MACOM and U.S. Air Force Enter into a Cooperative Research and Development Agreement
MACOM Technology Solutions Inc. (MACOM), a leading supplier of semiconductor solutions, today announced that it has entered into a Cooperative Research and Development Agreement with the United States Air Force Research Laboratory (AFRL) regarding Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) technology.
- MACOM Technology Solutions Inc. (MACOM), a leading supplier of semiconductor solutions, today announced that it has entered into a Cooperative Research and Development Agreement with the United States Air Force Research Laboratory (AFRL) regarding Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) technology.
- Under the agreement, AFRL and MACOM will work together to transfer AFRLs production ready 0.14 micron GaN-on-SiC semiconductor process to MACOMs Massachusetts-based U.S.
- Semiconductor experts from both parties will collaborate to support a rapid process transfer to MACOM.
- Once the process is transferred, MACOM anticipates that it will expand its standard and custom MMIC product offerings.