M.2

Cavli Wireless Gears Up to Introduce the 5G RedCap CQM220 Cellular IoT Module Alongside the Flagship CQS290 Android Module at Embedded World 2024

Retrieved on: 
Wednesday, April 3, 2024
Cortex, SBAS, Connectivity, POS, LGA, USB 2.0, Bluetooth, GPU, Galileo Galilei, QZSS, BDS, M.2, LTE, Internet of things, Embedded, SAN, ESIM, 3GPP, Qualcomm, Telemetry, ARM, GPS, Transport, Asset tracking, Linux, OTG, PCI, City, Architecture, ARM Cortex-A53, USB, Android (operating system), GLONASS, Fourth Industrial Revolution, CPU, Redcap, M2M, GNSS, Mobile phone

SAN JOSE, Calif., April 03, 2024 (GLOBE NEWSWIRE) -- Cavli Wireless , a pioneer in the IoT solutions landscape, is all set to announce its flagship 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024.

Key Points: 
  • SAN JOSE, Calif., April 03, 2024 (GLOBE NEWSWIRE) -- Cavli Wireless , a pioneer in the IoT solutions landscape, is all set to announce its flagship 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024.
  • The event represents the premier stage for global innovators like Cavli Wireless to showcase the innovative CQM220 to the world.
  • The CQM220 is the flagship 5G RedCap cellular IoT module from Cavli Wireless, compatible with 3GPP release 17 standards, specifically designed for advanced IoT and M2M applications.
  • With the unveiling of the CQM220 and the showcase of the CQS290 at Embedded World 2024, Cavli Wireless reaffirms its commitment to delivering cost-effective, uninterrupted, and superior cellular IoT solutions.

Virtium Introduces Industrial-grade High-Capacity E1.S NVMe SSD Platform With 5+ Year Availability

Retrieved on: 
Monday, April 8, 2024
Semiconductor, Engineering, Data Management, Technology, Manufacturing, Hardware, Temperature, Product marketing, M.2, SSD, BGA, Embedded, AI, Marketing, Traction, TB, Solid-state drive, AES, Video game

Virtium, a leading designer and manufacturer of industrial storage and memory solutions, today introduced the new StorFly® E1.S NVMe solid-state drive platform.

Key Points: 
  • Virtium, a leading designer and manufacturer of industrial storage and memory solutions, today introduced the new StorFly® E1.S NVMe solid-state drive platform.
  • Virtium has taken the E1.S form factor and transformed it into an "industrialized" solution, integrating essential features designed to enhance industrial applications.
  • The platform empowers design engineers with significant flexibility, allowing them to choose performance and the right capacity based on specific requirements.
  • The platform supports PCIe Gen4 and is backward compatible to PCIe Gen3 for low power consumption.

DFI Introduces QCS051 Industrial Motherboard

Retrieved on: 
Tuesday, April 9, 2024
Automation, HDMI, DFI, Temperature, Longevity, Qualcomm, M.2, Box, ESG, Power, AGV, RAM, AMR, LPDDR, Multimedia, Video game

TAIPEI, April 9, 2024 /PRNewswire/ -- DFI, the world's leading brand in embedded motherboards and industrial computers, today announced the launch of its latest innovation, the DFI QCS051 Industrial Motherboard, at Embedded World. Crafted to address the intricate needs of modern industrial automation, the QCS051 integrates the Qualcomm® QCS6490 processor, offering versatility for advanced applications such as Autonomous Mobile Robotics (AMR), Automated Guided Vehicles (AGV), and Box PCs.  Market analysis forecasts the burgeoning potential of AGVs and AMRs to soar to around $20 billion by 2028, accompanied by an anticipated installation base of 2.7 million robots. This surge is chiefly propelled by the logistics and manufacturing domains.

Key Points: 
  • TAIPEI, April 9, 2024 /PRNewswire/ -- DFI , the world's leading brand in embedded motherboards and industrial computers, today announced the launch of its latest innovation, the DFI QCS051 Industrial Motherboard, at Embedded World .
  • The QCS051 is a compact 2.5-inch Pico-ITX industrial motherboard designed for space-constrained environments, powered by the robust QCS6490 processor.
  • "In the era of integrating AI applications and emphasizing ESG sustainability, we proudly introduce the DFI QCS051 Industrial Motherboard powered by Qualcomm Technologies, offering balanced solutions with improved performance per watt.
  • "Powered by the QCS6490 processor, the QCS051 Industrial Motherboard represents a significant advancement in industrial automation technology," stated Dev Singh, vice president, business development and head of building, enterprise & industrial automation, Qualcomm Technologies, Inc. "We are proud to collaborate with DFI to deliver smarter, more efficient automation systems that empower businesses to thrive."

Innominds collaborates with Qualcomm to accelerate Enterprise Digital Transformation

Retrieved on: 
Tuesday, April 9, 2024
Qualcomm, Environmental monitoring, POS, Communication, M.2, Internet of things, SAN, Business development, Edge, Enterprise, NTN, AWS, Modem, Cognition, Automation, Som

SAN JOSE, Calif., April 9, 2024 /PRNewswire/ -- Innominds, a leader in edge orchestration, proudly announces the availability of iDhi, which is an enterprise and industrial IoT Edge Compute box. This Edge AI Platform is built around the Innominds ISQ5165/ISQ8250 small-form-factor System on Modules (SoM), which is powered by the Qualcomm® QRB5165/QCS8250 processors of Qualcomm Technologies, Inc., and can provide up to 15 TOPS of compute. Moreover, the Edge AI platform can now accommodate multiple M.2 slots for integrating AI accelerator modules, thereby enhancing its capability to handle industrial and enterprise workloads.

Key Points: 
  • High-compute Edge AI Platform, Sensor Gateway Device and NB-IoT Solutions based on Qualcomm® processors powering digital transformation for enterprises.
  • This Edge AI Platform is built around the Innominds ISQ5165/ISQ8250 small-form-factor System on Modules (SoM), which is powered by the Qualcomm® QRB5165/QCS8250 processors of Qualcomm Technologies, Inc., and can provide up to 15 TOPS of compute.
  • "As companies worldwide embrace digital transformation, Innominds, with its chip-to-cloud solutions and cognition platforms powered in part by Qualcomm Technologies' cutting-edge processors, is helping drive global digital transformation and innovation in enterprise and industrial IoT deployments," said Dev Singh, Vice President, Business Development and Head of Building, Enterprise & Industrial Automation, Qualcomm Technologies, Inc. "We are excited to collaborate with Innominds to help accelerate enterprise solutions."
  • "Our collaboration with Qualcomm Technologies has helped us to play a pivotal role in enterprise digital transformation."

Cavli Wireless All Set to Introduce the 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024

Retrieved on: 
Tuesday, March 26, 2024
Other Manufacturing, Technology, Telecommunications, Manufacturing, Software, Internet, Hardware, IOT (Internet of Things), Data Management, Connectivity, LGA, M.2, Internet of things, Embedded, Wireless, ESIM, 3GPP, MCU, Linux, Creativity, Redcap, M2M, GNSS, Mobile phone

Cavli Wireless , a pioneer in the IoT solutions landscape, is all set to announce its flagship 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024.

Key Points: 
  • Cavli Wireless , a pioneer in the IoT solutions landscape, is all set to announce its flagship 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024.
  • The event represents the premier stage for global innovators like Cavli Wireless to showcase the innovative CQM220 to the world.
  • The CQM220 is the flagship 5G RedCap cellular IoT module from Cavli Wireless, compatible with 3GPP release 17 standards, specifically designed for advanced IoT and M2M applications.
  • With the unveiling of the CQM220 at Embedded World 2024, Cavli Wireless reiterates its dedication to providing cost-effective, uninterrupted, and superior cellular IoT solutions.

SHARGE Launches Official Website in Germany, Expanding Global Presence

Retrieved on: 
Wednesday, March 27, 2024
Consumer Electronics, Environment, Technology, Sustainability, Other Technology, Green Technology, Hardware, EDC, M.2, Security printing

Leading global tech company SHARGE, is excited to announce the launch of its official website in Germany.

Key Points: 
  • Leading global tech company SHARGE, is excited to announce the launch of its official website in Germany.
  • The new German website provides German consumers with easy access to the brand's top-of-the-line charging solutions.
  • To celebrate the launch of the German official website, SHARGE will be offering exclusive deals for a limited time.
  • Weighing in at a mere 24g and designed to fit in your pocket, SHARGE Disk combines compactness with powerful features.

Cervoz at Embedded World 2024: Empowering Industry with Future-Ready Solutions

Retrieved on: 
Monday, March 25, 2024
ECC, Automation, Temperature, Communication, M.2, Memory, Data loss, Internet of things, NVM Express, DDR5, AI, PCI Express, Gigabit Ethernet, Solid-state drive, LVDS, Hall, Mobile phone

TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.

Key Points: 
  • TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.
  • At the event, Cervoz will showcase its advanced solutions in themes echoing today's industrial trends, highlighting edge and advanced computing, compact design, interconnectivity, and more.
  • Acknowledging the surge in edge computing, Cervoz introduces M.2 2230 (A+E Key) NVMe Gen3x2 solutions, the T425 series .
  • Lead the future of industries—join Cervoz at Embedded World 2024 in Hall 1, Booth 1-401.

Cervoz at Embedded World 2024: Empowering Industry with Future-Ready Solutions

Retrieved on: 
Monday, March 25, 2024
ECC, Automation, Temperature, Communication, M.2, Memory, Data loss, Internet of things, NVM Express, DDR5, AI, PCI Express, Gigabit Ethernet, Solid-state drive, LVDS, Hall, Mobile phone

TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.

Key Points: 
  • TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.
  • At the event, Cervoz will showcase its advanced solutions in themes echoing today's industrial trends, highlighting edge and advanced computing, compact design, interconnectivity, and more.
  • Acknowledging the surge in edge computing, Cervoz introduces M.2 2230 (A+E Key) NVMe Gen3x2 solutions, the T425 series .
  • Lead the future of industries—join Cervoz at Embedded World 2024 in Hall 1, Booth 1-401.

Fibocom Announces MediaTek-powered 5G RedCap Module FM330 Series to Lead 5G Expansion at MWC Barcelona 2024

Retrieved on: 
Monday, February 26, 2024
Cortex, Tao, Internet, Microsoft Windows, USB, Partnership, T300, MWC, Linux, Redcap, PC, MediaTek, Communication, M.2, Android, Arm, MBB, Tablet, PCB, LTE-M, Mobile World Congress

BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Key Points: 
  • Fibocom announces the launch of the industry-first T300-based 5G RedCap Module FM330 series in collaboration with MediaTek during MWC Barcelona 2024.
  • The FM330 series is positioned to expand the 5G landscape to a broader range, covering consumer-level, enterprise-level and industrial-level scenarios.
  • Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G.
  • Learn more about Fibocom's RedCap module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

Fibocom Announces MediaTek-powered 5G RedCap Module FM330 Series to Lead 5G Expansion at MWC Barcelona 2024

Retrieved on: 
Monday, February 26, 2024
Cortex, Tao, Internet, Microsoft Windows, USB, Partnership, T300, MWC, Linux, Redcap, PC, MediaTek, Communication, M.2, Android, Arm, MBB, Tablet, PCB, LTE-M, Mobile World Congress

BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Key Points: 
  • Fibocom announces the launch of the industry-first T300-based 5G RedCap Module FM330 series in collaboration with MediaTek during MWC Barcelona 2024.
  • The FM330 series is positioned to expand the 5G landscape to a broader range, covering consumer-level, enterprise-level and industrial-level scenarios.
  • Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G.
  • Learn more about Fibocom's RedCap module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.