EVG

Flash News: OKX Ventures Partner Jeff Ren Discusses the Future of Web3 at HK Web3 Festival Side Events

Retrieved on: 
Tuesday, April 9, 2024

HONG KONG, April 9, 2024 /PRNewswire/ -- OKX Ventures , the investment arm of leading Web3 technology company OKX , has issued updates for April 9, 2024.

Key Points: 
  • HONG KONG, April 9, 2024 /PRNewswire/ -- OKX Ventures , the investment arm of leading Web3 technology company OKX , has issued updates for April 9, 2024.
  • OKX Ventures Partner Jeff Ren recently delivered impactful opening speeches at two side events - 'EVG full-day demo day' and 'Happy Hour: Network & Drinks with OKX X Layer Community' during the recent Hong Kong Web3 Festival, which began on April 6 and ends on April 9.
  • The first event, 'EVG full-day demo day,' co-hosted by Everest Ventures Group (EVG) and X Layer , provided a full day of market insights, demos and networking.
  • Jeff's speech also highlighted OKX Ventures' efforts in investing in Layer 2, DeFi, Web3, NFT, metaverse projects and many others.

EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing with EVG®850 NanoCleave™ System

Retrieved on: 
Thursday, December 7, 2023

ST. FLORIAN, Austria, Dec. 7, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®850 NanoCleave™ layer release system—the first product platform to feature EVG's revolutionary NanoCleave technology. The EVG850 NanoCleave system enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an infrared (IR) laser coupled with specially formulated inorganic release materials in a proven, high-volume-manufacturing (HVM) capable platform. As a result, the EVG850 NanoCleave eliminates the need for glass carriers—enabling ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory and power device formation, to support future 3D integration roadmaps. 

Key Points: 
  • In addition, organic adhesives are generally limited to processing temperatures below 300 °C,  limiting their use to back-end processing.
  • Silicon carriers and inorganic release layers support process cleanliness, material compatibility and high processing temperature requirements for front-end manufacturing flows.
  • The layer transfer process also eliminates the need for expensive solvents associated with carrier wafer grinding, polishing and etching.
  • For more information on the EVG850 NanoCleave layer release system, visit https://www.evgroup.com/products/bonding/temporary-bonding-and-debonding... .

EV GROUP COMPLETES CONSTRUCTION OF NEW MANUFACTURING V BUILDING AT CORPORATE HEADQUARTERS TO EXPAND PRODUCTION CAPACITY

Retrieved on: 
Tuesday, November 28, 2023

ST. FLORIAN, Austria, Nov. 28, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction work for the next expansion phase of its corporate headquarters. The new "Manufacturing V" facility, which is now open and serves as the manufacturing department for EVG equipment components, provides a significant increase in production floor and warehouse space. The opening of the Manufacturing V facility is the latest in a series of expansion phases and investments driven by continued strong demand for EVG's hybrid bonding and other process solutions and process development services to support the rapidly growing advanced packaging and 3D/heterogeneous integration market.

Key Points: 
  • The new "Manufacturing V" facility, which is now open and serves as the manufacturing department for EVG equipment components, provides a significant increase in production floor and warehouse space.
  • EVG's state-of-the-art Manufacturing V facility adds more than 1200 m2 of additional production floor space (for a total of more than 8100 m2 of production area), and more than 1200 m2 of warehouse space.
  • Since embarking on these two most recent growth phases, EVG has expanded its production capacity by more than 60 percent.
  • As key process enablers for 3D/heterogeneous integration, fusion and hybrid bonding have been transformed into the new scaling mechanism for semiconductor manufacturing.

SILICON AUSTRIA LABS AND EV GROUP STRENGTHEN COLLABORATION IN OPTICAL TECHNOLOGY RESEARCH

Retrieved on: 
Monday, November 13, 2023

ST. FLORIAN, Austria and GRAZ, Austria, Nov. 13, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Silicon Austria Labs (SAL), Austria's leading research center for Electronic Based Systems (EBS), today announced that SAL has received and installed multiple EVG lithography and resist processing systems at its MicroFab R&D cleanroom facility in Villach, Austria. The installations are part of a strengthened collaboration between the two companies to accelerate the development and deployment of advanced optical technologies for heterogeneous integration applications, including wafer-level optics used for micro cameras and micro-mirrors, diffractive optics, and automotive optics used to enable autonomous driving and automotive lighting.

Key Points: 
  • The newly installed EVG systems include the LITHOSCALE® maskless exposure system, the EVG®7300 automated SmartNIL® nanoimprint and wafer-level optics system, as well as multiple complementary resist processing systems.
  • According to Dr. Mohssen Moridi, Head of Research Division Microsystems at Silicon Austria Labs, "We have recently been immersed in a range of cutting-edge R&D projects spanning meta-optics, integrated photonics, and MEMS, necessitating the use of advanced lithography and bonding tools.
  • Its applications extend to diverse fields such as smart lighting systems, AR/VR, automotive optics, telecommunication, and quantum technology."
  • According to Thomas Glinsner, corporate technology director at EV Group, "Silicon Austria Labs is a leading research center for optical miniaturization and heterogeneous integration, and is a strategic partner for EV Group.

ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions

Retrieved on: 
Wednesday, September 20, 2023

To assist the industry in grasping the key to high-end semiconductor manufacturing and integration capabilities, the Heterogeneous Integrated Chiplet System Package ( Hi-CHIP ) Alliance brings together leading semiconductor companies from Taiwan and around the world to provide comprehensive services, spanning from packaging design, testing and verification, to pilot production.

Key Points: 
  • To assist the industry in grasping the key to high-end semiconductor manufacturing and integration capabilities, the Heterogeneous Integrated Chiplet System Package ( Hi-CHIP ) Alliance brings together leading semiconductor companies from Taiwan and around the world to provide comprehensive services, spanning from packaging design, testing and verification, to pilot production.
  • Looking forward, the alliance is set to actively explore its global market potential.
  • ITRI has been committed to developing manufacturing technologies and upgrading materials and equipment to enhance heterogeneous integration technologies.
  • The objective is to nurture international partnerships, fuel technological advancements in equipment and materials, and propel the semiconductor industry to new horizons.

EV GROUP SCORES BIG WITH ELEVENTH CONSECUTIVE TRIPLE CROWN WIN IN TechInsights 2023 CUSTOMER SATISFACTION SURVEY

Retrieved on: 
Tuesday, June 27, 2023

ST. FLORIAN, Austria, June 27, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced that it has once again been voted by customers as one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of the 2023 THE BEST Suppliers of Fab Equipment in the 2023 TechInsights Customer Satisfaction Survey, increasing its score in both award segments compared to last year's listings as well as earning a 5 Star rating in both segments for the second time in a row. EVG also received a RANKED 1st in Specialty Fab Equipment award again this year, marking the 11th year in a row that it has received all three customer satisfaction awards.

Key Points: 
  • EVG also received a RANKED 1st in Specialty Fab Equipment award again this year, marking the 11th year in a row that it has received all three customer satisfaction awards.
  • A white paper detailing EVG's survey results issued by TechInsights is available at: https://bit.ly/evgtechinsights23 .
  • Demonstrating this, customers awarded EVG higher ratings for the sixth consecutive year in TechInsights' Customer Satisfaction Survey.
  • "We are grateful and humbled by the continued recognition that we receive from our customers in the annual TechInsights Customer Satisfaction survey," stated Hermann Waltl, executive sales and customer support director at EV Group.

Cardano as a Bridge: Adaverse's Investments and Acceleration in Africa and Asia

Retrieved on: 
Thursday, May 4, 2023

Adaverse has established strong brand recognition in Africa and Asia and has expanded its business scope worldwide.

Key Points: 
  • Adaverse has established strong brand recognition in Africa and Asia and has expanded its business scope worldwide.
  • This strategic partnership has given Adaverse unparalleled access to the Cardano ecosystem, which it uses to support portfolio companies and investment partners alike.
  • Adaverse's aim to connect Africa with Asia through the Cardano ecosystem is based on the belief that developing countries lacking financial tools, such as Africa, Asia, and Latin America, represent both a challenge and an opportunity.
  • Adaverse is also devoted to connecting the African market with other global markets, such as Asia and the United States.

Pure Storage Helps EV Group Bring Products to Market Faster and Continue to Grow Rapidly with Modern Storage Technology

Retrieved on: 
Wednesday, April 19, 2023

MOUNTAIN VIEW, Calif., April 19, 2023 /PRNewswire/ -- Pure Storage®, (NYSE: PSTG), the IT pioneer that delivers the world's most advanced data storage technology and services, today announced that EV Group (EVG), a leading provider of production systems and process solutions for wafer processing in the semiconductor industry, microsystems technology and nanotechnology, has selected the Pure Storage portfolio - including Pure Storage FlashArray™, Evergreen//Forever™ and Pure1® - to bring new solutions to market faster and compete on a global scale.

Key Points: 
  • With increasing demand for semiconductor technologies, EVG recognized the need to bring new, differentiated solutions to market faster.
  • To support its storage infrastructure efforts, the company turned to Pure Storage.
  • Implementing Pure Storage solutions has enabled EVG to continue to drive global growth and gain a competitive advantage in the marketplace with a flexible, scalable storage infrastructure.
  • Intuitive storage management: Pure1, Pure Storage's AI-driven management platform, is a powerful and simple tool that helps EVG manage its storage infrastructure.

EV Group and Notion Systems Team Up to Combine Nanoimprint Lithography with Inkjet Coating for New High-Volume-Manufacturing Applications

Retrieved on: 
Monday, April 17, 2023

ST. FLORIAN, Austria and SCHWETZINGEN, Germany, April 17, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Notion Systems, a leading supplier of industrial inkjet coating systems for functional materials, today announced that they have entered into an agreement to develop the first fully integrated and automated nanoimprint lithography (NIL) solution with inkjet coating capabilities.

Key Points: 
  • Per the joint agreement, the two companies will develop a customized inkjet module to be integrated in EVG's industry-benchmark HERCULES® NIL platform based on EVG's SmartNIL® technology.
  • Through this partnership, EVG further cements its leadership in NIL with inkjet capabilities in a fully integrated and automated NIL solution.
  • This unique deposition approach can also reduce material consumption, resulting in significant cost savings associated with nanoimprint resists.
  • "We are pleased to be partnering with EV Group on this important development for the NIL market," stated Dr. Kai Keller, VP Business Development, Notion Systems.

EV GROUP ADVANCES LEADERSHIP IN OPTICAL LITHOGRAPHY WITH NEXT-GENERATION EVG150 RESIST PROCESSING PLATFORM

Retrieved on: 
Monday, November 7, 2022

ST. FLORIAN, Austria, Nov. 7, 2022 /PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has strengthened its portfolio of optical lithography solutions with the unveiling of the next-generation 200-mm version of its EVG®150 automated resist processing system. The redesigned EVG150 platform includes advanced features and enhancements that provide even greater throughput (by up to 80 percent) and versatility, as well as smaller tool footprint (by nearly 50 percent), compared to the previous-generation platform. The EVG150 provides reliable and high-quality coating and developing processes in a universal platform that supports a variety of devices and applications, including advanced packaging, MEMS, radio frequency (RF), 3D sensing, power electronics, and photonics. Its high throughput, flexibility and repeatability support the most demanding needs for both high-volume production and industrial development.

Key Points: 
  • Company executives will be available to discuss the next-generation EVG150 resist processing system at SEMICON Europa, taking place next week at the Messe Mnchen in Munich, Germany, from November 15-18 (co-located with Electronica).
  • Silicon Austria Labs, a leading research center for Electronic Based Systems (EBS), is the first customer to receive the next-generation EVG150 system.
  • EVG is now accepting orders for the next-generation EVG150 automated resist processing system, and is offering product demonstrations at EVG's headquarters.
  • Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.