DDR4

Octavo Systems Unveils the OSD32MP2 Series: Revolutionizing System Design in the Electronics Industry

Retrieved on: 
Tuesday, April 9, 2024
Cortex, SIP, Arm, Automation, GPU, Memory, DDR4, Electronics, Vulkan, API, ARM architecture family, Family, STMicroelectronics, EEPROM, Mobile phone

NUREMBERG, Germany, April 9, 2024 /PRNewswire/ -- Octavo Systems , a leader in system integration technology, proudly announces the launch of its OSD32MP2 family , featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM .

Key Points: 
  • NUREMBERG, Germany, April 9, 2024 /PRNewswire/ -- Octavo Systems , a leader in system integration technology, proudly announces the launch of its OSD32MP2 family , featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM .
  • The OSD32MP2 family caters to a diverse range of applications, from industrial automation to consumer electronics, offering unparalleled processing power, connectivity, and security features.
  • "Octavo Systems is committed to empowering electronics design engineers by simplifying the complexities of modern electronic design," said Harley Walsh, President of Octavo Systems.
  • For additional information, including detailed specifications and ordering details, please visit https://octavosystems.com or contact Octavo Systems at [email protected] .

SMART Modular Technologies Introduces Zefr ZDIMM Memory Modules with Ultra-High Reliability for Demanding Compute Applications

Retrieved on: 
Tuesday, March 26, 2024
Apps, Applications, Technology, Semiconductor, Security, Other Technology, Software, Internet, Hardware, Electronic Design Automation, Data Management, SGH, DRAM, DDR4, HPC, DDR5, Multimedia, SMART

SMART Modular Technologies, Inc. (“SMART”) , a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products, introduces its ultra-high reliability memory solution, Zefr™ ZDIMM™ memory modules.

Key Points: 
  • SMART Modular Technologies, Inc. (“SMART”) , a division of SGH (Nasdaq: SGH ) and a global leader in memory solutions, solid-state drives, and hybrid storage products, introduces its ultra-high reliability memory solution, Zefr™ ZDIMM™ memory modules.
  • View the full release here: https://www.businesswire.com/news/home/20240326690949/en/
    SMART Modular’s Zefr ZDIMM ultra-high reliability memory modules are ideally suited for data centers, hyperscalers, high performance computing (HPC) platforms and other environments that run large memory applications.
  • ZDIMM modules undergo a screening process that replicates real-world conditions which ensures the robustness and resilience of ZDIMM modules in the most demanding computing scenarios.
  • Zefr, ZDIMM, the stylized “S” and “SMART” as well as “SMART Modular Technologies” are trademarks or registered trademarks of SMART Modular Technologies, Inc. All other trademarks and registered trademarks are the properties of their respective owners.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

TECNO Introduces Two Mini PC Models at MWC24 Barcelona, Showcasing MEGA MINI Gaming G1 as the Industry's Smallest Water-Cooled Gaming Mini PC Redefining Standards

Retrieved on: 
Wednesday, February 28, 2024
Intel, Wi-Fi 6, Multimedia, Mobile, Nettop, MWC, DDR4, DDR5, MEGA, M1, Intel Turbo Boost, Graphics processing unit, Thunderbolt (interface), Ultra, PCI, Central processing unit, Video game

TECNO has Introducing the MEGA MINI Gaming G1 from TECNO - the world's first smallest Water-Cooling Gaming Mini PC with a dedicated graphics card.

Key Points: 
  • TECNO has Introducing the MEGA MINI Gaming G1 from TECNO - the world's first smallest Water-Cooling Gaming Mini PC with a dedicated graphics card.
  • The MEGA MINI Gaming G1 is cutting-edge hardware and cooling system design by integrating the latest generation of gaming CPUs and powerful dedicated GPUs.
  • It empowered by Intel®Core™ Ultra processor and also optional with 13th I9-13900H high-performance gaming processor, with Turbo Boost reaching up to 5.4GHz.
  • The MEGA MINI Gaming G1 is also designed with metal body with dazzling lights, very attractive by game users.

TECNO Introduces Two Mini PC Models at MWC24 Barcelona, Showcasing MEGA MINI Gaming G1 as the Industry's Smallest Water-Cooled Gaming Mini PC Redefining Standards

Retrieved on: 
Wednesday, February 28, 2024
Intel, Wi-Fi 6, Mobile, Nettop, MWC, DDR4, DDR5, MEGA, M1, Intel Turbo Boost, Graphics processing unit, Thunderbolt (interface), Ultra, PCI, Central processing unit, Video game

TECNO has Introducing the MEGA MINI Gaming G1 from TECNO - the world's first smallest Water-Cooling Gaming Mini PC with a dedicated graphics card.

Key Points: 
  • TECNO has Introducing the MEGA MINI Gaming G1 from TECNO - the world's first smallest Water-Cooling Gaming Mini PC with a dedicated graphics card.
  • The MEGA MINI Gaming G1 is cutting-edge hardware and cooling system design by integrating the latest generation of gaming CPUs and powerful dedicated GPUs.
  • It empowered by Intel®Core™ Ultra processor and also optional with 13th I9-13900H high-performance gaming processor, with Turbo Boost reaching up to 5.4GHz.
  • The MEGA MINI Gaming G1 is also designed with metal body with dazzling lights, very attractive by game users.

Ram BOP Industry Research Report 2024: A $31.58 Billion Market in 2023 - Global Industry Size, Share, Trends, Opportunities, & Forecasts 2019-2029

Retrieved on: 
Friday, February 23, 2024
Cloud, Intel, Random-access memory, USD, Artificial intelligence, Traction, Ram, Internet, BOP, Growth, DDR4, DDR5, NVRAM, 3D XPoint, DDR, Virtual reality, Memory, Augmented reality, DRAM, Cloud computing, VR, Micrometre, Research, RAM, Computer data storage

DUBLIN, Feb. 22, 2024 /PRNewswire/ -- The "Ram BOP Market - Global Industry Size, Share, Trends, Opportunity, & Forecast 2019-2029" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Feb. 22, 2024 /PRNewswire/ -- The "Ram BOP Market - Global Industry Size, Share, Trends, Opportunity, & Forecast 2019-2029" report has been added to ResearchAndMarkets.com's offering.
  • The global Ram BOP market is experiencing a significant boost due to the escalating demand for smartphones and electronic devices.
  • Technological advancements and continuous innovation in the field of memory storage technologies serve as a key driver for the global RAM BOP market.
  • Company Profiles: Detailed analysis of the major companies present in the Global Ram BOP Market.

Senao Networks Unveils SX904 SmartNIC: A Breakthrough in High-Performance Networking

Retrieved on: 
Thursday, February 22, 2024
ECC, PCI Express, Intel, Security, NIC, Senao Networks, Skylake (microarchitecture), MWC, DDR4, Xeon, BMC, Information technology

TAIPEI, Taiwan, Feb. 22, 2024 /PRNewswire/ -- Senao Networks, a leading network solution provider, proudly announces its launch of SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design. This cutting-edge NIC, harnessing the power of PCIe Gen4 technology and fueled by the Intel XeonD processor, sets an unprecedented standard in high-performance network computing. Senao will showcase a system demonstration at the Intel booth during the upcoming MWC in Barcelona, 26th to 29th of February, 2024.

Key Points: 
  • In collaboration with Intel, Senao Networks introduce SX904 SmartNIC, redefining industry benchmarks and a paradigm shift in high-performance network computing.
  • TAIPEI, Taiwan, Feb. 22, 2024 /PRNewswire/ -- Senao Networks, a leading network solution provider, proudly announces its launch of SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design.
  • Senao will showcase a system demonstration at the Intel booth during the upcoming MWC in Barcelona, 26th to 29th of February, 2024.
  • "Senao Networks is proud to introduce the groundbreaking SX904 SmartNIC, setting a new standard in high-performance networking.

Hitek Systems Introduces Agilex® 7 SoC FPGA-Based Radio Development Platform

Retrieved on: 
Thursday, February 15, 2024
Workload, LTE, Intel, Mobile, TI, DDR4, RAN, Radio, IEEE 1588, Documentation, System, Mobile World Congress, Esom, 3GPP, Memory, Radio access network, Kyōto Station, FMC, Ecosystem, SOC, RF, IEEE, DPD, Video game

GERMANTOWN, Md., Feb. 15, 2024 /PRNewswire-PRWeb/ -- Hitek Systems today introduced a new Hitek eSOM7C development platform designed to ease the design and deployment of Intel-based Open Radio Access Network (RAN) architectures (O-RAN) for LTE, 5G and other wireless communications systems, while increasing system interoperability and performance.

Key Points: 
  • Hitek Systems today introduced a new Hitek eSOM7C development platform designed to ease the design and deployment of Intel-based Open Radio Access Network (RAN) architectures (O-RAN) for LTE, 5G and other wireless communications systems, while increasing system interoperability and performance.
  • GERMANTOWN, Md., Feb. 15, 2024 /PRNewswire-PRWeb/ -- Hitek Systems today introduced a new Hitek eSOM7C development platform designed to ease the design and deployment of Intel-based Open Radio Access Network (RAN) architectures (O-RAN) for LTE, 5G and other wireless communications systems, while increasing system interoperability and performance.
  • The new ESOM7C development platform incorporates TI's AFE7769D into Hitek's Intel Agilex® 7 SoC FPGA embedded system on module (eSOM7C) development platform to provide efficient conversion of baseband data into RF signals for single-, dual- and even tri-band wireless systems.
  • "Hitek Systems created the new development platform to help streamline system integration and interoperability to enable more adaptable flexible radio access networks, while enhancing any system integrator's choices, capabilities and time to market" said Tariq Muhammad, President Hitek Systems.

Dynabook Elevates Hybrid Learning with Dynabook E11 Series Windows 11 Pro Laptops for K-12 Education

Retrieved on: 
Thursday, February 1, 2024
DDR4, Education, Memory, E11, UXGA, IPS, E10, Wi-Fi 6, LAN, Microsoft Teams, USB, Table tennis rubber, Microsoft, LPDDR5, HD, Windows Ink, ChromeOS, Student, Microsoft Intune

IRVINE, Calif., Feb. 1, 2024 /PRNewswire/ -- Dynabook Americas, Inc., the gold standard for long-lasting, professional-grade laptops, today unveiled the Dynabook E11 Series of 11.6-inch Windows 11 Pro laptops specifically engineered for education. Available in two form factors, traditional clamshell and versatile 2-in-1 convertible, E11 Series laptops provide schools an affordable yet flexible solution for modern curriculum and hybrid learning.

Key Points: 
  • Available for pre-order March 1, 2024, Dynabook E11 laptops are available in traditional clamshell and flexible 2-in-1 convertible configurations
    IRVINE, Calif., Feb. 1, 2024 /PRNewswire/ -- Dynabook Americas, Inc. , the gold standard for long-lasting, professional-grade laptops, today unveiled the Dynabook E11 Series of 11.6-inch Windows 11 Pro laptops specifically engineered for education.
  • Available in two form factors, traditional clamshell and versatile 2-in-1 convertible, E11 Series laptops provide schools an affordable yet flexible solution for modern curriculum and hybrid learning.
  • Windows 11 Pro Education seamlessly runs locally installed and web apps, making it ideal for remote or classroom learning.
  • To order or learn more about the new E11 education laptops from Dynabook, please contact your authorized Dynabook dealer, or visit us.dynabook.com .

Cincoze Slim Embedded Computers—Demonstrating the Power of One Computer / Two Purposes

Retrieved on: 
Thursday, January 18, 2024
Mobile, Wireless, Hardware, Electronic Design Automation, Data Management, Public Transport, Technology, Other Manufacturing, Other Transport, Engineering, Transport, Other Technology, Manufacturing, EN, PCI Express, Power over Ethernet, Mini, KIOSK, Multimedia, Vibration, Attention, IGN, Computer, Communication, HMI, DDR4, Personal computer, System, EMC, CPU, DDR5, CDS, Intel, Gigabit Ethernet, COM, Printed circuit board

Rugged embedded computing brand – Cincoze continues to deepen its embedded computer range.

Key Points: 
  • Rugged embedded computing brand – Cincoze continues to deepen its embedded computer range.
  • Among their striking designs, the One Computer / Two Purposes function has attracted particular attention.
  • They are not only slim embedded computers but, through the patented CDS (Convertible Display System, Patent no.
  • View the full release here: https://www.businesswire.com/news/home/20240118852490/en/
    Cincoze Slim Embedded Computers—Demonstrating the Power of One Computer / Two Purposes (Photo: Business Wire)
    The P2202 series includes two models: P2202 and P2202E with PCIe expansion.