QUALCOMM

S&P Dow Jones Indices Reports U.S. Common Indicated Dividend Payments Increase $16.0 Billion in Q1 2024 Driven by Large-Cap Initiations

Retrieved on: 
Tuesday, April 2, 2024
QUALCOMM, Microsoft, Capital, Salesforce, S&P Dow Jones Indices, Meta Platforms, Growth, Booking Holdings, Index, Dow Jones Industrial Average, Beauty salon

Q1 2024 U.S. common dividend decreases were $6.7 billion, up 73.3% from $3.9 billion in Q4 2023, and down 33.3% from $10.0 billion in Q1 2023.

Key Points: 
  • Q1 2024 U.S. common dividend decreases were $6.7 billion, up 73.3% from $3.9 billion in Q4 2023, and down 33.3% from $10.0 billion in Q1 2023.
  • The net 12-month March 2024 indicated dividend increase was $42.8 billion, compared to $59.7 billion for the prior 12-month period.
  • NEW YORK, April 2, 2024 /PRNewswire/ -- S&P Dow Jones Indices announced today that the indicated dividend net changes (increases less decreases) for U.S. domestic common stocks increased $16.0 billion during Q1 2024, compared to the $13.7 billion increase in Q4 2023 and a $9.7 billion increase in Q1 2023.
  • Increases were $22.7 billion versus $17.5 billion for Q4 2023, and decreases were $6.7 billion compared to $3.9 billion in Q4 2023.

Fibocom Bolsters On-device Intelligence with Newly Launched Smart Module SC208 Based on Snapdragon 460 Mobile Platform at MWC Barcelona 2024

Retrieved on: 
Tuesday, February 27, 2024
POC, Multimedia, POS, Intelligence, GNSS, MIPI, MWC, Qualcomm, Communication, Antirrhinum, GPU, QUALCOMM, Internet, Mobile World Congress, Mobile phone

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a highly integrated multi-mode smart module SC208 with gigantic performance leaps in 4G category and a series of feature-packed multimedia experience improvements during MWC Barcelona 2024. Powered by the Snapdragon®™ 460 mobile platform with an octa-core processor (4*A73 1.8GHz + 4*A53 1.6GHz) and with a high-performance graphics processing unit (GPU), the module is capable of multi-tasking in terms of 1080P video transmission, multi-camera input simultaneously while balancing the power consumption, bolstering the adoption of smart wireless solution in industries such as smart POS, industrial handsets, body-worn cameras, PoC terminals, in-vehicle applications, smart home and more.

Key Points: 
  • Propelling edge intelligence of smart IoT terminals, Fibocom launches a high-performance smart module SC208 with global-scale 4G cellular mobile experiences and impressive multimedia processing capabilities during MWC Barcelona 2024.
  • Fibocom SC208 is designed to meet the evolving demand for edge intelligence for smart IoT terminals by integrating the Snapdragon 460 Mobile platform, supporting a 2x increase in overall system performance, compared to previous generations.
  • "We are proud of our cooperation with Qualcomm Technologies and building the infrastructure of edge intelligence based upon Snapdragon 460 Mobile Platform.
  • Learn more about Fibocom's smart module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

Fibocom Bolsters On-device Intelligence with Newly Launched Smart Module SC208 Based on Snapdragon 460 Mobile Platform at MWC Barcelona 2024

Retrieved on: 
Tuesday, February 27, 2024
POC, Multimedia, POS, Intelligence, GNSS, MIPI, MWC, Qualcomm, Communication, Antirrhinum, GPU, QUALCOMM, Internet, Mobile World Congress, Mobile phone

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a highly integrated multi-mode smart module SC208 with gigantic performance leaps in 4G category and a series of feature-packed multimedia experience improvements during MWC Barcelona 2024. Powered by the Snapdragon®™ 460 mobile platform with an octa-core processor (4*A73 1.8GHz + 4*A53 1.6GHz) and with a high-performance graphics processing unit (GPU), the module is capable of multi-tasking in terms of 1080P video transmission, multi-camera input simultaneously while balancing the power consumption, bolstering the adoption of smart wireless solution in industries such as smart POS, industrial handsets, body-worn cameras, PoC terminals, in-vehicle applications, smart home and more.

Key Points: 
  • Propelling edge intelligence of smart IoT terminals, Fibocom launches a high-performance smart module SC208 with global-scale 4G cellular mobile experiences and impressive multimedia processing capabilities during MWC Barcelona 2024.
  • Fibocom SC208 is designed to meet the evolving demand for edge intelligence for smart IoT terminals by integrating the Snapdragon 460 Mobile platform, supporting a 2x increase in overall system performance, compared to previous generations.
  • "We are proud of our cooperation with Qualcomm Technologies and building the infrastructure of edge intelligence based upon Snapdragon 460 Mobile Platform.
  • Learn more about Fibocom's smart module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

Wi-Fi Chipset Market size worth USD 27.90 Billion, Globally, by 2030 at 4.56% CAGR: Verified Market Research®

Retrieved on: 
Wednesday, September 27, 2023
Hertz, Communication, QUALCOMM, Wireless Gigabit Alliance, Private, Internet, Bank statement, Smartphone, Research, WPA, USD, Intel, Multi-band device, WiGig, Cypress Semiconductor, Texas Instruments, Geography, STMicroelectronics, Split Single (band), City, Growth, WEP, Mobile phone, Consumer electronics, Internet service provider, Wi-Fi, MediaTek, Others, Tablet

JERSEY CITY, N.J., Sept. 27, 2023 /PRNewswire/ -- The Global Wi-Fi Chipset Market is projected to grow at a CAGR of 4.56% from 2023 to 2030, according to a new report published by Verified Market Research®. The report reveals that the market was valued at USD 19.63 Billion in 2022 and is expected to reach USD 27.90 Billion by the end of the forecast period.

Key Points: 
  • The report provides an in-depth analysis of the global Wi-Fi Chipset Market, including its growth prospects, market trends, and market challenges.
  • JERSEY CITY, N.J., Sept. 27, 2023 /PRNewswire/ -- The Global Wi-Fi Chipset Market is projected to grow at a CAGR of 4.56% from 2023 to 2030, according to a new report published by Verified Market Research®.
  • The global Wi-Fi Chipset Market is witnessing a transformative evolution, with Wi-Fi technology emerging as the quintessential connectivity choice across various industries.
  • To get market data, market insights, financial statements and a comprehensive analysis of the Global Wi-Fi Chipset Market, please
    Based on the research, Verified Market Research® has segmented the global Wi-Fi Chipset Market into Product, Band, And Geography.

Wi-Fi Chipset Market size worth USD 27.90 Billion, Globally, by 2030 at 4.56% CAGR: Verified Market Research®

Retrieved on: 
Wednesday, September 27, 2023
Hertz, Communication, QUALCOMM, Wireless Gigabit Alliance, Private, Internet, Bank statement, Smartphone, Research, WPA, USD, Intel, Multi-band device, WiGig, Cypress Semiconductor, Texas Instruments, Geography, STMicroelectronics, Split Single (band), City, Growth, WEP, Mobile phone, Consumer electronics, Internet service provider, Wi-Fi, MediaTek, Others, Tablet

JERSEY CITY, N.J., Sept. 27, 2023 /PRNewswire/ -- The Global Wi-Fi Chipset Market is projected to grow at a CAGR of 4.56% from 2023 to 2030, according to a new report published by Verified Market Research®. The report reveals that the market was valued at USD 19.63 Billion in 2022 and is expected to reach USD 27.90 Billion by the end of the forecast period.

Key Points: 
  • The report provides an in-depth analysis of the global Wi-Fi Chipset Market, including its growth prospects, market trends, and market challenges.
  • JERSEY CITY, N.J., Sept. 27, 2023 /PRNewswire/ -- The Global Wi-Fi Chipset Market is projected to grow at a CAGR of 4.56% from 2023 to 2030, according to a new report published by Verified Market Research®.
  • The global Wi-Fi Chipset Market is witnessing a transformative evolution, with Wi-Fi technology emerging as the quintessential connectivity choice across various industries.
  • To get market data, market insights, financial statements and a comprehensive analysis of the Global Wi-Fi Chipset Market, please
    Based on the research, Verified Market Research® has segmented the global Wi-Fi Chipset Market into Product, Band, And Geography.

iST, the first Asia laboratory to join the Automotive Electronics Council (AEC) as an Associate Member

Retrieved on: 
Monday, November 14, 2022
NXP, General officer, STM, GF, Chrysler, Management control system, UMC, DENSO, Ford Motor Company, Tier 2, Letter, BOSCH, Association, MIH, AEC, Automotive Electronics Council, Electronics, TSMC, Ist, QUALCOMM, Associate, Mobility, DEKRA, Laboratory, Uranium, ZF, NVIDIA, TI

TAIPEI, Nov. 14, 2022 /PRNewswire/ -- Integrated Service Technology Inc. (iST) announced today that after going through tedious multiple reviews, the Automotive Electronics Council (AEC) the highest level of global automotive electronics qualification association has recently officially recognized iST as one of its Associate Member.

Key Points: 
  • TAIPEI, Nov. 14, 2022 /PRNewswire/ -- Integrated Service Technology Inc. (iST) announced today that after going through tedious multiple reviews, the Automotive Electronics Council (AEC) the highest level of global automotive electronics qualification association has recently officially recognized iST as one of its Associate Member.
  • There are only 93 firms in the world, 9 firms from Taiwan, to have become an AEC member.
  • These 9 Taiwan firms include TSMC and UMC foundries, and iST is honored to be the only laboratory in Asia recognized as part of this international elite team.
  • Now, in 2022, after laying the foundation in the automotive electronics market over the years, iST has finally passed the stringent reviews by the AEC and proud to become a member.

iST, the first Asia laboratory to join the Automotive Electronics Council (AEC) as an Associate Member

Retrieved on: 
Thursday, November 10, 2022
Cloud, NXP, IC, General officer, Mobility, Laboratory, Reliability verification, Automotive Electronics Council, GF, DEKRA, QUALCOMM, Failure analysis, Electronics, IOV, Ford Motor Company, Internet, Multimedia, IOT, STM, UMC, AEC, View, DENSO, Association, Management control system, Chrysler, MIH, Signal, Tier 2, Associate, Letter, TSMC, BOSCH, Industry, Ist, TI, NVIDIA, ZF

TAIPEI, Nov. 10, 2022 /PRNewswire/ --Integrated Service Technology Inc. (iST) announced today that after going through tedious multiple reviews, the Automotive Electronics Council (AEC) the highest level of global automotive electronics qualification association has recently officially recognized iST as one of its Associate Member.

Key Points: 
  • TAIPEI, Nov. 10, 2022 /PRNewswire/ --Integrated Service Technology Inc. (iST) announced today that after going through tedious multiple reviews, the Automotive Electronics Council (AEC) the highest level of global automotive electronics qualification association has recently officially recognized iST as one of its Associate Member.
  • There are only 93 firms in the world, 9 firms from Taiwan, to have become an AEC member.
  • These 9 Taiwan firms include TSMC and UMC foundries, and iST is honored to be the only laboratory in Asia recognized as part of this international elite team.
  • There are only 93 qualified AEC members in the world and are all distinguished firms in their respective automobile fields.

ASE Unveils Plans for the World’s First 5G mmWave NR-DC SA Smart Factory

Retrieved on: 
Wednesday, September 28, 2022
Semiconductor, 5G, Security, Manufacturing, Nanotechnology, Other Technology, Telecommunications, Networks, Internet, Consulting, Hardware, Data Management, Professional Services, Technology, Mobile, Wireless, Other Manufacturing, Packaging, Engineering, Efficiency, New, Face, Industry, AOI, Environment, Government, Industrial Development Bureau, APT, Technology, Ecosystem, Flip chip, Research, Supercomputer, Datang Telecom Group, Adoption, QUALCOMM, Telecom, Telecommunication, IPO, Qualcomm, National Cheng Kung University, SIP, Antirrhinum, TAIEX, Industrialisation, Industrial, View, IOT, Institute, NYSE, Indian Institute of Information Technology, Design and Manufacturing, Jabalpur, ICT, Automation, MEMS sensor generations, MEMS, ASE, Twitter, OEE, LinkedIn, High-pass filter, Data analysis, TSV, Solution, Information technology, Ericsson, Mobile phone, Television, Printed circuit board, OT, Askey

Asia Pacific Telecoms vast experience in enterprise wireless networks will be instrumental in deploying next-generation 5G network architecture within a manufacturing environment.

Key Points: 
  • Asia Pacific Telecoms vast experience in enterprise wireless networks will be instrumental in deploying next-generation 5G network architecture within a manufacturing environment.
  • Today marks an important milestone, as leading players in the industry, government, academia and research sectors joined forces to drive the developments of smart factory technologies.
  • At ASE, partnerships are key to advancing our competitiveness and seizing new opportunities across diverse disciplines, generations and global borders.
  • We will continue to support Taiwans development of mmWave technology and work together to strengthen Taiwans 5G ecosystem.

S&P 500 Buybacks Decline 21.8% as Financials Pull Back; 12-Months Buybacks Pass $1 Trillion for the First Time

Retrieved on: 
Tuesday, September 20, 2022
S&P Dow Jones Indices, QUALCOMM, Health care, GAAP, Energy, NEW, S&P, Microsoft, Lowe, Apple, History, GICS, Technology, Lowe's, S, EPS, META, Information technology, Fed, LOW, AAPL, Meta, MSFT, Total, Renewable energy, Tutoring, Mobile phone, Cryptocurrency, Online gambling, Bookkeeping, Beauty salon, Finance

For the 12-months ending June 2022, buybacks were a record $1.005 trillion, a 65.0% increase from the $609.4 billion spent in the June 2021 time period.

Key Points: 
  • For the 12-months ending June 2022, buybacks were a record $1.005 trillion, a 65.0% increase from the $609.4 billion spent in the June 2021 time period.
  • S&P 500 Q2 2022 dividends increased 2.1% to a record $140.6 billion from Q1 2022's $137.6 billion and were 13.9% greater than the $123.4 billion in Q2 2021.
  • Total shareholder return for the 12-months ending June 2022 increased to a record $1.547 trillion from the June 2021 $1.094 trillion.
  • The 12-month buybacks of $189.3 billion were 84.1% higher than the 12-month June 2021 buybacks of $102.9 billion, when the Fed partially limited buybacks.

ISG recognizes HARMAN DTS as a ‘Leader’ in the Provider Lens™ Internet of Things Services and Solutions 2022 Report

Retrieved on: 
Tuesday, August 9, 2022
Mobile, Wireless, Technology, Satellite, Other Technology, Internet, Hardware, Data Management, IOT (Internet of Things), Consumer Electronics, Artificial Intelligence, Lexicon, IOT, ISG, Investment, 2009 Davis Cup, Data management, Research, Harman Kardon, CISCO, Industry, ROI, ISO 27001:2013, Technology, Infor, Car, Communication, Apple Inc. v. Samsung Electronics Co., Partnership, Software, Management consulting, SIEM, IPS, HARMAN, Internet, Senior, Publicis Healthcare Communications Group, Third party, OTA, DTS, AKG (company), Food, International, ISO 9001:2015, Intel, Compliance, AI, Samsung, Managed services, Microsoft, QUALCOMM, Transport, Automation, Security operations center, Integration, JBL, ISO, AKG, ADAS, Mobile phone, Vaccine, Risk management, Online shopping, Incorporated, The Things, Infinity, Solution

HARMAN, a wholly-owned subsidiary of Samsung Electronics Co., Ltd. focused on connected technologies for automotive, consumer, and enterprise markets, is honored that its Digital Transformation Solutions (DTS) business unit has been recognized as a leader and rising star in the ISG Provider Lens Internet of Things Services and Solutions 2022 US report.

Key Points: 
  • HARMAN, a wholly-owned subsidiary of Samsung Electronics Co., Ltd. focused on connected technologies for automotive, consumer, and enterprise markets, is honored that its Digital Transformation Solutions (DTS) business unit has been recognized as a leader and rising star in the ISG Provider Lens Internet of Things Services and Solutions 2022 US report.
  • We are honored to receive such high recognition from ISG in numerous categories that we value greatly at HARMAN DTS, said David Owens, Senior Vice President, Digital Transformation Solutions at HARMAN.
  • For more information on The 2022 ISG Provider Lens Internet of Things Services and Solutions report for the U.S, visit https://www.businesswire.com
    ISG (Information Services Group) (Nasdaq: III) is a leading global technology research and advisory firm.
  • Harman Kardon, Infinity, JBL, Lexicon and Mark Levinson are trademarks of HARMAN International Industries, Incorporated, registered in the United States and/or other countries.