Semiconductor device fabrication

Aehr Receives $1.4 Million in Orders for Full-Wafer WaferPak™ Contactors for Production Test and Burn-in of Silicon Carbide Devices

Retrieved on: 
Tuesday, June 29, 2021
Materials, Technology, Semiconductor device fabrication, Science and technology, Digital electronics, Wafer, Integrated circuits, Microcontroller, Die, Silicon carbide, Microprocessor

Gayn Erickson, President and CEO ofAehr Test Systems, commented, Theseordersfrom our lead silicon carbide customerforour proprietary WaferPak Contactors accompanies the order we announced on June 1stfor anadditionalFOX-XPproduction testsystemandreflectstheir increased high volume production capacity needs.

Key Points: 
  • Gayn Erickson, President and CEO ofAehr Test Systems, commented, Theseordersfrom our lead silicon carbide customerforour proprietary WaferPak Contactors accompanies the order we announced on June 1stfor anadditionalFOX-XPproduction testsystemandreflectstheir increased high volume production capacity needs.
  • This FOX-XP systemisconfigured to test eighteen silicon carbide wafers in parallel while contacting and testing 100% of the devices on each wafer.
  • Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test.
  • The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices.

AMD Leads High Performance Computing Towards Exascale and Beyond

Retrieved on: 
Monday, June 28, 2021
Fabless semiconductor companies, Advanced Micro Devices, Semiconductor device fabrication, Computing, Epyc, Computers, GPGPU, ATI Technologies, Parallel computing

High performance computing is critical to addressing the world's biggest and most important challenges, said Forrest Norrod, senior vice president and general manager, data center and embedded systems group, AMD.

Key Points: 
  • High performance computing is critical to addressing the world's biggest and most important challenges, said Forrest Norrod, senior vice president and general manager, data center and embedded systems group, AMD.
  • With our AMD EPYC processor family and Instinct accelerators, AMD continues to be the partner of choice for HPC.
  • AMD is introducing its new AMD Instinct Education and Research (AIER) initiative , designed to help scientists, researchers and academics accelerate the performance of their code on AMD Instinct Accelerators.
  • Visit the AMD virtual booth at ISC 21 to learn more about AMD solutions for HPC and talk with AMD experts.

NTI Commended by Frost & Sullivan for Its Proprietary Technology for Nanofilm Deposition, the Filtered Cathodic Vacuum Arc (FCVA)

Retrieved on: 
Monday, June 28, 2021
Materials, Articles, Industrial processes, Materials science, Matter, Nitrides, Superhard materials, Semiconductor device fabrication, Coating, Deposition, Titanium nitride, Nuclear Threat Initiative

NTI has developed a revolutionary filtered cathodic vacuum arc (FCVA) technology that leverages a plasma source and electromagnetic waves to create high-quality coatings.

Key Points: 
  • NTI has developed a revolutionary filtered cathodic vacuum arc (FCVA) technology that leverages a plasma source and electromagnetic waves to create high-quality coatings.
  • "FCVA's advanced materials seamlessly enhance the average useful life of customers' end products," said Monami Dey, Senior Research Analyst, Frost & Sullivan.
  • NTI continually engages with customers to design and develop proprietary coatings for end products to achieve the desired functional and aesthetic properties.
  • "Its superior technology allows it to deliver top-notch alternatives to existing nanofilm deposition techniques while providing additional enhancements and properties."

NTI Commended by Frost & Sullivan for Its Proprietary Technology for Nanofilm Deposition, the Filtered Cathodic Vacuum Arc (FCVA)

Retrieved on: 
Monday, June 28, 2021
Materials, Articles, Industrial processes, Materials science, Matter, Nitrides, Superhard materials, Semiconductor device fabrication, Coating, Deposition, Titanium nitride, Nuclear Threat Initiative

NTI has developed a revolutionary filtered cathodic vacuum arc (FCVA) technology that leverages a plasma source and electromagnetic waves to create high-quality coatings.

Key Points: 
  • NTI has developed a revolutionary filtered cathodic vacuum arc (FCVA) technology that leverages a plasma source and electromagnetic waves to create high-quality coatings.
  • "FCVA's advanced materials seamlessly enhance the average useful life of customers' end products," said Monami Dey, Senior Research Analyst, Frost & Sullivan.
  • NTI continually engages with customers to design and develop proprietary coatings for end products to achieve the desired functional and aesthetic properties.
  • "Its superior technology allows it to deliver top-notch alternatives to existing nanofilm deposition techniques while providing additional enhancements and properties."

Taiwanese Semiconductor Manufacturing Industry, 1Q 2021 Report Featuring Inotera, Nanya, Powerchip, TSMC, UMC, VIS, Winbon - ResearchAndMarkets.com

Retrieved on: 
Friday, June 25, 2021
Technology, Semiconductor, Semiconductor device fabrication, Wafer, Electronics industry, Semiconductor devices, Industry economics)

The "Taiwanese Semiconductor Manufacturing Industry, 1Q 2021" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Taiwanese Semiconductor Manufacturing Industry, 1Q 2021" report has been added to ResearchAndMarkets.com's offering.
  • This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry.
  • Taiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2019 - 2Q 2021
    Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2019 - 2Q 2021
    Taiwanese Semiconductor Manufacturing Industry 8"-equiv.
  • Wafer Shipment Volume and Utilization Rate, 1Q 2019 - 2Q 2021
    Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2019 - 2Q 2021
    Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2019 - 4Q 2020
    Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Business Type, 1Q 2019 - 4Q 2020
    Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2019 - 4Q 2020
    Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume by Business Type, 1Q 2019 - 4Q 2020
    Taiwanese Foundry Industry Shipment Value Ranking, 1Q 2019 - 4Q 2020
    Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2019 - 4Q 2020
    Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2019 - 4Q 2020
    Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2019 - 4Q 2020
    Taiwanese DRAM Industry's 8"-equiv.

Heidelberg Instruments Announces Significant Partnership with Large Asia Based Photomask Production Group

Retrieved on: 
Thursday, June 24, 2021
Visual arts, Photomask, Lithography, Nanolithography, Semiconductor device fabrication

HEIDELBERG, Germany, June 24, 2021 /PRNewswire-PRWeb/ -- Heidelberg Instruments, a leading laser lithography and nanofabrication equipment manufacturer, today announced the biggest single order in its history.

Key Points: 
  • HEIDELBERG, Germany, June 24, 2021 /PRNewswire-PRWeb/ -- Heidelberg Instruments, a leading laser lithography and nanofabrication equipment manufacturer, today announced the biggest single order in its history.
  • This purchase, by a key photomask production group in Asia, includes two systems: a VPG+1400 for producing display photomasks and an ULTRA200 for semiconductor photomask applications.
  • "We are very excited about this project, especially as it comes from an existing customer who meticulously evaluated our technology against competitive solutions", said Steffen Diez, COO of Heidelberg Instruments.
  • "With the ULTRA200 and VPG+1400 we have introduced ideal solutions for the production of non-critical semiconductor and color filter photomasks."

STMicroelectronics brings Tower Semiconductor on board 300mm analog and power fab under construction in Italy

Retrieved on: 
Thursday, June 24, 2021
Semiconductor device fabrication, Electronic design, Mixed-signal integrated circuit, Semiconductor fabrication plant, Analog television, Electronic engineering, Technology, Secondary sector of the economy

The fab is expected to be ready for equipment installation later this year and start production in the second half of 2022.

Key Points: 
  • The fab is expected to be ready for equipment installation later this year and start production in the second half of 2022.
  • Both companies will invest in their respective process equipment and work together on the acceleration of the fab qualification and subsequent ramp-up.
  • In the early stage 130, 90 and 65nm processes for smart power, analog mixed signal and RF processes will be qualified in R3.
  • With Tower we have a great partner for analog, power and mixed-signal volume manufacturing that will enable us to qualify and ramp up the Agrate R3 300mm fab significantly faster.

STMicroelectronics brings Tower Semiconductor on board 300mm analog and power fab under construction in Italy

Retrieved on: 
Thursday, June 24, 2021
Semiconductor device fabrication, Electronic design, Mixed-signal integrated circuit, Semiconductor fabrication plant, Analog television, Electronic engineering, Technology, Secondary sector of the economy

The fab is expected to be ready for equipment installation later this year and start production in the second half of 2022.

Key Points: 
  • The fab is expected to be ready for equipment installation later this year and start production in the second half of 2022.
  • Both companies will invest in their respective process equipment and work together on the acceleration of the fab qualification and subsequent ramp-up.
  • In the early stage 130, 90 and 65nm processes for smart power, analog mixed signal and RF processes will be qualified in R3.
  • With Tower we have a great partner for analog, power and mixed-signal volume manufacturing that will enable us to qualify and ramp up the Agrate R3 300mm fab significantly faster.

The Worldwide Gallium Nitride Semiconductor Devices Industry is Expected to Reach $24.9 Billion by 2026 at a CAGR of 5.2% from 2021

Retrieved on: 
Wednesday, June 23, 2021
Chemistry, Physical sciences, Chemical compounds, Gallium nitride, Nitrides, Semiconductor device, SEMI, Semiconductor device fabrication, Electronics and semiconductor manufacturing industry in India, Electronics industry

The global GaN semiconductor devices market is estimated to be USD 19.4 billion in 2021 and is projected to reach USD 24.9 billion by 2026, at a CAGR of 5.2% during the forecast period.

Key Points: 
  • The global GaN semiconductor devices market is estimated to be USD 19.4 billion in 2021 and is projected to reach USD 24.9 billion by 2026, at a CAGR of 5.2% during the forecast period.
  • The opto-semiconductors segment for the GaN semiconductor device market is projected to hold the largest market share in 2026, by device type.
  • The renewables segment for the GaN semiconductor device market is estimated to register the highest CAGR growth during the forecast period, by vertical.
  • APAC is projected to register the largest market size of the GaN semiconductor device market by 2026.

Worldwide Wafer Handling Robots Industry to 2026 - by Component, Type and Geography

Retrieved on: 
Tuesday, June 22, 2021
Semiconductor device fabrication, Wafer, SEMI, Robot, Technology, Science and technology, SMIF

DUBLIN, June 22, 2021 /PRNewswire/ -- The "Wafer Handling Robots Market - Forecasts from 2021 to 2026" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, June 22, 2021 /PRNewswire/ -- The "Wafer Handling Robots Market - Forecasts from 2021 to 2026" report has been added to ResearchAndMarkets.com's offering.
  • Wafer handling robots are used for wide operations in the manufacturing process of wafers and their applications in the semiconductor industry.
  • This provides growth prospects for the wafer handling robots market.
  • Burgeoning demand for wafers will provide the market potential for the wafer handling robots industry.