Aehr Receives $1.4 Million in Orders for Full-Wafer WaferPak™ Contactors for Production Test and Burn-in of Silicon Carbide Devices
Gayn Erickson, President and CEO ofAehr Test Systems, commented, Theseordersfrom our lead silicon carbide customerforour proprietary WaferPak Contactors accompanies the order we announced on June 1stfor anadditionalFOX-XPproduction testsystemandreflectstheir increased high volume production capacity needs.
- Gayn Erickson, President and CEO ofAehr Test Systems, commented, Theseordersfrom our lead silicon carbide customerforour proprietary WaferPak Contactors accompanies the order we announced on June 1stfor anadditionalFOX-XPproduction testsystemandreflectstheir increased high volume production capacity needs.
- This FOX-XP systemisconfigured to test eighteen silicon carbide wafers in parallel while contacting and testing 100% of the devices on each wafer.
- Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test.
- The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices.