STMicroelectronics

Setting A New Security Benchmark: Kudelski IoT's Semiconductor Alliances Redefine IoT Provisioning

Retrieved on: 
Wednesday, April 10, 2024

Setting A New Security Benchmark: Kudelski IoT's Semiconductor Alliances Redefine IoT Provisioning

Key Points: 
  • Setting A New Security Benchmark: Kudelski IoT's Semiconductor Alliances Redefine IoT Provisioning
    Premier integration with Microchip, and collaborative partnerships with ST Microelectronics, Infineon, and Silicon Labs radically simplify a critical IoT security requirement.
  • Kudelski IoT libraries are integrated with semiconductor partner tools to enable device manufacturers to personalize their products in the factory or in the field.
  • Hardy Schmidbauer, Senior Vice President at Kudelski IoT, said, “For many IoT device manufacturers, security provisioning is today a laborious manual process that is prone to error, seriously compromising the security of individual devices, or even of a manufacturer’s whole chain of security.
  • By partnering with top IC manufacturers, Kudelski IoT is making provisioning a simpler, more automated, and secure process than ever before.

InnoEX returns with twofold increase in the number of exhibiting countries and regions

Retrieved on: 
Friday, March 22, 2024

Through this approach, InnoEX promotes comprehensive cross-regional and cross-industry cooperation, aiming to enhance local I&T capabilities.

Key Points: 
  • Through this approach, InnoEX promotes comprehensive cross-regional and cross-industry cooperation, aiming to enhance local I&T capabilities.
  • As a founding event of the Business of Innovation and Technology Week (BITWeek), driven by the Hong Kong SAR Government and HKTDC, this year's InnoEX will bring together exhibitors from 13 countries and regions, doubling the number from last year.
  • Participating exhibitors will come from Hong Kong, Mainland China, Canada, France, India, Poland, Thailand, the United Kingdom and other locations.
  • The Smart Hong Kong Pavilion, organised by the Office of the Government Chief Information Officer (OGCIO), drew crowds at the previous InnoEX and returns this year.

STMicroelectronics Announces Status of Common Share Repurchase Program

Retrieved on: 
Monday, April 8, 2024

AMSTERDAM – April 8, 2024 -- STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated July 1, 2021. The Program was approved by a shareholder resolution dated May 27, 2021 and by the supervisory board.

Key Points: 
  • Disclosure of Transactions in Own Shares – Period from Apr 02, 2024 to Apr 05, 2024
    AMSTERDAM – April 8, 2024 -- STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated July 1, 2021.
  • The Program was approved by a shareholder resolution dated May 27, 2021 and by the supervisory board.
  • The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from debt financial instruments that are exchangeable into equity instruments.
  • Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form.

LoRa Alliance® Returns to Europe with LoRaWAN® Live Munich

Retrieved on: 
Wednesday, April 3, 2024

FREMONT, Calif., April 03, 2024 (GLOBE NEWSWIRE) -- The LoRa Alliance®, the global association of companies backing the open LoRaWAN® standard for the internet of things (IoT) low-power wide-area networks (LPWANs), today announced the preliminary program for LoRaWAN Live Munich, taking place June 19-20 at the Westin Grand Munich. The event focuses on all aspects of LoRaWAN, the leading global LPWAN technology, addressing how companies are scaling with multiple use cases and rolling out deployments across numerous sites and facilities. The program has a strong focus on the industrial internet of things (IIoT), covering LoRaWAN technology, deployments, use cases and how to achieve a strong return on investment via a series of panels, presentations and networking activities. The gold sponsors for the event are Browan Communications and ZENNER. Rounding out the list of sponsors are Digi International, STMicroelectronics, EchoStar Mobile, Murata, Semtech, WIKA, Actility, Adeunis, Alpha-Omega Technology, Kerlink, MultiTech and TEKTELIC Communications.

Key Points: 
  • “The value of bringing together the global LoRaWAN ecosystem cannot be overstated,” said Donna Moore, CEO and chairwoman of the LoRa Alliance.
  • The engaging program also includes a products and solutions marketplace, mainstage keynotes and VIP speakers, live demonstrations and plenty of networking opportunities.
  • A live LoRaWAN network will also be deployed, allowing attendees to see solutions using LoRaWAN in action, courtesy of Network Sponsor Actility.
  • If interested in attending LoRaWAN Live Munich, please contact the alliance at [email protected] to make arrangements.

STMicroelectronics helps Panasonic Cycle Technology bring AI to e-assisted bikes for affordable safety boost

Retrieved on: 
Wednesday, April 3, 2024

ST’s edge AI solutions provide a tire pressure monitoring system (TPMS) that leverages an advanced AI function to improve rider safety and convenience.

Key Points: 
  • ST’s edge AI solutions provide a tire pressure monitoring system (TPMS) that leverages an advanced AI function to improve rider safety and convenience.
  • ST's edge AI development tool, STM32Cube.AI, enabled Panasonic to implement this edge AI function while fitting into STM32F3 embedded memory space.
  • This new function simplifies tire air-pressure maintenance, which enhances rider safety and prolongs the life of tires and other cycle components.
  • ST offers a comprehensive edge AI ecosystem for spreading edge AI to devices used in a wide range of scenarios.

DigiKey Hosts Great Board Giveaway, Technical Demos and More at Embedded World 2024

Retrieved on: 
Tuesday, April 2, 2024

NUREMBERG, Germany, April 02, 2024 (GLOBE NEWSWIRE) -- DigiKey , a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, will bring its refreshed brand and Great Board Giveaway to embedded world 2024 , April 9-11 in Nuremberg, Germany.

Key Points: 
  • NUREMBERG, Germany, April 02, 2024 (GLOBE NEWSWIRE) -- DigiKey , a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, will bring its refreshed brand and Great Board Giveaway to embedded world 2024 , April 9-11 in Nuremberg, Germany.
  • Visit the DigiKey booth during the show for the Great Board Giveaway and receive a random draw development board from our supporting partners, including NXP Semiconductors , u-blox , Raspberry Pi and STMicroelectronics .
  • At the booth, visitors can also view demos and chat with technical experts at the DigiKey TechBench.
  • “We look forward to connecting with the embedded community at embedded world 2024,” said Mike Slater, vice president, global business development at DigiKey.

Octavo Systems Unveils the OSD32MP2 Series: Revolutionizing System Design in the Electronics Industry

Retrieved on: 
Tuesday, April 9, 2024

NUREMBERG, Germany, April 9, 2024 /PRNewswire/ -- Octavo Systems , a leader in system integration technology, proudly announces the launch of its OSD32MP2 family , featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM .

Key Points: 
  • NUREMBERG, Germany, April 9, 2024 /PRNewswire/ -- Octavo Systems , a leader in system integration technology, proudly announces the launch of its OSD32MP2 family , featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM .
  • The OSD32MP2 family caters to a diverse range of applications, from industrial automation to consumer electronics, offering unparalleled processing power, connectivity, and security features.
  • "Octavo Systems is committed to empowering electronics design engineers by simplifying the complexities of modern electronic design," said Harley Walsh, President of Octavo Systems.
  • For additional information, including detailed specifications and ordering details, please visit https://octavosystems.com or contact Octavo Systems at [email protected] .

Green Hills Software, STMicroelectronics and Cetitec Collaborate on Delivering Configurable In-Vehicle Communications Platform for Automotive Zonal Controllers

Retrieved on: 
Tuesday, April 9, 2024

NUREMBERG, Germany, April 9, 2024 /PRNewswire/ -- Green Hills Software, the worldwide leader in embedded safety and security, together with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Cetitec, a Porsche company and leading software specialist for the development of connectivity and networking system solutions, today announced a collaboration to deliver an integrated and configurable communications platform for use in zonal controllers for the centralized EE vehicle architecture of the SDV. This solution consists of Green Hills' µ-velOSity™ real-time operating system (RTOS), ST's Stellar Integration MCU platform, and Cetitec's advanced networking stacks, gateways and routing frameworks.

Key Points: 
  • This zonal-based centralized architecture has increased requirements for performance, safety and security of the zonal controllers and necessitates new in-vehicle networking solutions.
  • Based on this platform, Cetitec provides a demonstrator consisting of the Cetitec Gateway and the Cetitec Distributed Communications Framework (CDCF).
  • "Our collaboration with Cetitec and Green Hills on the Stellar platform brings safe and efficient solutions to our customers.
  • Green Hills, ST, and Cetitec will demonstrate the zonal controller solution platform at embedded world 2024, April 9-11, in the Green Hills booth #4-325 and in the ST booth #4A-148.

Macronix Non-Volatile Memory Solutions Showcase with Partners NXP, ST at embedded world 2024

Retrieved on: 
Monday, April 8, 2024

NUREMBERG, Germany, April 7, 2024 /PRNewswire/ -- Macronix International Co., Ltd. (TSE: 2337), a leading integrated-device manufacturer of non-volatile memory (NVM) solutions, will have its versatile NVM solutions showcased at embedded world 2024 through its partnerships with industry leaders NXP Semiconductors (NXP) and STMicroelectronics (ST).

Key Points: 
  • NUREMBERG, Germany, April 7, 2024 /PRNewswire/ -- Macronix International Co., Ltd. (TSE: 2337), a leading integrated-device manufacturer of non-volatile memory (NVM) solutions, will have its versatile NVM solutions showcased at embedded world 2024 through its partnerships with industry leaders NXP Semiconductors (NXP) and STMicroelectronics (ST).
  • Macronix flash memory will be featured among NXP partners as the processor leader highlights its solutions in Internet of Things (IoT) and S32G Vehicle Network Processors, based on the Arm® Cortex® A53 architecture, in automotive applications.
  • Additionally, Macronix's MX66UW1G45G OctaFlash™ memory will play an integral role in ST's demonstrations of high-end graphics and graphical user interfaces, powered by the new STM32H7Sx/Rx high-performance microcontroller, and the new STM32MP2 microprocessor with neural processing unit targeted at Industry 4.0 and edge artificial intelligence applications.
  • Macronix NVM solutions exhibit with partners at embedded world 2024:

STMicroelectronics Announces Status of Common Share Repurchase Program

Retrieved on: 
Monday, March 25, 2024

AMSTERDAM – March 25, 2024 -- STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated July 1, 2021. The Program was approved by a shareholder resolution dated May 27, 2021 and by the supervisory board.

Key Points: 
  • Disclosure of Transactions in Own Shares – Period from Mar 18, 2024 to Mar 20, 2024
    AMSTERDAM – March 25, 2024 -- STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated July 1, 2021.
  • The Program was approved by a shareholder resolution dated May 27, 2021 and by the supervisory board.
  • The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from debt financial instruments that are exchangeable into equity instruments.
  • Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form.