UART

Quectel Broadens RedCap Offering With Commercial Availability of RG255C-GL RedCap 5G Module

Retrieved on: 
Tuesday, April 9, 2024
Consumer Electronics, Technology, IOT (Internet of Things), Telecommunications, Apps, Applications, Software, Networks, Internet, Mobile, Wireless, 5G, Hardware, PDA, MiFi, LGA, USB 2.0, Galileo Galilei, SGMII, BDS, LTE, Internet of things, SPI, Qualcomm, LAN, 3GPP, Gateway, UART, GPS, URLLC, Router, VEX, X35, Architecture, Industrial, USB, Data-rate units, PCM, CSO, Multimedia, GLONASS, Redcap, GNSS, Mobile phone

Embedded World--Quectel Wireless Solutions, a global IoT solutions provider, is delighted to announce the commercial availability of the RG255C-GL 5G RedCap Sub-6 GHz LGA module, delivering comprehensive 5G and 4G coverage across the globe.

Key Points: 
  • Embedded World--Quectel Wireless Solutions, a global IoT solutions provider, is delighted to announce the commercial availability of the RG255C-GL 5G RedCap Sub-6 GHz LGA module, delivering comprehensive 5G and 4G coverage across the globe.
  • View the full release here: https://www.businesswire.com/news/home/20240409408432/en/
    Quectel broadens RedCap offering with commercial availability of RG255C-GL RedCap 5G module (Photo: Business Wire)
    The RG255C-GL, conforming to 3GPP Release 17 standards, features a compact LGA form factor measuring 32.0mm x 29.0mm x 2.4mm.
  • "Having the RG255C-GL 5G RedCap module commercially available offers our customers access to the benefits of 5G without the accompanying expense and power consumption," commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions.
  • Attendees to Embedded World will be able to find out more about the RG255C-GL 5G RedCap module on the Quectel stand at booth number 3-318.

Revolutionizing Connectivity: Ezurio introduces wide portfolio of new Wireless and System on Modules product ranges in collaboration with Texas Instruments

Retrieved on: 
Tuesday, April 9, 2024
TI, SDIO, Original equipment manufacturer, Wi-Fi, Internet of things, UART, Software, Bluetooth Low Energy, Texas Instruments, SMT, Semiconductor, SOM, Silicon, Mobile phone

AKRON, Ohio, April 9, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces new product portfolios leveraging embedded processing products from Texas Instruments (TI), the global semiconductor leader known for its design, manufacture and test of analog and embedded semiconductors that are the essential building blocks of electronic systems.

Key Points: 
  • Ezurio will introduce its first new TI based product range the Sona™ TI351 family, which is a Wi-Fi 6 & Bluetooth 5.4 wireless module offering based on TI's SimpleLink™ CC33x1 Wi-Fi portfolio.
  • This solution becomes a key wireless enabler to Ezurio's next portfolio of System-on-Modules (SOM) – the Carbon series.
  • Additionally, this SOM line incorporates TI analog and power components, showcasing a synergy of Ezurio design and development capabilities and TI Semiconductors resources.
  • The close collaboration with TI will offer next-generation solutions that not only enhance connectivity and performance but also significantly simplify the development process for OEMs and product innovators.

Toshiba Releases Arm® Cortex®-M4 Microcontrollers for Motor Control

Retrieved on: 
Tuesday, March 26, 2024
Software, Other Manufacturing, Hardware, Consumer Electronics, Technology, IOT (Internet of Things), Semiconductor, Manufacturing, Toshiba, Engine, Internet of things, UART, Electronics, IEC, RAM, Memory, AC, FPU, Documentation, Multimedia, ADC, Computer data storage

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added eight new products with 512KB/1MB flash memory capacity and four types of packages to the M4K Group of the TXZ+™ Family Advanced Class 32-bit microcontrollers equipped with Cortex®-M4 core with FPU.

Key Points: 
  • Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added eight new products with 512KB/1MB flash memory capacity and four types of packages to the M4K Group of the TXZ+™ Family Advanced Class 32-bit microcontrollers equipped with Cortex®-M4 core with FPU.
  • View the full release here: https://www.businesswire.com/news/home/20240325053408/en/
    Toshiba: TXZ+™ Family Advanced Class Arm® Cortex®-M4 microcontrollers for motor control (Graphic: Business Wire)
    Continuing advances in the functionality of motor applications supporting IoT is increasing demand for large program capacity and firmware over-the-air support.
  • The microcontrollers also offer various interfaces and motor control options, such as advance-programmable motor driver (A-PMD), advanced encoder 32-bit (A-ENC32), advanced vector engine plus (A-VE+) and three units of high-speed, high-resolution 12-bit analog/digital converters.
  • Toshiba is planning to increase capacity of flash memory also for M4M Group with CAN interface.

Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules to Increase Developer Options and Help Accelerate Digital Transformation

Retrieved on: 
Monday, February 26, 2024
Telecommunications, Networks, Consumer Electronics, Technology, Apps, Applications, IOT (Internet of Things), Mobile, Wireless, Security, Cortex, UART, I2S, Bluetooth, BLE, SRAM, Multimedia, LCC, Temperature, ARM, Internet of things, MWC, SPI, Codec, Communication, Bluetooth Low Energy, ADC, Sport, VEX, Certification, Bluetooth mesh networking, LAN, CSO, SMT, SWD, IEEE, PWM, IEEE 802.11n-2009, Data-rate units, Mobile phone

View the full release here: https://www.businesswire.com/news/home/20240226444518/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240226444518/en/
    Quectel unveils four new high performance Wi-Fi and Bluetooth modules to increase developer options and help accelerate digital transformation (Photo: Business Wire)
    “Adding the Quectel FCU741R, FCS950R and HCM010S to our portfolio enables developers and designers to select the module that best suits the needs of their use case,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.
  • Quectel has also launched the Quectel HCM010S , high-performance MCU Bluetooth module which boasts an ARM Cortex M33 processor and supports both Bluetooth Low Energy (BLE) and Bluetooth Mesh technologies.
  • Quectel provides a comprehensive range of embedded and external antennas, offering end-to-end support from design to certification and post-deployment.
  • Quectel’s integrated approach with antennas, modules, and certifications significantly reduces cost and accelerates time-to-market, streamlining the journey from concept to mass market.

Fibocom Collaborates with STMicroelectronics to Debut Smart Home Solution at MWC Barcelona 2024

Retrieved on: 
Tuesday, February 27, 2024
Tao, Marketing, UART, Microcontroller, FWA, CPE, Wireless, Connectivity Standards Alliance, Zigbee, Partnership, Electronics, MWC, Language, Bit, Communication, STMicroelectronics, MCU, Ecosystem, Connectivity, Acceleration, Imagination, MBB, Tablet, Internet, Mobile World Congress, Television

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a leading global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, today announced the collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in launching the industry-leading smart home solution leveraging the Matter-compatible technologies, STM32WB55 and FG370. It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.

Key Points: 
  • It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.
  • In collaboration with STMicroelectronics, Fibocom has integrated the smart home solution into 5G CPE in conjunction with ST's MCU STM32WB55 and Fibocom's 5G module FG370.
  • Looking forward, the partnership with the ecosystem will strengthen and tighten the acceleration of smart home solution in a unified platform."
  • Learn more about Fibocom's smart home solution at booth #5I33 in hall 5 during MWC Barcelona 2024.

Fibocom Collaborates with STMicroelectronics to Debut Smart Home Solution at MWC Barcelona 2024

Retrieved on: 
Tuesday, February 27, 2024
Tao, Marketing, UART, Microcontroller, FWA, CPE, Wireless, Connectivity Standards Alliance, Zigbee, Partnership, Electronics, MWC, Language, Bit, Communication, STMicroelectronics, MCU, Ecosystem, Connectivity, Acceleration, Imagination, MBB, Tablet, Internet, Mobile World Congress, Television

BARCELONA, Spain, Feb. 27, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a leading global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, today announced the collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in launching the industry-leading smart home solution leveraging the Matter-compatible technologies, STM32WB55 and FG370. It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.

Key Points: 
  • It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.
  • In collaboration with STMicroelectronics, Fibocom has integrated the smart home solution into 5G CPE in conjunction with ST's MCU STM32WB55 and Fibocom's 5G module FG370.
  • Looking forward, the partnership with the ecosystem will strengthen and tighten the acceleration of smart home solution in a unified platform."
  • Learn more about Fibocom's smart home solution at booth #5I33 in hall 5 during MWC Barcelona 2024.

m-oem Expands its Raman Product Line: Introducing the SAVANNAH Raman Module

Retrieved on: 
Friday, February 23, 2024
UART, Metrohm, OEM, Raman, USB

PLAINSBORO, N.J., Feb. 23, 2024 /PRNewswire-PRWeb/ -- SAVANNAH's key advantages elevate it above other Raman OEM solutions:

Key Points: 
  • m-oem, the OEM division of Metrohm, is thrilled to announce the launch of the SAVANNAH Raman Module.
  • SAVANNAH is a fully integrated Raman module consisting of a laser source and detection system.
  • This cutting-edge technology empowers our customers to incorporate Raman as an analytical tool in a variety of applications across various industries.
  • PLAINSBORO, N.J., Feb. 23, 2024 /PRNewswire-PRWeb/ -- SAVANNAH's key advantages elevate it above other Raman OEM solutions:
    SAVANNAH is a fully integrated Raman module consisting of a laser source and detection system.

Renesas Launches RZ/G3S 64-bit Microprocessor with Enhanced Peripherals for IoT Edge and Gateway Devices

Retrieved on: 
Tuesday, January 16, 2024
Technology, Mobile, Wireless, Semiconductor, 5G, Security, Software, Hardware, IOT (Internet of Things), Data Management, ECC, Gigabit Ethernet, UART, MPU, Hertz, Renesas Electronics, DRAM, Sleep, Multimedia, Infrastructure, RS485, USB, Arm, Workload, IAR, Embedded, Linux, VLP, PCI Express, DDR, PSA, ICS, CPU, Trust anchor, CIP, Internet of things, Video game

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new 64-bit general-purpose microprocessor (MPU) for IoT edge and gateway devices that consumes significantly less power.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new 64-bit general-purpose microprocessor (MPU) for IoT edge and gateway devices that consumes significantly less power.
  • These features make the device ideal for IoT applications such as home gateways, smart meters, and tracking devices.
  • “The RZ/G3S represents the next generation products that will extend our reach to the rapidly growing 5G IoT and Gigabit Wi-Fi 7 gateway markets.
  • The fast startup allows IoT devices, which frequently operate intermittently, to save power and significantly extend the runtime of battery-powered devices.

Quectel Introduces Ultra-Low Power, Cost-Effective KG200Z Long Range Module

Retrieved on: 
Tuesday, January 9, 2024
Telecommunications, Internet, Data Management, Technology, Apps, Applications, IOT (Internet of Things), Mobile, Wireless, Other Technology, Waste management, UART, RF, SWD, VEX, CSO, BPSK, Life, Multimedia, LGA, MSK, FSK, Communication, Hertz, HVAC, CES, Long Range, SPI, Internet of things, Telescopic sight

CES - Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of the KG200Z module, a state-of-the-art Long Range (LoRa®) technology module designed to cater to the specific needs of IoT projects demanding dependable, ultra-low power, and cost-effective, long range wireless communication.

Key Points: 
  • CES - Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of the KG200Z module, a state-of-the-art Long Range (LoRa®) technology module designed to cater to the specific needs of IoT projects demanding dependable, ultra-low power, and cost-effective, long range wireless communication.
  • View the full release here: https://www.businesswire.com/news/home/20240109198172/en/
    Quectel introduces ultra-low power, cost-effective KG200Z Long Range module (Photo: Business Wire)
    The module delivers seamless and robust connectivity for IoT devices, boasting an impressive transmission distance of 2-5 kilometers in urban settings and 10-15 kilometers in suburban areas.
  • The module also boasts a range connectivity options with multiple interfaces, including UART, SPI*, I2C*, and SWD, catering to a wide range of applications.
  • With an ultra-low power consumption, the KG200Z module is engineered for efficiency, boasting low power consumption to extend battery life significantly.

Telit Cinterion and Alif Semiconductor Unveil the Vision AppKit: A Postage Stamp-Sized, Intelligent Connected Camera Platform

Retrieved on: 
Tuesday, January 9, 2024
Entrepreneurship, UART, Face, The Palazzo, LTE-M, AI, Communication, PSM, MCU, Vision, Ultra, Wi-Fi, CES, SPI, Discontinuous reception, Bluetooth Low Energy, Palace, Logic, SDIO

Alif's E3 Series MCU — known for its EdgeAI capabilities in battery-operated IoT devices — powers this groundbreaking design.

Key Points: 
  • Alif's E3 Series MCU — known for its EdgeAI capabilities in battery-operated IoT devices — powers this groundbreaking design.
  • Telit Cinterion supports communication in the Vision AppKit with the ME310 LTE Cat-M and WE310 Wi-Fi and Bluetooth Low Energy 5.0 modules.
  • "The Vision AppKit AI camera reference design incorporates highly efficient processing capability to deliver small form factor camera solutions for object detection and image classification in a secure way," said Reza Kazerounian, Co-Founder and President at Alif Semiconductor.
  • For more information and to see a demo of the Vision AppKit in action at CES 2024, visit Alif Semiconductor's suite at The Palazzo and Telit Cinterion's booth #10662.