Semiconductor device fabrication

ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330

Retrieved on: 
Wednesday, November 16, 2022
Fraunhofer Society, Packaging and labeling, Research, Industry, OSAT, ERS, IEEE Transactions on Advanced Packaging, Technology, Semiconductor device fabrication, Solution

MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic , the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction.

Key Points: 
  • MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic , the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction.
  • Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies.
  • They can both be found in most of ERS's machines and are typically applied for warpage correction after thermal debonding.
  • "We therefore extend our warpage correction capabilities to a standalone machine, which can be deployed in-between processes to aid manufacturing."

ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330

Retrieved on: 
Wednesday, November 16, 2022
Fraunhofer Society, Packaging and labeling, Research, Industry, OSAT, ERS, IEEE Transactions on Advanced Packaging, Technology, Semiconductor device fabrication, Solution

MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic , the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction.

Key Points: 
  • MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic , the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction.
  • Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies.
  • They can both be found in most of ERS's machines and are typically applied for warpage correction after thermal debonding.
  • "We therefore extend our warpage correction capabilities to a standalone machine, which can be deployed in-between processes to aid manufacturing."

Falkonry Unveils GPU-Based, High-Speed Time Series Anomaly Detection Application

Retrieved on: 
Thursday, September 22, 2022
Other Manufacturing, Apps, Applications, Technology, Software, Manufacturing, Networks, Internet, Hardware, Data Management, Artificial Intelligence, Adoption, Health, Efficiency, Metal, NVIDIA, Anomaly, Deep learning, NVIDIA GPU, Maintenance, Donbas–Rostov strategic defensive operation, Health Industry Business Communications Council, Forbes, CEO, CB Insights, Fossil fuel, Semiconductor device fabrication, AI, Plant, JMP, Milk, Video game console, Medical device

Falkonry today announced an automated anomaly detection application called Falkonry Insight which operates on high-speed sensor time series data.

Key Points: 
  • Falkonry today announced an automated anomaly detection application called Falkonry Insight which operates on high-speed sensor time series data.
  • These systems generate massive amounts of time series data containing signs of deteriorating machine health and product quality.
  • Falkonry Insight allows operations teams to virtually inspect every electrical and mechanical data point to automatically detect new and emerging hotspots.
  • Falkonry Insight organizes detected anomalies by the affected components of the plant, the severity of the anomaly, and the main contributing factors.

EV Group Revolutionizes 3D Integration from Advanced Packaging to Transistor Scaling with NanoCleave Layer Release Technology

Retrieved on: 
Monday, September 12, 2022
ACE EV Group, 3D IC, Glass, Adhesive, Temperature, Time, Memory, CFET-FM, 3D, ICS, ST, NIL, 300C, EVG, Booth, Industry, Nanotechnology, IR, Semiconductor, Technology, 4th floor, Solution, Silicon, Taipei Nangang Exhibition Center, Microelectromechanical systems, MEMS, Semiconductor device fabrication, 3D printing, Borosilicate glass, Printed circuit board

ST. FLORIAN, Austria, Sept. 12, 2022 /PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as semiconductor advanced packaging. NanoCleave is a fully front-end-compatible layer release technology that features an infrared (IR) laser that can pass through silicon, which is transparent to the IR laser wavelength. Coupled with the use of specially formulated inorganic layers, this technology enables an IR laser-initiated release of any ultra-thin film or layer from silicon carriers with nanometer precision.

Key Points: 
  • NanoCleave is a fully front-end-compatible layer release technology that features an infrared (IR) laser that can pass through silicon, which is transparent to the IR laser wavelength.
  • As a result, NanoCleave enables silicon wafer carriers in advanced packaging processes such as Fan-out Wafer-level Packaging (FoWLP) using mold and reconstituted wafers as well as interposers for 3D Stacked ICs (3D SIC).
  • Our NanoCleave layer release technology is a game-changer for semiconductor scaling through thin-layer and die stacking, with the potential to address the most pressing requirements of the industry.
  • Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

See Live Demos of PI's Motion Control for Precision Manufacturing Technology at IMTS 2022

Retrieved on: 
Wednesday, August 31, 2022
Research, Engineering, IMTS, Solution, Robotics, Semiconductor device fabrication, Science, XY, Quantum computing, Automation, List of life sciences, EtherCAT, XYZ, International, Silicon, PI, Silicon photonics, Industry, Motion, 3D printing

AUBURN, Mass., Aug. 31, 2022 /PRNewswire-PRWeb/ -- IMTS (International Manufacturing Technology Show) is known as the largest and longest-running biennial trade show in North America for the latest advancements in manufacturing engineering and applications. In Chicago, IL, PI's booth will feature the latest state-of-the-art precision motion and automation technologies including precision gantry and hexapod robotics, linear motor actuators and stages, and interactive displays of nanopositioning components, with PI engineers on-hand to answer questions and help you find the right solution for your precision motion project in industry, research, or science.

Key Points: 
  • AUBURN, Mass., Aug. 31, 2022 /PRNewswire-PRWeb/ -- IMTS (International Manufacturing Technology Show) is known as the largest and longest-running biennial trade show in North America for the latest advancements in manufacturing engineering and applications.
  • PI's high precision solutions and motion systems find applications in additive manufacturing, laser processing and machining, metrology, optics and camera module assembly, chip manufacturing, wafer inspection, and aerospace.
  • You can take a look at a variety of performance automation for manufacturing applications covered by PI system technologies.
  • Another way to learn about the latest motion control technologies is by signing up to one of our precision motion design webinars at this URL: https://www.pi-usa.us/en/news-events/webinars/

Avalanche Technology and FALINUX partner to build the next generation of Industrial Automation Human Machine Interface Products

Retrieved on: 
Monday, August 8, 2022
Transfer, Motor control, RAM, DSPS, ASSP, STT-MRAM, Technology, IOT, MCU-2/P protective mask, Business, Semiconductor device fabrication, Research, Industry, Parallel, MRAM, User interface, Marketing, Application-specific integrated circuit, Mark (given name), Family, Program, Linux, SRAM, Flash, Graphene production techniques, SOC, Logistics, Smart, HMI, ISO, Persistent, Computer data storage, Automation, Chemical substance, Avalanche

FREMONT, Calif., Aug. 08, 2022 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, announced today that it is providing Persistent SRAM (P-SRAM) products for industrial touch screen applications developed by FALINUX. FALINUX has designed in Avalanche's 8Mb High Performance Serial P-SRAM device into its next generation Human Machine Interface (HMI) products used in industrial automation systems.

Key Points: 
  • FREMONT, Calif., Aug. 08, 2022 /PRNewswire-PRWeb/ -- Avalanche Technology, the leader in next generation MRAM technology, announced today that it is providing Persistent SRAM (P-SRAM) products for industrial touch screen applications developed by FALINUX.
  • FALINUX has designed in Avalanche's 8Mb High Performance Serial P-SRAM device into its next generation Human Machine Interface (HMI) products used in industrial automation systems.
  • FALINUX designs and manufactures HMI systems for various industrial segments such as Logistics, Semiconductor Manufacturing, Chemical, Energy, Textile and Food production.
  • "Our second-generation industrial products all have a seamless upgrade path to eliminate the need for expensive redesigns in future system iterations."

New Multi-Axis, Ultra-Precision Motion Systems Showcasing at the 2022 Semicon West

Retrieved on: 
Wednesday, June 29, 2022
Quantum computing, Automation, Metrology, Silicon photonics, Solution, Semiconductor device fabrication, PI, List of life sciences, Silicon, Microscope

AUBURN, Mass., June 29, 2022 /PRNewswire-PRWeb/ -- PI's booth at the 2022 Semicon West will feature new high precision multi-axis motion systems for Wafer Inspection and Metrology along with high speed piezo mirror mounts for laser beam delivery and fast response focus scanners for surface metrology. Held in San Francisco, Semicon West offers hands-on and virtual access this year to the latest design and development systems and services created for the microelectronics supply chain.

Key Points: 
  • AUBURN, Mass., June 29, 2022 /PRNewswire-PRWeb/ -- PI's booth at the 2022 Semicon West will feature new high precision multi-axis motion systems for Wafer Inspection and Metrology along with high speed piezo mirror mounts for laser beam delivery and fast response focus scanners for surface metrology .
  • Held in San Francisco, Semicon West offers hands-on and virtual access this year to the latest design and development systems and services created for the microelectronics supply chain.
  • PI's high precision solutions and motion systems find applications in wafer inspection and metrology, wafer stealth dicing, nano-lithography, laser optics, and mask inspection.
  • Another way to learn about the latest motion control technologies is by signing up to one of our precision motion design webinars at this URL: https://www.pi-usa.us/en/news-events/webinars/

New Motion Systems Applications for 6-Axis Robotic Stages and Cartesian Linear Robots Showcased at the 2022 Robotics Summit

Retrieved on: 
Thursday, May 12, 2022
Automation, List of life sciences, Silicon photonics, Silicon, Summit, PI, Semiconductor device fabrication, Robotics, Quantum computing

AUBURN, Mass., May 12, 2022 /PRNewswire-PRWeb/ -- PI's booth at the 2022 Robotics Summit featured new applications for high precision 6-axis stages based on hexapod parallel kinematic robots and gantries (cartesian linear robots). Held annually in Boston, the Summit's expo offered hands on access to the latest design and development for producing robotics and intelligent robotic systems and services.

Key Points: 
  • New live demonstrations on multi-axis precision motion systems for performance automation.
  • AUBURN, Mass., May 12, 2022 /PRNewswire-PRWeb/ -- PI's booth at the 2022 Robotics Summit featured new applications for high precision 6-axis stages based on hexapod parallel kinematic robots and gantries (cartesian linear robots) .
  • Held annually in Boston, the Summit's expo offered hands on access to the latest design and development for producing robotics and intelligent robotic systems and services.
  • PI's high precision robotics solutions and motion systems find applications in micro-assembly, test & metrology, high speed multi-axis alignment of optics, camera lenses and panels, and laser machining.

SYNOPSYS ALERT: Bragar Eagel & Squire, P.C. is Investigating Synopsys, Inc. on Behalf of Synopsys Stockholders and Encourages Investors to Contact the Firm

Retrieved on: 
Wednesday, April 20, 2022
Legal, Professional Services, News, Telephone, Software, NASDAQ, Commerce, SMIC, SNPS, Semiconductor device fabrication, Technology, SHI International Corp, Jeanne Eagels, Semiconductor Manufacturing International Corporation, Security, U.S. Department of Commerce Office of Security, U.S. Department of Defense Strategy for Operating in Cyberspace, P.C, Mobile phone, Huawei, Synopsys, Industry

Bragar Eagel & Squire, P.C., a nationally recognized stockholder rights law firm, is investigating potential claims against Synopsys, Inc. (Synopsys or the Company) (NASDAQ: SNPS) on behalf of Synopsys stockholders.

Key Points: 
  • Bragar Eagel & Squire, P.C., a nationally recognized stockholder rights law firm, is investigating potential claims against Synopsys, Inc. (Synopsys or the Company) (NASDAQ: SNPS) on behalf of Synopsys stockholders.
  • Our investigation concerns whether Synopsys has violated the federal securities laws and/or engaged in other unlawful business practices.
  • On April 13, 2022, news outlets reported that Synopsys is under investigation by the U.S. Department of Commerce.
  • On this news, Synopsys share price fell $4.11 to close at $306.72 per share on April 13, 2022, thereby injuring investors.

SYNOPSYS ALERT: Bragar Eagel & Squire, P.C. is Investigating Synopsys, Inc. on Behalf of Synopsys Stockholders and Encourages Investors to Contact the Firm

Retrieved on: 
Tuesday, April 19, 2022
Legal, Professional Services, News, Telephone, Software, NASDAQ, Commerce, SMIC, SNPS, Semiconductor device fabrication, Technology, SHI International Corp, Jeanne Eagels, Semiconductor Manufacturing International Corporation, Security, U.S. Department of Commerce Office of Security, U.S. Department of Defense Strategy for Operating in Cyberspace, P.C, Mobile phone, Huawei, Synopsys, Industry

Bragar Eagel & Squire, P.C., a nationally recognized stockholder rights law firm, is investigating potential claims against Synopsys, Inc. (Synopsys or the Company) (NASDAQ: SNPS) on behalf of Synopsys stockholders.

Key Points: 
  • Bragar Eagel & Squire, P.C., a nationally recognized stockholder rights law firm, is investigating potential claims against Synopsys, Inc. (Synopsys or the Company) (NASDAQ: SNPS) on behalf of Synopsys stockholders.
  • Our investigation concerns whether Synopsys has violated the federal securities laws and/or engaged in other unlawful business practices.
  • On April 13, 2022, news outlets reported that Synopsys is under investigation by the U.S. Department of Commerce.
  • On this news, Synopsys share price fell $4.11 to close at $306.72 per share on April 13, 2022, thereby injuring investors.