MRAM

Adamas One Corp. Announces Establishment of Board of Advisors for Adamas One Technologies

Retrieved on: 
Tuesday, March 26, 2024
Diamond, Mathematics, Nano, Growth, Business, Strategic management, Science, Material, Central Waqf Council, Polymer, Analog Devices, Research, Fairchild Semiconductor, Business development, MRAM, Engineering, Onsemi, Adamas, Diamond Vision, Jerry Maguire, NSF, NASA, Publication, Amphenol, Ceramic, Pennsylvania State University, Advanced technology, Information technology

The Board of Advisors is comprised of esteemed industry experts that will provide strategic guidance as Adamas One Technologies explores various applications for lab-grown diamonds in the semiconductor industry.

Key Points: 
  • The Board of Advisors is comprised of esteemed industry experts that will provide strategic guidance as Adamas One Technologies explores various applications for lab-grown diamonds in the semiconductor industry.
  • The newly appointed members include:
    Jerry McGuire- Mr. McGuire is currently the COO of Adamas One Corp. and the President of Adamas One Technologies.
  • The establishment of the Board of Advisors underscores the company's dedication to staying at the forefront of technological advancements and driving value for its stakeholders.
  • Adamas One Corp. is a registered trademark of Adamas One Corp. in the United States and/or other countries.

Everspin Technologies Unveils PERSYST, Simplifying Persistent Memory Solutions

Retrieved on: 
Tuesday, April 9, 2024
Professional Services, Data Management, Security, Technology, Data Analytics, Hardware, Automation, Stand, Embedded, AI, MRAM, Robotics, STT-MRAM

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced today the new brand name PERSYST for its persistent memory product family.

Key Points: 
  • Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced today the new brand name PERSYST for its persistent memory product family.
  • Everspin’s initiative to simplify product identification beyond conventional alphanumeric identifiers promises to make selecting the right solutions easier for clients.
  • “Known for unparalleled persistence, durability, and performance our PERSYST products are used for critical applications where data security is essential,” said Sanjeev Aggarwal, president and CEO of Everspin Technologies.
  • Everspin also will collaborate with Synaptic Labs to showcase EMxxLX’s integration with the xSPI controller on an FPGA evaluation board.

Avalanche Technology Announces Support for NASA PEMS Qualification and Screening

Retrieved on: 
Monday, April 8, 2024
PEMS, LEO, DPA, Avalanche, Risk, Swap, Aerospace, ISO9001, Software, MRAM, JEDEC, NASA, Defense

FREMONT, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, announced today the launch of a new product derivative to address the growing demand from the aerospace and defense community for extended qualification and screening solutions, particularly NASA PEMS INST-0001.

Key Points: 
  • In response to unprecedented demand for extended qualification & screening flows, Avalanche rolls out pin compatible NASA PEMS options for enabling Dual QSPI MRAM family.
  • FREMONT, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, announced today the launch of a new product derivative to address the growing demand from the aerospace and defense community for extended qualification and screening solutions, particularly NASA PEMS INST-0001.
  • "Having the ability to leverage pin compatible options for extended qualification to NASA PEMS provides additional platform scalability our customers want, and with Avalanche MRAM, the data integrity they need."
  • By extending its commanding lead with partners' own options for packaging, qualification, and screening, Avalanche gives customers choices for tailored platforms that can evolve with changing program requirements.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
Tuesday, March 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Everspin Technologies Expands Board of Directors with Appointment of Douglas Mitchell

Retrieved on: 
Wednesday, March 13, 2024
Semiconductor, IOT (Internet of Things), Hardware, Data Management, Technology, Cypress Semiconductor, Simtek Corporation, Acquisition, MRAM, RAM, Marketing, United States Air Force, Magnetoresistive RAM, Computer data storage

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced the appointment of Douglas Mitchell to its Board of Directors, effective February 26, 2024.

Key Points: 
  • Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced the appointment of Douglas Mitchell to its Board of Directors, effective February 26, 2024.
  • Mr. Mitchell has held various executive management positions focusing on corporate leadership, technology, marketing and business development of micro-controllers, digital signal processors and memories.
  • During his tenure at Infineon Technologies, he served as Vice President of RAM products, overseeing P&L responsibilities for a broad range of volatile and non-volatile memory technologies.
  • At Everspin, Mr. Mitchell served as Vice President of Sales & Marketing, leading business development efforts for the company's MRAM products shortly after their spin-off from Freescale.

Solid State Cooling Market worth $1.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 27, 2024
Cloud, Genomics, External, SLC, Urbanization, MLC, Biomedical Research, Transport, Enterprise, Molecular biology, NvSRAM, USB, PMC, Statistics, PCR, FRAM, Biotechnology, EVS, Row, Form, Air conditioning, Electronics, DNA, PCI Express, TLC, USB flash drive, Payment card, Region, Polymerase chain reaction, EEPROM, SAS, Agriculture, SATA, Refrigeration, Food, Authentication, PCI, Resistive random-access memory, LED, Defense, Temperature, Consumer electronics, Growth, Access management, SSD, LAN, Internal, MRAM, Content, Near-field communication, EPROM, Protection, Coherent Corp., NRAM, Government, Hardware, Adhesive

Solid state cooling market for electrocaloric technology to hold the highest CAGR during the forecast period.

Key Points: 
  • Solid state cooling market for electrocaloric technology to hold the highest CAGR during the forecast period.
  • Solid state cooling market for thermocycler type to hold the highest CAGR during the forecast period.
  • Solid state cooling market for automotive vertical to hold the highest CAGR during the forecast period.
  • These players have a strong market presence for Solid state cooling s across various North America, Europe, Asia Pacific, and RoW countries.

Avalanche Technology Announces Two New Products in Its Upgradeable Small Form Factor Family of Gb STT-MRAM For Aerospace Applications

Retrieved on: 
Monday, March 25, 2024
Transfer, Temperature, SRAM, EEPROM, EAP, System, MRAM, Engineering, Life, RAM, Marketing, Low Earth orbit, STT-MRAM, GEO, Persistent, PDC, Parallel, FBGA, Video game

FREMONT, Calif., March 25, 2024 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, announced today two new densities of its 3rd generation space-grade parallel asynchronous x32-interface high-reliability P-SRAM (Persistent SRAM) memory devices, based on its latest Spin Transfer Torque Magneto-resistive RAM (STT-MRAM) technology.

Key Points: 
  • With this development, Avalanche Technology is leading an evolution toward a new level of performance versus cost for modern space electronic systems.
  • "We welcome the addition of Avalanche's higher densities in the same physical footprint.
  • With the new 8Gb P-SRAM device, customers can design unified memory architecture systems for high reliability aerospace applications, all in one small form factor."
  • All density options in Avalanche's Parallel x32 Space Grade series will be available to customers participating in the early access program.

New High-Density Ceramic Column Grid Array STT-MRAM Optimally Designed for Space and the Harshest Environments

Retrieved on: 
Friday, February 23, 2024
Transfer, CTE, READ, Architecture, SRAM, STT-MRAM, CBGA, Research, Swap, Temperature, PWA, IBM, CLGA, QML, MRAM, Palladium, Avalanche, CGA, Family, CCGA, Parallel, CLASP, WRITE, Printed circuit board

The Micross co-fired Ceramic Column Grid Array package is the latest addition to our Hi-Reliability MRAM solutions for Space applications that will benefit from improved thermal stress related, electro-mechanical failures.

Key Points: 
  • The Micross co-fired Ceramic Column Grid Array package is the latest addition to our Hi-Reliability MRAM solutions for Space applications that will benefit from improved thermal stress related, electro-mechanical failures.
  • This new package offering is made possible via our Column Last Attach Solder Process (CLASP), licensed from IBM promoting a highly robust thermal shock & stress survivability option for our Hermetic fine pitch packages.
  • Perpendicular Spin-Torque MRAM devices offer inherent protection from harsh environments, and the best power profile of all non-volatile memories – making them optimally suited for hi-reliability aerospace and space applications.
  • Micross' licensed CLASP column attach process utilizes a Sn10Pb90 solder wire that is attached to the parent Land Grid package via a eutectic Palladium doped Sn63Pb37 solder attach process.

Credo Technology Group to Exhibit at Chiplet Summit 2024

Retrieved on: 
Tuesday, February 6, 2024
Technology, Mobile, Wireless, Semiconductor, Telecommunications, Software, Networks, Internet, Hardware, Data Management, Intellectual property, Credo, Exhibition, MRAM, Business development, Santa Clara Convention Center, PAM4, IP, Conference

Credo Technology Group Holding Ltd (“Credo”) (Nasdaq: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved power efficiency as data rates and corresponding bandwidth requirements increase throughout the data infrastructure market, will be exhibiting in booth 316 at the Chiplet Summit Conference and Exhibition taking place February 6-8, at the Santa Clara Convention Center.

Key Points: 
  • Credo Technology Group Holding Ltd (“Credo”) (Nasdaq: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved power efficiency as data rates and corresponding bandwidth requirements increase throughout the data infrastructure market, will be exhibiting in booth 316 at the Chiplet Summit Conference and Exhibition taking place February 6-8, at the Santa Clara Convention Center.
  • The summit is an excellent platform for Credo representatives to discuss the company’s comprehensive family of chiplet and intellectual property (IP) solutions with the chiplet ecosystem.
  • Attendees are encouraged to visit booth 316 to receive briefings on all Credo’s chiplet offerings including the recent portfolio expansion of the 112G PAM4 SerDes IP family in the latest process technology.
  • Credo invites all Chiplet Summit attendees to visit booth 316 and attend our panel to learn more.

Avalanche Technology Enables The Orbital Internet and Mars/Moon Gateway With Space-IoT Architecture

Retrieved on: 
Thursday, February 1, 2024
Avalanche, Marketing, Internet of things, TFLOPS, Orbital, Space Race, Orbit, GOPS, Architecture, Swap, Weather, MRAM, Business development, Spacecraft, Thought, Learning, Mercury Systems, Processor, NASA, Video game

FREMONT, Calif, Feb. 1, 2024 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, today released a white paper showing how AI computing should be implemented in Space. The white paper is titled "AI Computing in Space: A New Space-IoT Architecture to Solve the Processor Scaling Problem for Space", and examines why we need a new approach to scaling processing and cloud architectures for Space.

Key Points: 
  • FREMONT, Calif, Feb. 1, 2024 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, today released a white paper showing how AI computing should be implemented in Space.
  • We're completing the Orbital Internet picture by providing a new architecture, available now, for how AI computing should be implemented in Space.
  • "Previously Avalanche showed how to enable Multi Mission Boot Capability, and how to design robust data centers in Space.
  • Now we're completing the Orbital Internet picture by providing a new architecture, available now, for how AI computing should be implemented in Space."