United Microelectronics Corporation

Colley Hwang: Taiwan-Japan best match in semiconductor synergy

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Monday, February 19, 2024
IDM, Huang, TSMC, ICT, Sony, Internet, Intel, Compal, Multimedia, United Microelectronics Corporation, Car, Research, Nintendo, Health, Dell, Electronics, Plant, Denso, Samsung, Foxconn, Delta Electronics, HP, Gartner, Risk, Communication, UMC, Pegatron, Apple, Interview, Software, Parity, LG, Hyundai, Video game

In an interview, DIGITIMES President Colley Hwang, a seasoned expert and consultant in the semiconductor industry, stated that the semiconductor industry is undergoing structural changes.

Key Points: 
  • In an interview, DIGITIMES President Colley Hwang, a seasoned expert and consultant in the semiconductor industry, stated that the semiconductor industry is undergoing structural changes.
  • TSMC (Taiwan Semiconductor Manufacturing Company) recently announced its investment plan for the Kumamoto Fab 2 plant, collaborating with local companies like Sony, Denso, and Toyota.
  • Hwang emphasized the compatibility between Taiwan and Japan and highlighted Japan's dominance in semiconductor materials and equipment, accounting for 52% and 36% of the global market share, respectively.
  • Therefore, the best approach is a highly integrated collaboration between Southeast Asian/South Asian countries and East Asian traditional production systems.

Intel and UMC Announce New Foundry Collaboration

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Thursday, January 25, 2024
Electronic Design Automation, Semiconductor, Engineering, Technology, Manufacturing, Hardware, Intel, Credit, Multimedia, Process, INTC, History, Ecosystem, Communication, PDK, Investment, UMC, United Microelectronics Corporation, Process design kit

(Credit: Intel Corporation)

Key Points: 
  • (Credit: Intel Corporation)
    “Taiwan has been a critical part of the Asian and global semiconductor and broader technology ecosystem for decades, and Intel is committed to collaborating with innovative companies in Taiwan, such as UMC, to help better serve global customers,” said Stuart Pann, Intel senior vice president and general manager of Intel Foundry Services (IFS).
  • IFS has made significant progress over the past year, building strong momentum with new customers, including new customers across the Intel 16, Intel 3 and Intel 18A process technologies, and expanding its growing foundry ecosystem.
  • UMC has a more than 40-year history of being a preferred supplier of foundry services to critical applications including automotive, industrial, display and communications.
  • UMC is a significant supplier to the top 400+ semiconductor customers and has extensive expertise and know-how in supporting customers to reach high yields while maintaining industry-leading foundry utilization.

UMC Recognized for ESG Strength With DJSI World & Emerging Markets Index and MSCI-ESG AA Rating

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Monday, December 11, 2023
Electronic Design Automation, Professional Services, Semiconductor, Environmental, Social and Governance (ESG), Technology, Telecommunications, Mobile, Wireless, MSCI, United Microelectronics Corporation, Carbon, NYSE, Policy, Science, AA, DJSI, Ethics, Dow Jones, TWSE, Science Based Targets initiative, RE100, Growth, UMC, Chief sustainability officer, Emerging market, ESG

Meanwhile, UMC maintained its position as a constituent stock of the DJSI-Emerging Markets.

Key Points: 
  • Meanwhile, UMC maintained its position as a constituent stock of the DJSI-Emerging Markets.
  • UMC also achieved a remarkable AA rating in the MSCI ESG Ratings.
  • In addition, this year UMC has achieved an AA rating in the MSCI ESG ratings.
  • UMC has also consistently been selected as a component of the MSCI ACWI ESG Leaders Index and the Emerging Markets ESG Leaders Index.

MediaTek's Chairman Ming-Kai Tsai Awarded Prestigious IEEE Robert N. Noyce Medal

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Wednesday, November 29, 2023
National Chiao Tung University, IEEE, MediaTek, United Microelectronics Corporation, Research, STEM, National Tsing Hua University, University, ITRI, Industrial Technology Research Institute, CEDA, Electronics, Electrical engineering, College, Semiconductor, Nobel Prize, Former, Culture, Computer science, MSEE, TSMC, BSEE, IC, Electronic, UMC, National Taiwan University, Pleasure, Video game, Boston

HSINCHU, Nov. 28, 2023 /PRNewswire/ -- MediaTek today announced its chairman Ming-Kai Tsai has been awarded the IEEE Robert N. Noyce Medal, one of the most prestigious awards in the electronics industry. Chairman Tsai was recognized for his vision and leadership in the global semiconductor industry, democratizing technology access for billions of people. The award will be presented to Tsai in-person at the IEEE Honors Ceremony, which will be held May 3, 2024 in Boston.

Key Points: 
  • HSINCHU, Nov. 28, 2023 /PRNewswire/ -- MediaTek today announced its chairman Ming-Kai Tsai has been awarded the IEEE Robert N. Noyce Medal, one of the most prestigious awards in the electronics industry.
  • Chairman Tsai was recognized for his vision and leadership in the global semiconductor industry, democratizing technology access for billions of people.
  • The award will be presented to Tsai in-person at the IEEE Honors Ceremony, which will be held May 3, 2024 in Boston.
  • " IEEE Robert N. Noyce Medal is an extremely important award, holding a special place in the global semiconductor industry.

UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI

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Tuesday, October 31, 2023
Electronic Design Automation, Semiconductor, Technology, Other Technology, Artificial Intelligence, Internet, Hardware, Internet of things, Digital, 3D, Intelligence, DRAM, NYSE, United Microelectronics Corporation, TSV, Comprehensive, ASE, R&D, R, Growth, EDA, ASIC, OSAT, TWSE, CMOS, Silicon, AI, UMC, Memory, Logic, Video game, Cadence, Michael Faraday, Winbond

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.

Key Points: 
  • United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.
  • The W2W 3D IC project with partner collaboration targets edge AI applications – such as home and industrial IoT, security, and smart infrastructure – requiring mid-to-high range computing power, extensive and customizable memory modules, and relatively low power consumption.
  • “This project helps us collectively to improve customer time-to-market and sustain profitable growth through the integration technologies developed to accomplish application excellence in the AI era.”
    “With the continued proliferation of edge AI applications, 3D IC design is becoming increasingly crucial for our customers.
  • As the only EDA partner in this new project, we’re working closely with Faraday and UMC to enable 3D IC designs with the Cadence Integrity 3D-IC Platform.

3D Stacking Market worth $3.1 billion by 2028 - Exclusive Report by MarketsandMarkets™

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Monday, October 2, 2023
Chemical control, SK, Electronics, TSV, Gas Control Equipment Ltd, College of Engineering (KNUST), TSV Kottern, Dram, AMD, IC, TSMC, TGV, ICS, Automation, Intel, Tokyo Electron, Tablet, Valmiera Glass Via (basketball), Logic, LED, Laser, United Microelectronics Corporation, Memory, ASE, Growth, Glass, Region, Semiconductor, Video game, Samsung, Hybrid

In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.

Key Points: 
  • In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.
  • 3D stacking addresses this demand by enabling the integration of diverse functionalities and components in a compact three-dimensional structure.
  • The 3D stacking technology optimizes the memory device structure, enhancing storage capacity, speed, and efficiency in data handling.
  • By stacking memory cells vertically, 3D stacking allows for greater storage density and faster read-write speeds, meeting the escalating data storage requirements of various applications.

3D Stacking Market worth $3.1 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, October 2, 2023
Chemical control, SK, Electronics, TSV, Gas Control Equipment Ltd, College of Engineering (KNUST), TSV Kottern, Dram, AMD, IC, TSMC, TGV, ICS, Automation, Intel, Tokyo Electron, Tablet, Valmiera Glass Via (basketball), Logic, LED, Laser, United Microelectronics Corporation, Memory, ASE, Growth, Glass, Region, Semiconductor, Video game, Samsung, Hybrid

In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.

Key Points: 
  • In the realm of 3D integrated circuits (3D ICs), TSVs play a pivotal role, enabling advanced packaging techniques and stacking IC chips using TSV interconnects, contributing to the evolution of semiconductor devices.
  • 3D stacking addresses this demand by enabling the integration of diverse functionalities and components in a compact three-dimensional structure.
  • The 3D stacking technology optimizes the memory device structure, enhancing storage capacity, speed, and efficiency in data handling.
  • By stacking memory cells vertically, 3D stacking allows for greater storage density and faster read-write speeds, meeting the escalating data storage requirements of various applications.

DENSO and USJC Announce Mass Production Shipment of Automotive IGBT, Targeting Expanding Electric Vehicle Market

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Wednesday, May 10, 2023
Semiconductor, Partnership, ICE, DC, AC, TWSE, USJC, Ministry, United Microelectronics Corporation, Automation, UMC, Ministry of Economy, Trade and Industry, Policy, METI, DENSO, NYSE, Commerce, IGBT, Management, Rail transport

It comes just one year after the companies announced a strategic partnership for this critical power semiconductor used in electric vehicles.

Key Points: 
  • It comes just one year after the companies announced a strategic partnership for this critical power semiconductor used in electric vehicles.
  • As adoption of electric vehicles accelerates, automakers are seeking to boost powertrain efficiency while also increasing cost-effectiveness of electrified vehicles.
  • "Today, we are thrilled to welcome a memorable shipping ceremony that symbolizes the partnership between DENSO, UMC and USJC.
  • "It is an honor to be a strategic partner of DENSO, a leading automotive solution provider to global automakers.

DENSO and USJC Announce Mass Production Shipment of Automotive IGBT, Targeting Expanding Electric Vehicle Market

Retrieved on: 
Wednesday, May 10, 2023
EV, Electric Vehicles, Automotive, Technology, Manufacturing, IOT (Internet of Things), Semiconductor, Telecommunications, Other Manufacturing, Software, Hardware, Electronic Design Automation, Partnership, ICE, DC, Multimedia, AC, TWSE, USJC, United Microelectronics Corporation, Automation, UMC, Policy, METI, DENSO, NYSE, Commerce, IGBT, Management, Electronics

It comes just one year after the companies announced a strategic partnership for this critical power semiconductor used in electric vehicles.

Key Points: 
  • It comes just one year after the companies announced a strategic partnership for this critical power semiconductor used in electric vehicles.
  • The jointly invested line at USJC supports the production of a new generation of IGBT developed by DENSO, which offers 20% reduction in power losses compared with earlier generation devices.
  • “Today, we are thrilled to welcome a memorable shipping ceremony that symbolizes the partnership between DENSO, UMC and USJC.
  • “It is an honor to be a strategic partner of DENSO, a leading automotive solution provider to global automakers.

UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications

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Wednesday, May 3, 2023
Technology, Mobile, Wireless, Semiconductor, Satellite, Telecommunications, Software, Networks, Electronic Design Automation, IOT (Internet of Things), High-pass filter, United Microelectronics Corporation, Wi-Fi, FWA, Research, Internet of things, TWSE, Associate, UMC, City, Beamforming, NYSE, RF, Mobile phone

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that its 40nm RFSOI technology platform is now ready for production of millimeter-wave (mmWave) radio frequency (RF) front-end products, enabling the proliferation of 5G wireless networks and applications including smartphones, Fixed Wireless Access (FWA) systems, and small cell base stations.

Key Points: 
  • United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that its 40nm RFSOI technology platform is now ready for production of millimeter-wave (mmWave) radio frequency (RF) front-end products, enabling the proliferation of 5G wireless networks and applications including smartphones, Fixed Wireless Access (FWA) systems, and small cell base stations.
  • UMC’s new platform, 40RFSOI, is optimized for manufacturing RF switches, low noise amplifiers, and power amplifiers capable of handling the wider bandwidth of mmWave frequencies.
  • With the introduction of our 40RFSOI platform, UMC expands our RF portfolio to enable our customers to deliver their advanced 5G devices to market and capture opportunities in the growing mmWave market,” said Raj Verma, Associate Vice President of Technology Development at UMC.
  • Since 2014, UMC has had over 400 product tape-outs and more than 35 billion RFSOI chips shipped for various applications.