11-13 at Moscone Center in San Francisco.

Key Points: 
  • SAN JOSE, Calif., June 29, 2022 (GLOBE NEWSWIRE) -- Primarius Technologies will unveil its flexible and scalable design environment for custom memory and analog/mixed-signal IC design and new circuit simulation and design enablement solutions during the Design Automation Conference (DAC) July 11-13 at Moscone Center in San Francisco.
  • Primarius is committed to delivering innovative data-driven design technology co-optimization (DTCO) EDA solutions powered by leading-edge SPICE/FastSPICE simulation technologies, shortening time to market and improving yield, power, performance and area of circuit designs at advanced process nodes.
  • Its DTCO solutions such as SDEP, PCellLab, NanoCell and FS-Pro reduce the iteration cycle from process technology development to IC design for models, PDKs and standard cell development products available from Primarius.
  • It integrates with NanoSpice, Primarius circuit simulator series that offer the full spectrum of circuit simulation capabilities including high-performance parallel SPICE to an adaptive dual-simulation engine FastSPICE.

Samsung Foundry Adopts Primarius’ SDEP to Shorten SPICE Model Development Turnaround Time

Retrieved on: 
Tuesday, June 14, 2022
SDEP, Data analysis, Conference, EDA, Moscone Center, CEO, IC, Algorithm, DAC, DTCO, Organization, Solution, Samsung, Samsung Electronics, GLOBE, Technology, Adoption, SPICE, SAN, PDK, Efficiency, Engineering, Design Automation Conference, Mobile phone

SAN JOSE, Calif., June 14, 2022 (GLOBE NEWSWIRE) -- Primarius Technologies today announced its SDEP intelligent spec-driven model extraction platform has been adopted by Samsung Foundry.

Key Points: 
  • SAN JOSE, Calif., June 14, 2022 (GLOBE NEWSWIRE) -- Primarius Technologies today announced its SDEP intelligent spec-driven model extraction platform has been adopted by Samsung Foundry.
  • SDEP helps Samsung Foundry and its customers significantly shorten turnaround time for SPICE model development, accelerating development competitiveness at legacy nodes, and enabling fast Design Technology Co-Optimization (DTCO) iterations at advanced process nodes.
  • With a SDEP setup, we can provide high-quality SPICE model and meet increasing customer demands with our available engineering resources.
  • Each variety of a process platform requires a dedicated effort on SPICE model development and foundries see more model development requests than previous generations.

Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors

Retrieved on: 
Thursday, April 21, 2022
EBeam, AP, IMS, ALD, Applied Materials, GLOBE, Goal, Engineering, Technology, Plasma, Nasdaq, DTCO, Solution, General manager, 3D, EUV, Device file, AMAT, Memory, Industry, Senior, DRAM, GAA, 3D printing, Video game console, Electronic component, Printed circuit board, FinFET

SANTA CLARA, Calif., April 21, 2022 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced innovations that help customers continue 2D scaling with EUV and detailed the industrys broadest portfolio of technologies for manufacturing next-generation 3D Gate-All-Around transistors.

Key Points: 
  • SANTA CLARA, Calif., April 21, 2022 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced innovations that help customers continue 2D scaling with EUV and detailed the industrys broadest portfolio of technologies for manufacturing next-generation 3D Gate-All-Around transistors.
  • One is classic Moores Law 2D scaling, creating smaller features using EUV lithography and materials engineering.
  • Today, Applied is introducing the Stensar Advanced Patterning Film for EUV which is deposited using Applieds Precision CVD (chemical vapor deposition) system.
  • The emerging GAA transistor exemplifies how customers can supplement 2D scaling with 3D design techniques and DTCO layout innovations to rapidly increase logic density even as 2D scaling slows.

ITRI's VLSI-TSA and VLSI-DAT Symposia will Kick Off in April 2022

Retrieved on: 
Wednesday, December 22, 2021
Online, Microsoft, Technology, Silicon, DTCO, Assembly, Multilateralism, University of California, Berkeley, Stanford University, MRAM, Industrial Technology Research Institute, MediaTek, Design Automation and Test in Europe, IBM, Library, General manager, Industry, University, SR, Gallium nitride, VLSI, Silicon carbide, UMC, ITRI, Intel, Mitsubishi Electric, Align Technology, Student, Silicon photonics, IC, Business, Ambassador Hotel Hsinchu, Research, Winbond, Multimedia, IBM Research, European Technology Platform on Smart Systems Integration, Department of Sustainability, Environment, Water, Population and Communities, Electronics, VLSI Technology, TSMC, Automation, Medical device, Online shopping, AI

The VLSI-TSA and VLSI-DAT symposia were first held in 1983, hosting premiere conferences in semiconductor-related fields and attracting up to 1,000 participants every year.

Key Points: 
  • The VLSI-TSA and VLSI-DAT symposia were first held in 1983, hosting premiere conferences in semiconductor-related fields and attracting up to 1,000 participants every year.
  • The 2022 VLSI-TSA and VLSI-DAT symposia are planned as hybrid events, incorporating an in-person conference and a virtual platform with live sessions and on-demand video presentations.
  • The in-person symposia will be held on April 18-21, 2022 at the Ambassador Hotel Hsinchu, Taiwan.
  • Following the physical event, there will be virtual symposia providing online access to on-demand video presentations from April 25 to May 24, 2022.