IDMS | Jotup

ASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the First Quarter of 2024

Retrieved on:

Thursday, April 25, 2024

EMS, Treasury, Capital, Depreciation, IDMS, Capital expenditure, ADS, Video game

Basic earnings per share for the quarter were NT$1.32 (or US$0.084 per ADS), compared to NT$1.36 for 1Q23 and NT$2.18 for 4Q23.

Key Points:

Basic earnings per share for the quarter were NT$1.32 (or US$0.084 per ADS), compared to NT$1.36 for 1Q23 and NT$2.18 for 4Q23.
Cost of revenues was NT$111,935 million for the quarter, down from NT$134,820 million in 4Q23.
Raw material cost totaled NT$66,845 million for the quarter, representing 50% of the total net revenues.
Labor cost totaled NT$15,378 million for the quarter, representing 12% of the total net revenues.

Astadia Achieves AWS Mainframe Migration Competency Status

Retrieved on:

Tuesday, March 12, 2024

Amazon Web Services, Software, FTR, APN, IBM, AWS, COBOL, IDMS, DB2, Assembler

BOSTON, March 12, 2024 (GLOBE NEWSWIRE) -- Astadia, the mainframe-to-cloud migration experts, announced today that their organization has achieved Amazon Web Services (AWS) Mainframe Migration Competency status.

Key Points:

BOSTON, March 12, 2024 (GLOBE NEWSWIRE) -- Astadia, the mainframe-to-cloud migration experts, announced today that their organization has achieved Amazon Web Services (AWS) Mainframe Migration Competency status.
The company also completed the AWS Foundational Technical Review (FTR) for its mainframe migration automation software, the Astadia FastTrack Factory.
Achieving the AWS Migration Competency differentiates Astadia as an AWS Partner Network (APN) member that provides specialized software and consulting services designed to help enterprises adopt, develop, and deploy complex projects on AWS.
“Astadia is proud to be recognized with AWS Mainframe Migration Competency status,” said Scott Silk, CEO of Astadia.

Netradyne Introduces GreenZone Score Enhancement to Boost Driver Advocacy and Safety

Retrieved on:

Thursday, March 28, 2024

Netradyne has expanded its innovative patented DriverStars and Driver Streaks to reinforce safe driving behaviors.

Key Points:

Netradyne has expanded its innovative patented DriverStars and Driver Streaks to reinforce safe driving behaviors.
Once a positive (durational) measurement is achieved by a driver, Netradyne’s Driver•i devices automatically capture video and award a Driver Streak, a subtype of DriverStars within the Netradyne system.
Driver Streaks also includes consecutive driving while being distraction-free as well as maintaining a safe following distance during their trip.
We've seen proof that positive reinforcement and continued performance training make a big impact on fleet safety results and overall safety culture,” says Adam Kahn, president at Netradyne.

Powering Up Panel-Level Packaging! Capcon’s Die Bonder Wins Bulk Adoption by Internationally Leading IDM Giant

Retrieved on:

Thursday, March 21, 2024

Recently, Capcon’s large panel-level packaging die bonder, AvantGo L6 (Leo), has been adopted in bulk by an internationally-leading IDM manufacturer and mass producer.

Key Points:

Recently, Capcon’s large panel-level packaging die bonder, AvantGo L6 (Leo), has been adopted in bulk by an internationally-leading IDM manufacturer and mass producer.
It is attracting the attention of industry leading Fabless, OSAT and IDM to position the technology as part of their packaging roadmap and process development.
For die bonder, the substrate size used in panel-level packaging is larger, so the surface prone to warping.
It is focusing on wafer-level packaging equipment, panel-level packaging equipment, and substrate-level packaging equipment, committed to providing customers with advanced semiconductor packaging products, technology, and solutions.

Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy

Retrieved on:

Tuesday, March 12, 2024

ROME, March 12, 2024 /PRNewswire/ -- Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

Key Points:

This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028.
Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally.
"We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor industry, through this investment into the world's most advanced packaging solution.
Notably, Silicon Box facilities specialize in advanced chiplet integration capabilities ("advanced packaging"), on a large manufacturing format for scale.

Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy

Retrieved on:

Tuesday, March 12, 2024

ROME, March 12, 2024 /PRNewswire/ -- Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

Key Points:

This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028.
Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally.
"We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor industry, through this investment into the world's most advanced packaging solution.
Notably, Silicon Box facilities specialize in advanced chiplet integration capabilities ("advanced packaging"), on a large manufacturing format for scale.

BE Semiconductor Industries N.V. Announces Q4-23 and Full Year 2023 Results

Retrieved on:

Thursday, February 22, 2024

Silicon photonics, EVP, AI, Silicon, HBM, ASML, Service, Share repurchase, Growth, ESG, Weakness, Business, TSMC, Corporate development, IDMS, Logic, Development, Research

DUIVEN, the Netherlands, Feb. 22, 2024 (GLOBE NEWSWIRE) -- BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the fourth quarter and year ended December 31, 2023.

Key Points:

Shareholders also benefitted from a 141.2% increase in our share price and the capital allocation of € 435.5 million in the form of dividends and share repurchases.
We also continue to formulate and execute strategic initiatives to position Besi for solid profitability and sustainable growth over the next decade.
In addition, we formed a Technology Advisory Board to advance our core technology, competitive position and growth prospects.
The slope of the recovery this year is uncertain given restrained demand for mainstream applications and weakness in automotive end-user markets currently.

ASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the Fourth Quarter and the Full Year of 2023

Retrieved on:

Thursday, February 1, 2024

ADS, IDMS, EMS, Capital, Capital expenditure, Depreciation, Treasury, Video game

For the full year of 2023, the Company reported unaudited net revenues of NT$581,914 million and net income attributable to shareholders of the parent of NT$31,725 million.

Key Points:

For the full year of 2023, the Company reported unaudited net revenues of NT$581,914 million and net income attributable to shareholders of the parent of NT$31,725 million.
Raw material cost totaled NT$87,527 million for the quarter, representing 55% of the total net revenues.
Labor cost totaled NT$15,562 million for the quarter, representing 10% of the total net revenues.
Net foreign exchange gain was NT$3,731 million, primarily attributable to the depreciation of the U.S. dollar against the New Taiwan dollar.

Amkor Announces US Advanced Packaging and Test Facility

Retrieved on:

Thursday, November 30, 2023

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.

Key Points:

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.
Amkor is the only US-headquartered OSAT (outsourced semiconductor assembly and test) service provider with advanced packaging technology capability and high-volume manufacturing experience.
Upon completion, this will be the largest outsourced advanced packaging facility in the US.
“This investment will reinforce our leadership position in advanced packaging and test within the key markets we serve while solidifying our commitment to expanding US-based chip manufacturing.”

Global Outsourced Semiconductor Assembly and Test Research Report 2023: Growth Opportunities, Estimates, Size and Forecast Trends through 2027 - ResearchAndMarkets.com

Retrieved on:

Tuesday, November 28, 2023

Technology, Semiconductor, Internet of things, Ecosystem, Research, IDMS, Geography, ATP

The "Global Outsourced Semiconductor Assembly and Test Growth Opportunities" report has been added to ResearchAndMarkets.com's offering.

Key Points:

The "Global Outsourced Semiconductor Assembly and Test Growth Opportunities" report has been added to ResearchAndMarkets.com's offering.
This comprehensive study delves into the global outsourced semiconductor assembly and test (OSAT) market, which is poised for substantial growth, primarily driven by the increasing adoption of advanced packaging technology across various industries.
OSATs, or outsourced semiconductor assembly and test providers, are essential third-party partners specializing in assembly, testing, and packaging (ATP) services for integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers.
To provide comprehensive insights, the research combines findings from discussions with industry experts and stakeholders in the OSAT ecosystem with secondary research data to estimate market size and forecast growth trends through 2027.