OSAT

ChipMOS REPORTS 25.2% YoY OCTOBER 2023 REVENUE INCREASE

Retrieved on: 
Thursday, November 9, 2023
Taiwan Stock Exchange, OSAT, US, The Company, Semiconductor, Cryptocurrency

HSINCHU, Nov. 9, 2023 /PRNewswire/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of October 2023.

Key Points: 
  • HSINCHU, Nov. 9, 2023 /PRNewswire/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of October 2023.
  • All U.S. dollar figures cited in this press release are based on the exchange rate of NT$32.47 to US$1.00 as of October 31, 2023.
  • Revenue for the month of October 2023 was NT$1,970.0 million or US$60.7 million, representing an increase of 3.0% from September 2023, and an increase of 25.2% from October 2022.
  • The Company noted that despite the impacts of broader market softness in certain markets and at certain customers, it is benefiting from healthy memory products demand.

UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI

Retrieved on: 
Tuesday, October 31, 2023
Electronic Design Automation, Semiconductor, Technology, Other Technology, Artificial Intelligence, Internet, Hardware, Internet of things, Digital, 3D, Intelligence, DRAM, NYSE, United Microelectronics Corporation, TSV, Comprehensive, ASE, R&D, R, Growth, EDA, ASIC, OSAT, TWSE, CMOS, Silicon, AI, UMC, Memory, Logic, Video game, Cadence, Michael Faraday, Winbond

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.

Key Points: 
  • United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.
  • The W2W 3D IC project with partner collaboration targets edge AI applications – such as home and industrial IoT, security, and smart infrastructure – requiring mid-to-high range computing power, extensive and customizable memory modules, and relatively low power consumption.
  • “This project helps us collectively to improve customer time-to-market and sustain profitable growth through the integration technologies developed to accomplish application excellence in the AI era.”
    “With the continued proliferation of edge AI applications, 3D IC design is becoming increasingly crucial for our customers.
  • As the only EDA partner in this new project, we’re working closely with Faraday and UMC to enable 3D IC designs with the Cadence Integrity 3D-IC Platform.

ChipMOS REPORTS THIRD QUARTER 2023 RESULTS

Retrieved on: 
Thursday, November 2, 2023
Taiwan Stock Exchange, OSAT, ADS, The Company, Video game, Cryptocurrency

HSINCHU, Nov. 2, 2023 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported consolidated financial results for the third quarter ended September 30, 2023.

Key Points: 
  • HSINCHU, Nov. 2, 2023 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported consolidated financial results for the third quarter ended September 30, 2023.
  • Revenue for the third quarter of 2023 was NT$5,581.5 million or US$173.1 million, an increase of 2.5% from NT$5,444.1 million or US$168.9 million in the second quarter of 2023 and an increase of 6.2% from NT$5,254.0 million or US$163.0 million for the same period in 2022.
  • Net non-operating income in the third quarter of 2023 was NT$230.9 million or US$7.2 million, compared to NT$222.4 million or US$6.9 million in the second quarter of 2023, and NT$403.3 million or US$12.5 million in the third quarter of 2022.
  • Net earnings for the third quarter of 2023 were US$0.50 per basic ADS, compared to US$0.54 per basic ADS for the second quarter of 2023 and US$0.57 per basic ADS in the third quarter of 2022.

Advantest Issues Call for Papers for VOICE 2024 Developer Conference in San Diego, California

Retrieved on: 
Wednesday, October 18, 2023
Linda, Internet of things, Digital, WLR, Intelligence, WiGig, RF, ICS, History, HPC, MIMO, Conference, VOICE, Advantest, Artificial intelligence, City, OSAT, OEE, TSE, Abstract, IDMS, Radio frequency, Cost, Hot Topic, SIP, Video game, Mobile phone, Instrumentation, Consumer electronics

TOKYO, Oct. 18, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced a global call for papers for its VOICE 2024 Developer Conference focusing on leading-edge technologies and future trends.

Key Points: 
  • TOKYO, Oct. 18, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced a global call for papers for its VOICE 2024 Developer Conference focusing on leading-edge technologies and future trends.
  • The conference will be held in San Diego, California, on June 3-5, 2024.
  • Attendees at the conference sessions in June 2024 will vote for the best papers via the VOICE mobile app, with winning presenters receiving prizes and awards during the closing ceremonies.
  • For more information about the VOICE 2024 Developer Conference or sponsorship opportunities, visit https://voice.advantest.com/ or email [email protected] .

JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation

Retrieved on: 
Tuesday, October 10, 2023
Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Mobile, Wireless, Hardware, OSAT, Partnership, Multimedia, IC, JEDEC, San Jose Convention Center, Organization, IEEE, Open Compute Project, EDA, CDX, CDK, SIP, CDXML, OCP, 3D printing

In an extraordinary leap forward for the chiplet industry, the groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC is set to usher in a new era of innovation.

Key Points: 
  • In an extraordinary leap forward for the chiplet industry, the groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC is set to usher in a new era of innovation.
  • The result will be a unified structure that supports both chiplets and general electronic parts within the overarching purview of JEDEC.
  • Their collective mission, and that of the OCP ODSA Project, revolves around nurturing a flourishing open chiplet economy.
  • “By uniting the power of OCP CDXML and JEDEC JEP30 standards, we are forging a new era of collaboration and innovation in the chiplet industry.

ChipMOS REPORTS 6.2% YoY INCREASE IN 3Q23 REVENUE AND 20.2% YoY INCREASE SEPTEMBER 2023 REVENUE

Retrieved on: 
Friday, October 6, 2023
OSAT, The Company, US, Taiwan Stock Exchange, Semiconductor

All U.S. dollar figures cited in this press release are based on the exchange rate of NT$32.24 to US$1.00 as of September 29, 2023.

Key Points: 
  • All U.S. dollar figures cited in this press release are based on the exchange rate of NT$32.24 to US$1.00 as of September 29, 2023.
  • Revenue for the third quarter of 2023 was NT$5,581.5 million or US$173.1 million, representing an increase of 2.5% from the second quarter of 2023, and an increase of 6.2% from the third quarter of 2022.
  • The Company noted revenue growth in the third quarter of 2023, both year over year and quarter over quarter, reflects healthier channel inventory levels, and stable loading levels of DDIC high-end test platform.
  • Revenue for the month of September 2023 was NT$1,912.3 million or US$59.3 million, representing an increase of 4.3% from August 2023, and an increase of 20.2% from September 2022.

ChipMOS SCHEDULES THIRD QUARTER 2023 FINANCIAL RESULTS CONFERENCE CALL

Retrieved on: 
Friday, October 6, 2023
OSAT, Webcast, The Company, Taiwan Stock Exchange, Semiconductor, Online shopping

HSINCHU, Oct. 6, 2023 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will report third quarter 2023 results and host a conference call after the close of trading on the Taiwan Stock Exchange on Thursday, November 2, 2023.

Key Points: 
  • HSINCHU, Oct. 6, 2023 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will report third quarter 2023 results and host a conference call after the close of trading on the Taiwan Stock Exchange on Thursday, November 2, 2023.
  • Investors and analysts are encouraged to participate using the dial-in phone number noted below.
  • A webcast and replay will be available on the Company's website.

TIE 2023 opening this October Showcases over 1,000 Innovative Technologies and Demonstrate Taiwan's Strong R&D Capability

Retrieved on: 
Thursday, October 5, 2023
Online, OSAT, MPI, Government, Organization, Professional corporation, VIS, R, TIE, Futures studies, TWTC, Realtek, Taipei World Trade Center, Oxford Instruments, Etron, Attention, Taipei, Infineon Technologies

TAIPEI, Oct. 5, 2023 /PRNewswire/ -- The Taiwan Innotech Expo 2023 (TIE), one of the largest annual technology exchange events, will be held this October.

Key Points: 
  • TAIPEI, Oct. 5, 2023 /PRNewswire/ -- The Taiwan Innotech Expo 2023 (TIE), one of the largest annual technology exchange events, will be held this October.
  • Through a variety of both online and offline avenues, visitors will have the opportunity to experience the latest technological achievements in Taiwan.
  • TIE 2023 will feature participation from 430 domestic and international organizations, with more than 1,000 technological innovations on display.
  • TIE 2023 has invited nearly a hundred organizations from 21 countries, including the United States, Canada, Germany, Japan, and South Korea.

TIE 2023 opening this October Showcases over 1,000 Innovative Technologies and Demonstrate Taiwan's Strong R&D Capability

Retrieved on: 
Thursday, October 5, 2023
Online, OSAT, MPI, Government, Organization, Professional corporation, VIS, R, TIE, Futures studies, TWTC, Realtek, Taipei World Trade Center, Oxford Instruments, Etron, Attention, Taipei, Infineon Technologies

TAIPEI, Oct. 5, 2023 /PRNewswire/ -- The Taiwan Innotech Expo 2023 (TIE), one of the largest annual technology exchange events, will be held this October.

Key Points: 
  • TAIPEI, Oct. 5, 2023 /PRNewswire/ -- The Taiwan Innotech Expo 2023 (TIE), one of the largest annual technology exchange events, will be held this October.
  • Through a variety of both online and offline avenues, visitors will have the opportunity to experience the latest technological achievements in Taiwan.
  • TIE 2023 will feature participation from 430 domestic and international organizations, with more than 1,000 technological innovations on display.
  • TIE 2023 has invited nearly a hundred organizations from 21 countries, including the United States, Canada, Germany, Japan, and South Korea.

Advantest Receives PCI Express® Gen 5 Certification for MPT3000 Solid-State Drive Test Systems

Retrieved on: 
Thursday, September 28, 2023
NVM Express, OSAT, CXL, PCI Express, Advantest, ETC, SOC, SSD, Certification, PCI, Engineering, Compute Express Link, ITC, IDMS, Solid-state drive, Dibs, Independent, TSE, Video game

Advantest completed the rigorous testing process and was awarded certification in August 2023.

Key Points: 
  • Advantest completed the rigorous testing process and was awarded certification in August 2023.
  • Previously approved for PCIe 4.0 compliance testing, the MPT3000 is now also approved for official PCIe 5.0 compliance and certification testing.
  • The PCIe 5.0 certification was awarded specifically to two key products in the MPT3000 family: the MPT3000ES3 for engineering and the MPT3000HVM3 for high-volume manufacturing.
  • “Advantest has continually driven industry-leading advancements, enabling the MPT3000 to address SSD test requirements associated with PCIe 5.0, including NVMe devices and those utilizing the Compute Express Link™, or CXL, interconnect standard,” said Indira Joshi, VP of Advantest’s MPT3000 product line.