Yole

EQS-News: SÜSS MicroTec SE: Management confirms targets until 2025 at Capital Markets Day | Further potential for growth and efficiency gains by 2030 | Focus on core semiconductor markets

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Thursday, February 2, 2023
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Garching, Germany, February 2, 2023 – SÜSS MicroTec SE, a leading manufacturer of system and process solutions for the semiconductor industry and related markets, is informing capital markets about its strategic future today at the Capital Markets Day.

Key Points: 
  • Garching, Germany, February 2, 2023 – SÜSS MicroTec SE, a leading manufacturer of system and process solutions for the semiconductor industry and related markets, is informing capital markets about its strategic future today at the Capital Markets Day.
  • The focus will be on the growth prospects until 2030 for the Advanced Backend Solutions and Photomask Equipment business units.
  • In addition to its growth prospects, SUSS MicroTec is also presenting a strategy for improving the efficiency of its operations at the Capital Markets Day.
  • The Capital Markets Day presentations will be available for download at www.suss.com/en/investor-relations/publications shortly after the event.

MICLEDI Microdisplays and Kura Technologies Announce Partnership on Custom Micro-LED Display for Ultra High-Performance AR glasses, Scaling with Partners Including GlobalFoundries and TSMC

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Thursday, October 6, 2022
SAN, IMEC, Efficiency, ASIC, Smartphone, AR, 3D, Augmented reality, Yole, Multimedia, MicroLED, Partnership, San Francisco Bay Area, Technology, CES, Industry, Best, CEO, MIT, Silicon, CTO, USD, TSMC, GlobalFoundries, Leadership, Mobile phone, Management, Video game

SAN FRANCISCO and LEUVEN, Belgium, Oct. 5, 2022 /PRNewswire/ -- MICLEDI Microdisplays, a leading developer of microLED displays for augmented reality (AR) glasses, and Kura Technologies, a world leading innovator in AR headsets today announced a collaboration to manufacture AR glasses. The new glasses are designed by Kura and incorporate MICLEDI's unique 300mm microLED displays to achieve the performance required for Kura's next generation of AR glasses. Based upon Kura's proprietary architecture from the chip level up, these next generation glasses feature groundbreaking performance capabilities.

Key Points: 
  • The two companies have been working together for over a year with MICLEDI providing Kura early access to advanced microLEDs under a closely held collaboration.
  • "MICLEDI is pleased to be an integral part of Kura's innovation journey," said Sean Lord, MICLEDI CEO.
  • Working with Kura should provide mutually attractive timing and mass production ramp plans for both MICLEDI and GlobalFoundries," added Lord.
  • MICLEDI Microdisplays is a fabless developer of microLED display modules for the augmented reality (AR) market.

MICLEDI Microdisplays and Kura Technologies Announce Partnership to Advance AR Glasses

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Wednesday, October 5, 2022
SAN, IMEC, Efficiency, ASIC, Smartphone, AR, 3D, Augmented reality, Yole, MicroLED, Partnership, San Francisco Bay Area, Technology, CES, Industry, Best, CEO, MIT, GLOBE, Silicon, CTO, USD, TSMC, GlobalFoundries, Leadership, Video game console, Mobile phone, Management

SAN FRANCISCO and LEUVEN, Belgium, Oct. 05, 2022 (GLOBE NEWSWIRE) -- MICLEDI Microdisplays , a leading developer of microLED displays for augmented reality (AR) glasses, and Kura Technologies , a world leading innovator in AR headsets today announced a collaboration to manufacture AR glasses.

Key Points: 
  • SAN FRANCISCO and LEUVEN, Belgium, Oct. 05, 2022 (GLOBE NEWSWIRE) -- MICLEDI Microdisplays , a leading developer of microLED displays for augmented reality (AR) glasses, and Kura Technologies , a world leading innovator in AR headsets today announced a collaboration to manufacture AR glasses.
  • The new glasses are designed by Kura and incorporate MICLEDIs unique 300mm microLED displays to achieve the performance required for Kuras next generation of AR glasses.
  • The two companies have been working together for over a year with MICLEDI providing Kura early access to advanced microLEDs under a closely held collaboration.
  • Kura was one of the first customers to receive microLEDs from MICLEDI, enabling them to build and test their unique approach for driving and controlling microLED displays for AR glasses.

Lumotive Expands Lidar Technology Access Program to Include its Patented Light Control Metasurface™ (LCM) Beam Steering Chips and Reference Designs

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Tuesday, May 10, 2022
TAP, Industrial applications of nanotechnology, SPIE, GLOBE, EE, Yole, LCM, Edison Award, Electronics, CMOS, Safety, Robotics, Perception, Emerging technologies, Industry, Adoption, Lidar, CAGR, CEO, Technology, Automotive industry, 3D, AR, LCMS, Surveying, Lumot Lake

SEATTLE, May 10, 2022 (GLOBE NEWSWIRE) -- Lumotive , a leading developer of scalable, all-semiconductor lidar technologies, today announced that its patented Light Control Metasurface (LCM) beam steering chips and associated reference designs are now available to a select number of qualified partners via the companys Technology Access Program (TAP).

Key Points: 
  • SEATTLE, May 10, 2022 (GLOBE NEWSWIRE) -- Lumotive , a leading developer of scalable, all-semiconductor lidar technologies, today announced that its patented Light Control Metasurface (LCM) beam steering chips and associated reference designs are now available to a select number of qualified partners via the companys Technology Access Program (TAP).
  • Lumotive has developed a key scanning semiconductor technology for 3D real-time LiDAR.
  • LiDAR for Automotive and Industrial Applications report , Yole Dveloppement, 2021
    Lumotives disruptive Light Control Metasurface (LCM) solid-state beam steering chips significantly reduce the complexity, cost and size of lidar systems while improving performance and reliability.
  • Lumotive is a leader in all-semiconductor lidar systems, developing high-performance solutions for consumer electronics, industrial automation, robotics and automotive applications.

Tower Semiconductor Expands its Leading-Edge Power Management Platforms Supporting Higher Power and Higher Voltage ICs

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Monday, May 9, 2022
TASE, U.S. Securities and Exchange Commission, RF CMOS, IDMS, NASDAQ, Tower, Yole, BCD, Company, CMOS, RF, CPU, Graphics processing unit, Security (finance), MEMS, F-4, BiCMOS, Israel Securities Authority, Tower Semiconductor, Efficiency, F-3, Silicon-germanium, Technology, DTI, ICS, Renewable energy, Mobile phone

The new releases address the increasing demand for higher power ICs at higher voltages and power efficiency, further enhancing Towers leading market position in support of the power IC market that according to Yole Dveloppement ( Yole ) will reach over $25.5B by 2026.

Key Points: 
  • The new releases address the increasing demand for higher power ICs at higher voltages and power efficiency, further enhancing Towers leading market position in support of the power IC market that according to Yole Dveloppement ( Yole ) will reach over $25.5B by 2026.
  • Towers 65nm BCD platform is known as the best-in-class sub-90nm BCD technology with its leading figure of merit in power performance, cost, and integration competitiveness.
  • The Companys 180nm BCD is the industrys widest, best-in-class platform with respect to voltage coverage, isolation schemes, power performance, die size, and mask count.
  • Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.

MegaChips Focuses on Edge AI with Custom ASIC Solutions

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Friday, April 22, 2022
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SAN JOSE, Calif., April 21, 2022 /PRNewswire/ -- MegaChips, the leading custom ASIC company in Japan, today announced the launch of its AI Partner Program, which allows companies to integrate powerful AI capabilities without requiring in-house AI experts, allowing vendors to focus on their key strengths and ensuring top quality for the final product.

Key Points: 
  • The AI Partner Program marks the entry of MegaChips into the global Edge AI chips market, which was valued at $9 billion in 2020, and is projected to reach $59.6 billion by 2030 - an average growth rate of 21.2%.
  • "MegaChips is thrilled to offer the most turn-key solution for enterprise companies looking to implement AI technology," said Douglas Fairbairn, Director of Business Development.
  • MegaChips is one of the world's leading custom ASIC providers for consumer, telecom/network, industrial and automotive applications.
  • Headquartered in Japan, with offices in Silicon Valley and Taiwan, Megachips has over 30 years in business and has successfully completed morethan 1,500 ASIC projects.

ERS electronic unveils the Next-Generation of its ADM330 with a new design and advanced features

Retrieved on: 
Wednesday, March 30, 2022
Industry, CAGR, ERS, Multimedia, HPC, FO, Atmosphere, Yole, View, OSAT, IEEE Transactions on Advanced Packaging, IOT, Solution, Technology, CTE, Printed circuit board

Since then, it has become an industry-favourite and can be found on the production floors of most semiconductor manufacturers and OSATs involved in Advanced Packaging worldwide.

Key Points: 
  • Since then, it has become an industry-favourite and can be found on the production floors of most semiconductor manufacturers and OSATs involved in Advanced Packaging worldwide.
  • Lastly, the new ADM330 offers an implemented add-on software feature allowing stand-alone laser marking for improved wafer traceability.
  • With these improvements,we continue todeliver a robust system that meetsthe ever-changing process requirementsof Advanced Packaging," says Debbie-Claire Sanchez, FO Equipment Business Unit manager at ERS electronic.
  • Next-generation of ERS ADM330 debonding equipment announced today by ERS electronic will be a solution to enable warpage adjustment improvement and contribute to reducing yield losses."

ERS electronic unveils the Next-Generation of its ADM330 with a new design and advanced features

Retrieved on: 
Wednesday, March 30, 2022
Industry, CAGR, ERS, HPC, FO, Atmosphere, Yole, OSAT, IEEE Transactions on Advanced Packaging, IOT, Solution, Technology, CTE, Printed circuit board

Since then, it has become an industry-favourite and can be found on the production floors of most semiconductor manufacturers and OSATs involved in Advanced Packaging worldwide.

Key Points: 
  • Since then, it has become an industry-favourite and can be found on the production floors of most semiconductor manufacturers and OSATs involved in Advanced Packaging worldwide.
  • Lastly, the new ADM330 offers an implemented add-on software feature allowing stand-alone laser marking for improved wafer traceability.
  • With these improvements,we continue todeliver a robust system that meetsthe ever-changing process requirementsof Advanced Packaging," says Debbie-Claire Sanchez, FO Equipment Business Unit manager at ERS electronic.
  • Next-generation of ERS ADM330 debonding equipment announced today by ERS electronic will be a solution to enable warpage adjustment improvement and contribute to reducing yield losses."

FormFactor Introduces High-Power Semiconductor Wafer Probing System for Automotive, Renewable Energy, and Industrial Applications

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Thursday, March 3, 2022
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LIVERMORE, Calif., March 03, 2022 (GLOBE NEWSWIRE) -- FormFactor, Inc. (NASDAQ: FORM), a leading semiconductor test and measurement supplier, today introduced the TESLA300 high power semiconductor probing system.

Key Points: 
  • LIVERMORE, Calif., March 03, 2022 (GLOBE NEWSWIRE) -- FormFactor, Inc. (NASDAQ: FORM), a leading semiconductor test and measurement supplier, today introduced the TESLA300 high power semiconductor probing system.
  • * To meet market demand, major IDMs and foundries are researching new materials and beginning to manufacture power devices on 300mm wafers.
  • With its unique features and 300mm automation capabilities, the TESLA300 system provides ideal support for both R&D technical requirements and niche production test applications.
  • Flexible wafer handling, up to 300mm in wafer size, with semi or fully-automated configuration.

Lumotive and ZKW Group Jointly Demonstrate Vehicle Headlight with Integrated Functional Lidar at CES 2022

Retrieved on: 
Thursday, January 6, 2022
EE Times, CMOS, 3D, Consumer Technology Association, Safety, Group, Electronics, Yole, Association, M30, CES, Emerging technologies, AR, LCM, SPIE, Lidar, LED, Robotics, Consumer Electronics Show, Perception, Character, Golf, Technology, Industry, Edison Award, Invention, Television, Surveying, Lumot Dam

LAS VEGAS, Jan. 6, 2022 /PRNewswire/ -- Lumotive , aleading developer of solid-state lidar systems, and the ZKW Group ,a specialist for innovative premium lighting systems and electronics, today unveiled a functional demonstration of Lumotive's lidar technology integrated with a ZKW vehicle headlight.

Key Points: 
  • LAS VEGAS, Jan. 6, 2022 /PRNewswire/ -- Lumotive , aleading developer of solid-state lidar systems, and the ZKW Group ,a specialist for innovative premium lighting systems and electronics, today unveiled a functional demonstration of Lumotive's lidar technology integrated with a ZKW vehicle headlight.
  • "The market for automotive LiDAR is expected to reach $2.3B in 2026 and then $6.2B in 2032, including LiDAR integrated in next-generation lighting systems that incorporate 3D sensing capabilities.
  • With our discoveries and inventions, the ZKW corporate group makes vehicles more desirable, more unique, safer, and more energy efficient.
  • Founded in 2018, Lumotive is a leader in all-silicon lidar systems, developing high-performance solutions for consumer electronics, industrial automation, robotics and automotive applications.