Yole

Powering Up Panel-Level Packaging! Capcon’s Die Bonder Wins Bulk Adoption by Internationally Leading IDM Giant

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Thursday, March 21, 2024
Semiconductor, Technology, Manufacturing, Nanotechnology, Other Technology, Other Manufacturing, Hardware, IDM, Algorithm, Yole, Fabless manufacturing, RF, Leo, UPH, Foundry, Education minister, Key, Sensor, IDMS, Car, Law, Printed circuit board

Recently, Capcon’s large panel-level packaging die bonder, AvantGo L6 (Leo), has been adopted in bulk by an internationally-leading IDM manufacturer and mass producer.

Key Points: 
  • Recently, Capcon’s large panel-level packaging die bonder, AvantGo L6 (Leo), has been adopted in bulk by an internationally-leading IDM manufacturer and mass producer.
  • It is attracting the attention of industry leading Fabless, OSAT and IDM to position the technology as part of their packaging roadmap and process development.
  • For die bonder, the substrate size used in panel-level packaging is larger, so the surface prone to warping.
  • It is focusing on wafer-level packaging equipment, panel-level packaging equipment, and substrate-level packaging equipment, committed to providing customers with advanced semiconductor packaging products, technology, and solutions.

Altos Radar Debuts Game-Changing 4D Imaging Radar at CES 2024

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Wednesday, January 10, 2024
RADAR, RF, Altos, ZhenFund, Snow, Yole, TI, Perception, Radar, Algorithm, ADAS, Huawei, McKinsey & Company, Apple, Mozilla, CES, Build automation, Pony.ai, Imaging radar, Rain, Lidar, Instrumentation

LAS VEGAS, Jan. 10, 2024 /PRNewswire/ -- Altos Radar, a pioneer startup led by industry experts, unveiled its groundbreaking 4D imaging radar at CES 2024.

Key Points: 
  • LAS VEGAS, Jan. 10, 2024 /PRNewswire/ -- Altos Radar, a pioneer startup led by industry experts, unveiled its groundbreaking 4D imaging radar at CES 2024.
  • At the heart of this innovation lies the Altos V Series, a world-first non-FPGA 4-chip cascade design based on TI TDA4.
  • Key Features of Altos V Series:
    Altos Radar also introduced the Altos RF Series, a non-computing front-end radar module offering a cost-effective 4D imaging radar solution that seamlessly connects to a common camera interface.
  • Altos Radar's high-performance 4D millimeter-wave RADAR meets the booming demand for 4D imaging radars, with the market projected to double to $8 billion by 2027 (Yole's 2022 Automotive Radar Report).

Tower Semiconductor and InnoLight Partner to Develop Multi-Generation Silicon Photonics Based Optical Transceivers

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Thursday, September 7, 2023
Partnership, COSA, Senior, Tower Semiconductor, HPA, Lidar, Tower, AI, Silicon, Online shopping, Yole

MIGDAL HAEMEK, Israel, and SUZHOU, China, Sept. 7, 2023 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, and InnoLight Technology, the leader in data center optics, today announced their collaboration to develop multi-generation high-speed optical transceivers based on Tower’s Silicon Photonics process platform (PH18).

Key Points: 
  • MIGDAL HAEMEK, Israel, and SUZHOU, China, Sept. 7, 2023 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, and InnoLight Technology, the leader in data center optics, today announced their collaboration to develop multi-generation high-speed optical transceivers based on Tower’s Silicon Photonics process platform (PH18).
  • According to Yole, a market research firm, the silicon photonic die market is expected to grow at 22% CAGR reaching nearly half-a-billion dollars by 2027.
  • Dr. Marco Racanelli, Senior Vice President and General Manager of Analog Business Unit at Tower Semiconductor: “We are excited to partner with a leader like InnoLight for the manufacturing of their current and next-generation optical transceiver products.
  • Our well-established collaboration with Tower firmly demonstrates that we have found a foundry partner who not only possesses best-in-class silicon photonics technology but is also willing to collaborate closely with us to translate our innovations into silicon.

Altos Radar raises $3.5m to accelerate the development and commercialization of 4D imaging radars

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Monday, August 14, 2023
Radar, Hitachi, Yole, FCC, FSD, Huawei, System basis chip, Perception, Socs, McKinsey & Company, ZF, Lyft, Silicon, ZhenFund, Pony.ai, SAN, RADAR, Radio, Yoy, Pedestrian, Build automation, Full, Road, Television, Instrumentation, Apple

SAN JOSE, Calif., Aug. 14, 2023 /PRNewswire/ -- Silicon Valley-based automotive radar startup, Altos Radar, has raised $3.5 million in seed round funding that will fast-track the commercialization of 4D imaging radars in driver-assisted and autonomous vehicles.

Key Points: 
  • SAN JOSE, Calif., Aug. 14, 2023 /PRNewswire/ -- Silicon Valley-based automotive radar startup, Altos Radar, has raised $3.5 million in seed round funding that will fast-track the commercialization of 4D imaging radars in driver-assisted and autonomous vehicles.
  • This enabled the possibility of producing high-resolution radars at one-third the size of the previously used 24GHz radars with similar angular resolution.
  • This makes Altos V1 radar the world's first production-ready non-FPGA-based, 4-chip cascaded (12TX, 16RX) 4D imaging radar, offering great advantages in cost, reliability and mass-producibility.
  • Altos Radar's new high-performance 4D millimeter-wave RADAR caters to the demands of a 4D imaging radar market that Yole's 2022 Automotive Radar Report estimated will double YoY by 2027 to $8 billion.

Weebit Nano qualifies its ReRAM module for automotive grade temperature

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Monday, July 31, 2023
ECC, MCU, SkyWater Technology, Resistive random-access memory, Radiation, Yole, Internet of things, Weebit Nano, NVM Express, ASX, Temperature, IP, Doctor of Philosophy, HOD, CEA-Leti: Laboratoire d'électronique des technologies de l'information, Memory, Algorithm, JEDEC, Silicon, IOS, Computer data storage, Vaccine

HOD HASHARON, Israel, July 31, 2023 (GLOBE NEWSWIRE) -- Weebit Nano Limited (ASX:WBT), a leading developer of advanced memory technologies for the global semiconductor industry, has fully qualified its Resistive Random-Access Memory (ReRAM) module up to 125 degrees Celsius, the temperature specified for automotive grade 1 Non-Volatile Memories (NVMs).

Key Points: 
  • HOD HASHARON, Israel, July 31, 2023 (GLOBE NEWSWIRE) -- Weebit Nano Limited (ASX:WBT), a leading developer of advanced memory technologies for the global semiconductor industry, has fully qualified its Resistive Random-Access Memory (ReRAM) module up to 125 degrees Celsius, the temperature specified for automotive grade 1 Non-Volatile Memories (NVMs).
  • This achievement demonstrates the suitability of Weebit ReRAM for use in microcontrollers and other automotive components, as well as high-temperature industrial and IoT applications.
  • The ReRAM module includes a 128Kb 1T1R ReRAM array, control logic, decoders, IOs (Input/Output communication elements) and error correcting code (ECC).
  • Weebitcontinues to extend the qualification of its ReRAM modules to higher temperature and endurance levels, both with CEA-Leti and SkyWater Technology.

GaN and SiC Technologies on Spotlight at PowerUP Asia Conference

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Monday, April 24, 2023
NXP Semiconductors, Exhibition, UTAC Group, Electronics, Infineon Technologies, EPC, Arrow Electronics, EVS, Rohde & Schwarz, Silicon carbide, WBG, Traction, STMicroelectronics, Silicon, ASE Group, Analog Devices, Gallium nitride, News, Video game, Consumer electronics, Yole

WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023.

Key Points: 
  • WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023.
  • Organized by AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, PowerUP Asia puts the spotlight on the key players and the latest technologies and trends in the power electronics industry in Asia.
  • PowerUP Asia builds on the success of the established PowerUP Expo, a virtual conference and exhibition being held by Power Electronics News, a sister publication under AspenCore.
  • With fairgrounds, an exhibition hall, and a conference space, PowerUP Asia functions similarly to a live exhibition and conference.

Automotive CMOS Image Sensor (CIS) Chip Industry Research Report 2022: Intelligent Vehicles Provide Lucrative Opportunities - ResearchAndMarkets.com

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Monday, February 13, 2023
Technology, Hardware, Automotive Manufacturing, Manufacturing, ASIL, LFM, Photography, OMS, Smartphone, TANK, SVS, MP, ADAS, CSP, Level 2, Certification, Temperature, CIS, Child, Backup camera, OmniVision Technologies, HDR, Yole, RVC, Vital signs, Growth, CES, DMS, ICV, Camera, Satellite navigation device

The "Automotive CMOS Image Sensor (CIS) Chip Industry Research Report, 2022" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Automotive CMOS Image Sensor (CIS) Chip Industry Research Report, 2022" report has been added to ResearchAndMarkets.com's offering.
  • It is known that the biggest application market of image sensor is smartphone field.
  • As the smartphone market becomes saturated, image sensor chip vendors are turning to booming intelligent vehicle market.
  • The huge demand also drives the growth of automotive image sensors and gives rise to more market segments.

Singapore’s Capcon Raises Around $50 Million

Retrieved on: 
Sunday, February 5, 2023
Packaging, Semiconductor, Technology, Manufacturing, Software, Other Manufacturing, Hardware, Monoceros, Reticulum, SPIL, AOI, Andromeda, Leo, Marketing, SIP, ASE, Video game, Yole

Capcon, a Singapore-based advanced packaging solution provider, has secured around $50 million in series B2 funding.

Key Points: 
  • Capcon, a Singapore-based advanced packaging solution provider, has secured around $50 million in series B2 funding.
  • Ltd. provides a full range of advanced packaging processes, offering die bonders for wafer-level packaging, panel-level packaging, Flip chip, SIP, and Stack Die, etc.
  • At the beginning of 2022, Capcon reached a 3-year supply agreement with ASE.
  • Capcon is comprehensively engaged in intelligent manufacturing, semiconductors and pan-semiconductor fields.

Global Automotive CMOS Image Sensor (CIS) Chip Industry Research Report 2022: Market to Reach $7.4 Billion by 2027

Retrieved on: 
Monday, February 13, 2023
ASIL, LFM, Photography, OMS, Smartphone, TANK, SVS, MP, ADAS, CSP, Level 2, Certification, Temperature, CIS, Child, Backup camera, OmniVision Technologies, HDR, Yole, RVC, Vital signs, Growth, CES, DMS, ICV, Camera, Satellite navigation device

DUBLIN, Feb. 13, 2023 /PRNewswire/ -- The "Automotive CMOS Image Sensor (CIS) Chip Industry Research Report, 2022" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Feb. 13, 2023 /PRNewswire/ -- The "Automotive CMOS Image Sensor (CIS) Chip Industry Research Report, 2022" report has been added to ResearchAndMarkets.com's offering.
  • As the smartphone market becomes saturated, image sensor chip vendors are turning to booming intelligent vehicle market.
  • The huge demand also drives the growth of automotive image sensors and gives rise to more market segments.
  • ICV TANK forecasts that the market for automotive CIS will reach $7.4 billion by 2027.

EQS-News: SÜSS MicroTec SE: Management confirms targets until 2025 at Capital Markets Day | Further potential for growth and efficiency gains by 2030 | Focus on core semiconductor markets

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Thursday, February 2, 2023
UV, Yole, OPEX, Capital market, EUV, SET, DNA Oyj, Financial Oversight and Management Board for Puerto Rico, Total, Running, Society of Vacuum Coaters, Photomask, SÜSS MicroTec, Lithography, Thought, Marketing, Publishing, Growth, Software, SUSS, EBIT, EUR, MEMS, Semiconductor, Security (finance), Renewable energy, Fine chemical, Perpend stone

Garching, Germany, February 2, 2023 – SÜSS MicroTec SE, a leading manufacturer of system and process solutions for the semiconductor industry and related markets, is informing capital markets about its strategic future today at the Capital Markets Day.

Key Points: 
  • Garching, Germany, February 2, 2023 – SÜSS MicroTec SE, a leading manufacturer of system and process solutions for the semiconductor industry and related markets, is informing capital markets about its strategic future today at the Capital Markets Day.
  • The focus will be on the growth prospects until 2030 for the Advanced Backend Solutions and Photomask Equipment business units.
  • In addition to its growth prospects, SUSS MicroTec is also presenting a strategy for improving the efficiency of its operations at the Capital Markets Day.
  • The Capital Markets Day presentations will be available for download at www.suss.com/en/investor-relations/publications shortly after the event.