Shenzhen:300638

Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024

Retrieved on: 
Wednesday, April 10, 2024
Internet, Ipcs, POS, AI, Heart, Business development, Partnership, Communication, Automation, Qualcomm, Robotics, Perception, Fourth Industrial Revolution

At the "heart" of Industry 4.0, interoperability is crucial for operators to get insights into the equipment's performance in the field.

Key Points: 
  • At the "heart" of Industry 4.0, interoperability is crucial for operators to get insights into the equipment's performance in the field.
  • This groundbreaking series solutions is poised to advance the industrial applications that demand wireless connection, high-integration expertise with design-in Linux operating system for easy integration, and long-term product lifecycle optimization.
  • By adopting Linux-supported Fibocom's smart modules, Linux engineers around the world have the ability to develop industrial devices such as industrial PCs (IPCs), edge AI workstations, smart POS terminals, and industrial routers with higher efficiency as well as potent multimedia processing capabilities.
  • The Linux-based Edge AI Solutions are highly flexible and customizable compatible with industrial standards, and can be widely deployed in industrial PCs (IPCs), industrial cameras, edge AI workstations, smart POS terminals, and robotics.

Fibocom's 5G Premium Smart Module SC171 Awarded as the Best-in-Show Embedded Computing Design at Embedded World 2024

Retrieved on: 
Tuesday, April 9, 2024
GPU, Communication, Artificial intelligence of things, EVP, Wi-Fi 6, Embedded, Qualcomm, Internet, Electronics, Linux, Microsoft Windows, Mining, CPU, HD, MIMO, Android, Mobile phone

Based on the Qualcomm QCM6490 chipset, the module delivers up to 12 TOPS computing capabilities and supports mainstream 5G frequency bands for high-speed, reliable connectivity.

Key Points: 
  • Based on the Qualcomm QCM6490 chipset, the module delivers up to 12 TOPS computing capabilities and supports mainstream 5G frequency bands for high-speed, reliable connectivity.
  • Notably, the module now has been deployed in the 5G mining scenario to ensure an intelligent and robust wireless connection.
  • Designed for high-end AIoT applications, Fibocom SC171 was selected by Sany (customer) to develop their 5G AR helmet for digital transformation in the mining industry.
  • Fibocom SC171 is an industry-piloting 5G smart module powered by the Qualcomm QCM6490 with a powerful CPU and a GPU to support rich AI algorithm integration, and up to 12 TOPS computing capabilities.

Fibocom Collaborates with STMicroelectronics to Debut Smart Home Solution at MWC Barcelona 2024

Retrieved on: 
Tuesday, February 27, 2024
Tao, Marketing, UART, Microcontroller, FWA, CPE, Wireless, Connectivity Standards Alliance, Zigbee, Partnership, Electronics, MWC, Language, Bit, Communication, STMicroelectronics, MCU, Ecosystem, Connectivity, Acceleration, Imagination, MBB, Tablet, Internet, Mobile World Congress, Television

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a leading global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, today announced the collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in launching the industry-leading smart home solution leveraging the Matter-compatible technologies, STM32WB55 and FG370. It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.

Key Points: 
  • It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.
  • In collaboration with STMicroelectronics, Fibocom has integrated the smart home solution into 5G CPE in conjunction with ST's MCU STM32WB55 and Fibocom's 5G module FG370.
  • Looking forward, the partnership with the ecosystem will strengthen and tighten the acceleration of smart home solution in a unified platform."
  • Learn more about Fibocom's smart home solution at booth #5I33 in hall 5 during MWC Barcelona 2024.

Fibocom Collaborates with STMicroelectronics to Debut Smart Home Solution at MWC Barcelona 2024

Retrieved on: 
Tuesday, February 27, 2024
Tao, Marketing, UART, Microcontroller, FWA, CPE, Wireless, Connectivity Standards Alliance, Zigbee, Partnership, Electronics, MWC, Language, Bit, Communication, STMicroelectronics, MCU, Ecosystem, Connectivity, Acceleration, Imagination, MBB, Tablet, Internet, Mobile World Congress, Television

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a leading global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, today announced the collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in launching the industry-leading smart home solution leveraging the Matter-compatible technologies, STM32WB55 and FG370. It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.

Key Points: 
  • It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.
  • In collaboration with STMicroelectronics, Fibocom has integrated the smart home solution into 5G CPE in conjunction with ST's MCU STM32WB55 and Fibocom's 5G module FG370.
  • Looking forward, the partnership with the ecosystem will strengthen and tighten the acceleration of smart home solution in a unified platform."
  • Learn more about Fibocom's smart home solution at booth #5I33 in hall 5 during MWC Barcelona 2024.

Fibocom Bolsters On-device Intelligence with Newly Launched Smart Module SC208 Based on Snapdragon 460 Mobile Platform at MWC Barcelona 2024

Retrieved on: 
Tuesday, February 27, 2024
POC, Multimedia, POS, Intelligence, GNSS, MIPI, MWC, Qualcomm, Communication, Antirrhinum, GPU, QUALCOMM, Internet, Mobile World Congress, Mobile phone

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a highly integrated multi-mode smart module SC208 with gigantic performance leaps in 4G category and a series of feature-packed multimedia experience improvements during MWC Barcelona 2024. Powered by the Snapdragon®™ 460 mobile platform with an octa-core processor (4*A73 1.8GHz + 4*A53 1.6GHz) and with a high-performance graphics processing unit (GPU), the module is capable of multi-tasking in terms of 1080P video transmission, multi-camera input simultaneously while balancing the power consumption, bolstering the adoption of smart wireless solution in industries such as smart POS, industrial handsets, body-worn cameras, PoC terminals, in-vehicle applications, smart home and more.

Key Points: 
  • Propelling edge intelligence of smart IoT terminals, Fibocom launches a high-performance smart module SC208 with global-scale 4G cellular mobile experiences and impressive multimedia processing capabilities during MWC Barcelona 2024.
  • Fibocom SC208 is designed to meet the evolving demand for edge intelligence for smart IoT terminals by integrating the Snapdragon 460 Mobile platform, supporting a 2x increase in overall system performance, compared to previous generations.
  • "We are proud of our cooperation with Qualcomm Technologies and building the infrastructure of edge intelligence based upon Snapdragon 460 Mobile Platform.
  • Learn more about Fibocom's smart module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

Fibocom Collaborates with Industry Partners to Accelerate 5G RedCap Commercialization in Extended Markets

Retrieved on: 
Tuesday, February 27, 2024
Quanta, ODU, CPE, Partnership, MWC, Quanta Computer, Redcap, Communication, 3GPP, PLANET, Dongle, Internet, Mobile World Congress, Mobile phone

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, is delighted to announce an industry-leading momentum of implementing deployable and commercialized 5G RedCap module solution to 5G IoT scenarios, in collaboration with well-known customers including but not limited to Askey, Quanta Computer, PLANET, companies of whom have profound influence in the vertical markets respectively. Rigorous engineering testing and verification has been conducted to ensure the seamless integration of the latest generation 5G RedCap on customers' devices. Enabling ultra-reliable data transmission and efficient network utilization under the 5G network catering to diverse application scenarios such as in-home connectivity, enterprises-level connectivity, and industrial-grade connectivity, etc.

Key Points: 
  • By achieving momentum across industries, the 5G RedCap module solution that Fibocom offers is capable of delivering a high-performance and cost-effective connectivity service for industry customers at the early stage of the 5G RedCap rollout.
  • Fibocom 5G RedCap module solution provides enhanced network performance, simplified hardware and antenna design while conserving low power consumption.
  • "We are proud of the joint announcement of the commercially deployable 5G RedCap solution with our customers from diversified markets based on Fibocom's 5G RedCap module portfolios.
  • "We look forward to unleashing the full potential of 5G RedCap with our industry customers and helping customers to realize the monetization of 5G RedCap with less time to market."

Fibocom Bolsters On-device Intelligence with Newly Launched Smart Module SC208 Based on Snapdragon 460 Mobile Platform at MWC Barcelona 2024

Retrieved on: 
Tuesday, February 27, 2024
POC, Multimedia, POS, Intelligence, GNSS, MIPI, MWC, Qualcomm, Communication, Antirrhinum, GPU, QUALCOMM, Internet, Mobile World Congress, Mobile phone

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a highly integrated multi-mode smart module SC208 with gigantic performance leaps in 4G category and a series of feature-packed multimedia experience improvements during MWC Barcelona 2024. Powered by the Snapdragon®™ 460 mobile platform with an octa-core processor (4*A73 1.8GHz + 4*A53 1.6GHz) and with a high-performance graphics processing unit (GPU), the module is capable of multi-tasking in terms of 1080P video transmission, multi-camera input simultaneously while balancing the power consumption, bolstering the adoption of smart wireless solution in industries such as smart POS, industrial handsets, body-worn cameras, PoC terminals, in-vehicle applications, smart home and more.

Key Points: 
  • Propelling edge intelligence of smart IoT terminals, Fibocom launches a high-performance smart module SC208 with global-scale 4G cellular mobile experiences and impressive multimedia processing capabilities during MWC Barcelona 2024.
  • Fibocom SC208 is designed to meet the evolving demand for edge intelligence for smart IoT terminals by integrating the Snapdragon 460 Mobile platform, supporting a 2x increase in overall system performance, compared to previous generations.
  • "We are proud of our cooperation with Qualcomm Technologies and building the infrastructure of edge intelligence based upon Snapdragon 460 Mobile Platform.
  • Learn more about Fibocom's smart module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

Fibocom at MWC Barcelona 2024: Accelerating Connectivity for an Intelligent Future

Retrieved on: 
Monday, February 26, 2024
ODU, FWA, CPE, Mobile, AI, Intelligence, Wireless, Internet, Lite, Booth, MWC, Redcap, Communication, MediaTek, Multimedia, Mobile World Congress, Industrial internet of things, STMicroelectronics, IVI, ECR, Industrial, Qualcomm, Electronic cash, Acceleration, Congress, Heart, Wi-Fi, IEEE 802.11be, Dongle, Mobile phone

Committed to accelerating connectivity for an intelligent future, Fibocom showcased its state-of-the-art wireless modules and solutions, incorporating cutting-edge technologies like RedCap and AI, etc.

Key Points: 
  • Committed to accelerating connectivity for an intelligent future, Fibocom showcased its state-of-the-art wireless modules and solutions, incorporating cutting-edge technologies like RedCap and AI, etc.
  • It complies with Matter standards and redefines the smart home connectivity, creating a more convenient and intelligent home environment for users.
  • Illustrating the transformative power of intelligent connectivity, Fibocom presents its comprehensive product portfolio and successful implementations covering diverse vertical markets.
  • Underlining its theme for MWC 2024, 'Accelerate Connectivity, Intelligent Future,' Fibocom vividly illustrates the transformative power that not only shapes the present but redefines the    future.

Fibocom Announces MediaTek-powered 5G RedCap Module FM330 Series to Lead 5G Expansion at MWC Barcelona 2024

Retrieved on: 
Monday, February 26, 2024
Cortex, Tao, Internet, Microsoft Windows, USB, Partnership, T300, MWC, Linux, Redcap, PC, MediaTek, Communication, M.2, Android, Arm, MBB, Tablet, PCB, LTE-M, Mobile World Congress

BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Key Points: 
  • Fibocom announces the launch of the industry-first T300-based 5G RedCap Module FM330 series in collaboration with MediaTek during MWC Barcelona 2024.
  • The FM330 series is positioned to expand the 5G landscape to a broader range, covering consumer-level, enterprise-level and industrial-level scenarios.
  • Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G.
  • Learn more about Fibocom's RedCap module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

Fibocom Announces MediaTek-powered 5G RedCap Module FM330 Series to Lead 5G Expansion at MWC Barcelona 2024

Retrieved on: 
Monday, February 26, 2024
Cortex, Tao, Internet, Microsoft Windows, USB, Partnership, T300, MWC, Linux, Redcap, PC, MediaTek, Communication, M.2, Android, Arm, MBB, Tablet, PCB, LTE-M, Mobile World Congress

BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Key Points: 
  • Fibocom announces the launch of the industry-first T300-based 5G RedCap Module FM330 series in collaboration with MediaTek during MWC Barcelona 2024.
  • The FM330 series is positioned to expand the 5G landscape to a broader range, covering consumer-level, enterprise-level and industrial-level scenarios.
  • Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G.
  • Learn more about Fibocom's RedCap module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.