STT-MRAM

Everspin Reports Unaudited Fourth Quarter and Full Year 2023 Financial Results

Retrieved on: 
Wednesday, February 28, 2024

Everspin Technologies, Inc. (NASDAQ: MRAM), the market leader in MRAM, today announced preliminary unaudited financial results for the fourth quarter and full year ended December 31, 2023.

Key Points: 
  • Everspin Technologies, Inc. (NASDAQ: MRAM), the market leader in MRAM, today announced preliminary unaudited financial results for the fourth quarter and full year ended December 31, 2023.
  • Licensing, royalties, patents, and other revenue of $4.3 million, compared to $1.1 million in the fourth quarter of 2022.
  • GAAP operating expenses of $8.1 million, compared to $7.5 million in the fourth quarter of 2022.
  • Everspin encourages investors to review its financial statements and publicly filed reports in their entirety and not to rely on any single financial measure.

Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs

Retrieved on: 
Wednesday, February 21, 2024

It achieves a random read access frequency of over 200 MHz and a write throughput of 10.4-megabytes-per-second (MB/s).

Key Points: 
  • It achieves a random read access frequency of over 200 MHz and a write throughput of 10.4-megabytes-per-second (MB/s).
  • View the full release here: https://www.businesswire.com/news/home/20240221234586/en/
    Renesas test chip with breakthrough fast write and fast read technology.
  • As IoT and AI technologies continue to advance, MCUs used in endpoint devices are expected to deliver higher performance than ever.
  • To address these challenges, Renesas has developed the following new circuit technologies to achieve faster read and write operations in MRAM.

New High-Density Ceramic Column Grid Array STT-MRAM Optimally Designed for Space and the Harshest Environments

Retrieved on: 
Friday, February 23, 2024

The Micross co-fired Ceramic Column Grid Array package is the latest addition to our Hi-Reliability MRAM solutions for Space applications that will benefit from improved thermal stress related, electro-mechanical failures.

Key Points: 
  • The Micross co-fired Ceramic Column Grid Array package is the latest addition to our Hi-Reliability MRAM solutions for Space applications that will benefit from improved thermal stress related, electro-mechanical failures.
  • This new package offering is made possible via our Column Last Attach Solder Process (CLASP), licensed from IBM promoting a highly robust thermal shock & stress survivability option for our Hermetic fine pitch packages.
  • Perpendicular Spin-Torque MRAM devices offer inherent protection from harsh environments, and the best power profile of all non-volatile memories – making them optimally suited for hi-reliability aerospace and space applications.
  • Micross' licensed CLASP column attach process utilizes a Sn10Pb90 solder wire that is attached to the parent Land Grid package via a eutectic Palladium doped Sn63Pb37 solder attach process.

ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM

Retrieved on: 
Wednesday, January 17, 2024

This SOT-MRAM array chip showcases an innovative computing in memory architecture and boasts a power consumption of merely one percent of a spin-transfer torque magnetic random-access memory (STT-MRAM) product.

Key Points: 
  • This SOT-MRAM array chip showcases an innovative computing in memory architecture and boasts a power consumption of merely one percent of a spin-transfer torque magnetic random-access memory (STT-MRAM) product.
  • Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at ITRI, highlighted the collaborative achievements of both organizations.
  • And its overall computing performance can be further enhanced when integrated with computing in memory circuit design.
  • Looking ahead, this technology holds the potential for applications in high-performance computing (HPC), artificial intelligence (AI), automotive chips, and more."

Avalanche Technology Presents "Dual QSPI 8Gb STT-MRAM Solutions for Space Applications" at the 2023 IEDM Conference

Retrieved on: 
Monday, December 4, 2023

FREMONT, Calif., Dec. 4, 2023 /PRNewswire-PRWeb/ -- Avalanche Technology continues to demonstrate industry leadership of both technology development and commercialization of the most advanced next-generation MRAM platform solutions for the Space Industry. Avalanche will present "Dual QSPI 8Gb STT-MRAM Solutions for Space Applications" at the 2023 IEEE International Electron Devices Meeting (IEDM), held in San Francisco, CA December 9th-13th. The presentation will provide attendees with a comprehensive overview of the technical specifications, design considerations, and real-world applications of Avalanche's most advanced Spin Transfer Torque (STT) MRAM devices for space applications. The company invites industry experts, researchers, and space technology enthusiasts to explore the potential of this groundbreaking innovation.

Key Points: 
  • Avalanche will present "Dual QSPI 8Gb STT-MRAM Solutions for Space Applications" at the 2023 IEEE International Electron Devices Meeting (IEDM), held in San Francisco, CA December 9th-13th.
  • The presentation will provide attendees with a comprehensive overview of the technical specifications, design considerations, and real-world applications of Avalanche's most advanced Spin Transfer Torque (STT) MRAM devices for space applications.
  • The company invites industry experts, researchers, and space technology enthusiasts to explore the potential of this groundbreaking innovation.
  • IEDM is the world's preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling.

DNA Data Storage Market worth $3,348 million by 2030 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, November 6, 2023

Cloud based DNA data storage to hold the largest share of the DNA data storage market during the forecast period.

Key Points: 
  • Cloud based DNA data storage to hold the largest share of the DNA data storage market during the forecast period.
  • Sequence-based DNA data storage segment is expected to be the fastest growing market of the DNA data storage market during the forecast period.
  • Sequence-based DNA data storage is a type of DNA data storage in which data is encoded in the sequence of DNA bases.
  • However, sequence-based DNA data storage is expected to be less durability and more expensive in comparison to structure-based DNA data storage.

DNA Data Storage Market worth $3,348 million by 2030 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, November 6, 2023

Cloud based DNA data storage to hold the largest share of the DNA data storage market during the forecast period.

Key Points: 
  • Cloud based DNA data storage to hold the largest share of the DNA data storage market during the forecast period.
  • Sequence-based DNA data storage segment is expected to be the fastest growing market of the DNA data storage market during the forecast period.
  • Sequence-based DNA data storage is a type of DNA data storage in which data is encoded in the sequence of DNA bases.
  • However, sequence-based DNA data storage is expected to be less durability and more expensive in comparison to structure-based DNA data storage.

Everspin Reports Unaudited Third Quarter 2023 Financial Results

Retrieved on: 
Wednesday, November 1, 2023

Everspin Technologies, Inc. (NASDAQ: MRAM), the market leader in MRAM, today announced preliminary unaudited financial results for the third quarter ended September 30, 2023.

Key Points: 
  • Everspin Technologies, Inc. (NASDAQ: MRAM), the market leader in MRAM, today announced preliminary unaudited financial results for the third quarter ended September 30, 2023.
  • Gross margin was 60.2%, compared to 58.4% in the second quarter of 2023 and 58.8% in the third quarter of 2022.
  • GAAP operating expenses were $7.9 million 2023, compared to $7.6 million in the second quarter of 2023 and $7.1 million in the third quarter of 2022.
  • Everspin encourages investors to review its financial statements and publicly-filed reports in their entirety and not to rely on any single financial measure.

Everspin Announces Expansion of Industrial STT-MRAM Devices

Retrieved on: 
Tuesday, October 17, 2023

In addition to the new capacity and smaller packaging, Everspin is delivering an extended temperature range in the EMxxLX products of -40⁰C to 105⁰C.

Key Points: 
  • In addition to the new capacity and smaller packaging, Everspin is delivering an extended temperature range in the EMxxLX products of -40⁰C to 105⁰C.
  • The EMxxLX family can replace alternative solutions, such as SRAM, BBSRAM, FRAM, NVSRAM, and NOR flash devices.
  • With the addition of a 4Mb capacity option, our MRAM devices provide even more options to select the optimal density solutions.
  • Everspin MRAM delivers the industry’s most robust, highest performance non-volatile memory for Industrial IoT, Data Center, Automotive, and other mission-critical applications where data persistence is paramount.

Everspin Reports Unaudited Second Quarter 2023 Financial Results

Retrieved on: 
Wednesday, August 2, 2023

Everspin Technologies, Inc. (NASDAQ: MRAM), the market leader in MRAM, today announced preliminary unaudited financial results for the second quarter ended June 30, 2023.

Key Points: 
  • Everspin Technologies, Inc. (NASDAQ: MRAM), the market leader in MRAM, today announced preliminary unaudited financial results for the second quarter ended June 30, 2023.
  • Gross margin for the second quarter of 2023 was 58.4%, compared to 56.8% in the first quarter of 2023 and 58.4% in the second quarter of 2022.
  • GAAP operating expenses were $7.6 million in the second quarter of 2023, compared to $7.7 million in the first quarter of 2023 and $6.9 million in the second quarter of 2022.
  • Everspin generated cash flows from operating activities of $6.3 million in the second quarter of 2023, compared to $1.2 million in the first quarter of 2023, and $4.3 million in the second quarter of 2022.