IEEE Transactions on Advanced Packaging

Origin Materials, Inc. Reports Operating and Financial Results for Second Quarter 2023

Retrieved on: 
Wednesday, August 9, 2023

Origin Materials, Inc. (“Origin,” “Origin Materials,” or the “Company”) (Nasdaq: ORGN, ORGNW), the world’s leading carbon negative materials company with a mission to enable the world’s transition to sustainable materials, today announced financial results for its second quarter ended June 30, 2023.

Key Points: 
  • Origin Materials, Inc. (“Origin,” “Origin Materials,” or the “Company”) (Nasdaq: ORGN, ORGNW), the world’s leading carbon negative materials company with a mission to enable the world’s transition to sustainable materials, today announced financial results for its second quarter ended June 30, 2023.
  • Additional second quarter and recent business highlights include:
    Origin Materials Announces Startup of Origin 1, World’s First Commercial CMF Plant .
  • During the second quarter, Origin completed detailed assessments with its engineering partners and updated its capital project plan based on the results.
  • Company management will host a webcast and conference call on August 9, 2023, at 5:00 p.m. Eastern Time, to discuss the Company's financial results.

Xpeedic Releases Notus at DesignCon2023, Announces Upgrades to Advanced Packaging and High-Speed Digital Solutions

Retrieved on: 
Wednesday, February 1, 2023

In addition to Notus, Xpeedic also announced today upgrades to its Advanced Packaging and High-Speed Digital Solutions.

Key Points: 
  • In addition to Notus, Xpeedic also announced today upgrades to its Advanced Packaging and High-Speed Digital Solutions.
  • Metis, the EM simulation tool for 2.5D/3DIC advanced packaging designs, now delivers further improvement on performance.
  • Hermes, Xpeedic’s 3D EM simulation tool, further improves its adaptive mesh technology to achieve desired accuracy with faster convergence.
  • Xpeedic will be in DesignCon Booth #633 today and tomorrow, February 1 and February 2, at the Santa Clara Convention Center.

Advantest to Showcase Latest IC Test Solutions at SEMICON Japan, December 14-16 in Tokyo

Retrieved on: 
Wednesday, December 7, 2022

TOKYO, Dec. 07, 2022 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature over a dozen of its latest products and services at the SEMICON Japan trade show on December 14-16 in Tokyo.

Key Points: 
  • TOKYO, Dec. 07, 2022 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature over a dozen of its latest products and services at the SEMICON Japan trade show on December 14-16 in Tokyo.
  • SEMICON Japan will be held as an in-person event this year at the Tokyo Big Sight.
  • In addition to showcasing advanced test technologies, Advantest will also highlight its ESG initiatives and action plans.
  • Like previous years, Advantest is expressing its steadfast support for the industry as a gold-level sponsor of this year’s SEMICON Japan.

Kulicke & Soffa Joins Hi-CHIP - Heterogeneous Integration and Chiplet System Package Alliance

Retrieved on: 
Monday, December 12, 2022

(NASDAQ: KLIC)("Kulicke &Soffa","K&S" or the "Company") today announced the Company has joined the Heterogeneous Integration and Chiplet System Package Alliance (Hi-CHIP), an initiative led by the Taiwan-based Industrial Technology Research Institute (ITRI), in collaboration with other major industry players.

Key Points: 
  • (NASDAQ: KLIC)("Kulicke &Soffa","K&S" or the "Company") today announced the Company has joined the Heterogeneous Integration and Chiplet System Package Alliance (Hi-CHIP), an initiative led by the Taiwan-based Industrial Technology Research Institute (ITRI), in collaboration with other major industry players.
  • These emerging applications are anticipatedtooutpacesemiconductor unit growth, drivingdemand for the Company's high-accuracy flip-chip, thermocompression and lithography systems, such as its LITEQ 500.
  • Kulicke&Soffa's LITEQ 500 lithography projection stepper uses a laser-based light source to provide high-intensity exposures without intensity degradation over time.
  • Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

Kulicke & Soffa Reports Fourth Quarter 2022 Results

Retrieved on: 
Wednesday, November 16, 2022

Through organic development, prudent acquisitions and close industry partnerships, Kulicke & Soffa's served available market has grown to approximately $4.7 billion in fiscal 2022, up 51 percent from fiscal 2018.

Key Points: 
  • Through organic development, prudent acquisitions and close industry partnerships, Kulicke & Soffa's served available market has grown to approximately $4.7 billion in fiscal 2022, up 51 percent from fiscal 2018.
  • Repurchased approximately 5.6 million shares of common stock through open market and accelerated programs at a cost of $282.8 million.
  • A conference call to discuss these results will be held tomorrow,November 17, 2022, beginning at8:00am EST.
  • Management uses both U.S. GAAP metrics as well as non-GAAP metrics to evaluate the Company's operating and financial results.

ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330

Retrieved on: 
Wednesday, November 16, 2022

MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic , the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction.

Key Points: 
  • MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic , the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction.
  • Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies.
  • They can both be found in most of ERS's machines and are typically applied for warpage correction after thermal debonding.
  • "We therefore extend our warpage correction capabilities to a standalone machine, which can be deployed in-between processes to aid manufacturing."

ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330

Retrieved on: 
Wednesday, November 16, 2022

MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic , the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction.

Key Points: 
  • MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic , the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction.
  • Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies.
  • They can both be found in most of ERS's machines and are typically applied for warpage correction after thermal debonding.
  • "We therefore extend our warpage correction capabilities to a standalone machine, which can be deployed in-between processes to aid manufacturing."

Camtek Schedules Third Quarter 2022 Results Release and Conference Call for November 17, 2022

Retrieved on: 
Monday, November 7, 2022

MIGDAL HA'EMEK, Israel, Nov. 7, 2022 /PRNewswire/ -- Camtek Ltd. (Nasdaq: CAMT); (TASE: CAMT) announced that it would be releasing its financial results for the third quarter 2022 on Thursday, November 17, 2022.

Key Points: 
  • MIGDAL HA'EMEK, Israel, Nov. 7, 2022 /PRNewswire/ -- Camtek Ltd. (Nasdaq: CAMT); (TASE: CAMT) announced that it would be releasing its financial results for the third quarter 2022 on Thursday, November 17, 2022.
  • The Company will also hold a conference call on the same day starting at 9:00 am ET.
  • Rafi Amit, CEO, Moshe Eisenberg, CFO and Ramy Langer, COO will host the call and will be available to answer questions after presenting the results.
  • Camtek provides dedicated solutions and crucial yield-enhancement data, enabling manufacturers to improve yield and drive down their production costs.

Paul Boudre appointed chairman of UnitySC

Retrieved on: 
Friday, September 23, 2022

MONTBONNOT, France, Sept. 23, 2022 /PRNewswire/ -- UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors.

Key Points: 
  • MONTBONNOT, France, Sept. 23, 2022 /PRNewswire/ -- UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors.
  • Paul Boudre was the CEO of Soitec [EPA:SOI], a world leader in silicon-on-insulator (SOI) design and manufacturing, from September 2015 to July 2022.
  • Paul Boudre also serves on the boards of directors of the Association for European NanoElectronics Activities (AENEAS) and the semiconductors company Alphawave IP Groupe.
  • Paul Boudre holds a graduate degree in chemistry from Ecole Nationale Suprieure de Chimie in Toulouse, France.

Paul Boudre appointed chairman of UnitySC

Retrieved on: 
Friday, September 23, 2022

MONTBONNOT, France, Sept. 23, 2022 /PRNewswire/ -- UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors.

Key Points: 
  • MONTBONNOT, France, Sept. 23, 2022 /PRNewswire/ -- UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors.
  • Paul Boudre was the CEO of Soitec [EPA:SOI], a world leader in silicon-on-insulator (SOI) design and manufacturing, from September 2015 to July 2022.
  • Paul Boudre also serves on the boards of directors of the Association for European NanoElectronics Activities (AENEAS) and the semiconductors company Alphawave IP Groupe.
  • Paul Boudre holds a graduate degree in chemistry from Ecole Nationale Suprieure de Chimie in Toulouse, France.