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Open Compute Project Tackles Data Center Hardware and Firmware Security

Retrieved on:

Tuesday, October 17, 2023

Cloud, Silicon, NCC, Security, SRP, NCC Group, Google Cloud, Intel, Checklist, CISO, Self-assessment, AMD, SK Hynix, SAN, OCP, IDC, SAFE, SK, Video game, Online shopping, Enablement

SAN JOSE, Calif., Oct. 17, 2023 /PRNewswire/ -- Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announced a new program, OCP Security Appraisal Framework and Enablement (S.A.F.E.) designed to improve the trustworthiness of devices across all data center IT infrastructure. The OCP S.A.F.E. program is expected to reduce cost overhead and redundancy of device security audits with an OCP Community developed per device security checklist, and advance the security posture of device hardware and firmware components across the supply chain.

Key Points:

program is expected to reduce cost overhead and redundancy of device security audits with an OCP Community developed per device security checklist, and advance the security posture of device hardware and firmware components across the supply chain.
It all starts with the OCP Community developing a standardized device specific audit checklist and criteria for selecting 3rd party device security review auditors.
Security is the underlying foundation which makes OCP core tenets of efficiency, openness, scale, impact and sustainability possible," said Steve Helvie, VP Emerging Markets at the Open Compute Project Foundation.
(3) advance the security posture of device hardware and firmware components, through iterative refinement of review areas, testing scopes and reporting requirements.

Open Compute Project Tackles Data Center Hardware and Firmware Security

Retrieved on:

Tuesday, October 17, 2023

Cloud, Silicon, NCC, Security, SRP, NCC Group, Google Cloud, Intel, Checklist, CISO, Self-assessment, AMD, SK Hynix, SAN, OCP, IDC, SAFE, SK, Video game, Online shopping, Enablement

SAN JOSE, Calif., Oct. 17, 2023 /PRNewswire/ -- Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announced a new program, OCP Security Appraisal Framework and Enablement (S.A.F.E.) designed to improve the trustworthiness of devices across all data center IT infrastructure. The OCP S.A.F.E. program is expected to reduce cost overhead and redundancy of device security audits with an OCP Community developed per device security checklist, and advance the security posture of device hardware and firmware components across the supply chain.

Key Points:

program is expected to reduce cost overhead and redundancy of device security audits with an OCP Community developed per device security checklist, and advance the security posture of device hardware and firmware components across the supply chain.
It all starts with the OCP Community developing a standardized device specific audit checklist and criteria for selecting 3rd party device security review auditors.
Security is the underlying foundation which makes OCP core tenets of efficiency, openness, scale, impact and sustainability possible," said Steve Helvie, VP Emerging Markets at the Open Compute Project Foundation.
(3) advance the security posture of device hardware and firmware components, through iterative refinement of review areas, testing scopes and reporting requirements.

XConn Technologies Showcases Composable Memory System Prototype with CXL™ 2.0 Ecosystem at 2023 OCP Global Summit

Retrieved on:

Tuesday, October 17, 2023

Silicon, MXC, CXL, Compute Express Link, 2.0, CPU, AI, Montage, Intel, Elasticity, CMM, HPC, CMS, Ecosystem, AMD, Architecture, SAN, OAM, Software, OCP, Memory, Apollo, PCI Express, SOC, 1.1, Mobile phone, Video game, Construction

SAN JOSE, Calif., Oct. 17, 2023 /PRNewswire/ -- XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for the future of high-performance computing and AI applications, today announced that it will be displaying a Composable Memory System prototype during the 2023 OCP Global Summit, October 17-19 in San Jose, at the OCP Open Experience Center. The demonstration – which will include solutions from AMD, Intel, MemVerge, Montage, SMART Modular and XConn's Apollo CXL/PCIe switch – will highlight the benefits of a Compute Express Link™ (CXL™) 2.0-based Composable Memory System featuring memory expansion, pooling, and sharing for demanding HPC and AI applications.

Key Points:

SAN JOSE, Calif., Oct. 17, 2023 /PRNewswire/ -- XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for the future of high-performance computing and AI applications, today announced that it will be displaying a Composable Memory System prototype during the 2023 OCP Global Summit, October 17-19 in San Jose, at the OCP Open Experience Center.
The Composable Memory System (CMS) is a sub-project within the OCP.
Its mission is to define architecture and the spec for memory systems that are composable to meet the demand of AI computing.
During OCP Global Summit, XConn will demonstrate a first-in-class composable memory system with servers powered by AMD, Intel, the Memory eXpander Controller (MXC) for CXL from Montage Technology, elastic memory software from MemVerge, and the high-speed CPU interconnect (CMM) for CXL from SMART Modular Technologies.

DriveNets Network Cloud-AI - the Highest-Performance AI Ethernet Solution - is available for order with Broadcom Jericho 3-AI Based White Boxes

Retrieved on:

Tuesday, October 17, 2023

This second AI networking solution from DriveNets is based on Network Cloud-AI which was introduced in May supporting white boxes based on Broadcom's Jericho 2C+.

Key Points:

This second AI networking solution from DriveNets is based on Network Cloud-AI which was introduced in May supporting white boxes based on Broadcom's Jericho 2C+.
Built on DriveNets' Network Cloud – which is deployed in the world's largest networks, DriveNets Network Cloud-AI supports the highest-performance, fully scheduled networking system based on open standard Ethernet.
DriveNets Network Cloud-AI was validated by leading hyperscalers in early trials as the top performing Ethernet solution for AI networking.
The availability of Network Cloud-AI software and Jericho 3-AI based white boxes allows builders of AI infrastructures to have a highest-performance, fully scheduled networking system available in the market today, based on open standard Ethernet.

Marvell Showcases Technology for Next-Generation AI and Cloud Networks at OCP Global Summit

Retrieved on:

Tuesday, October 17, 2023

Cloud, Microsoft, SerDes, San Jose Convention Center, PAM4, AI, TBPS, MRVL, SSD, GM, Manhattan Center, DPU, SC5, Ecosystem, Marvell, Marvell Technology, See, B13, Associate, DSP, OCP, PCI Express, DCI, EVP, Nova, Medical device, Computer data storage, Video game, Marketing

SANTA CLARA, Calif., Oct. 17, 2023 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will share its vision for advancing the next generation of AI and cloud networks at the 2023 Open Compute Project (OCP) Global Summit taking place October 17-19 at the San Jose Convention Center in San Jose, California.

Key Points:

Nguyen's presentation, "AI Drives the Need for (More) Speed," will discuss the ways optical technology can meet the AI bandwidth challenge and how collaboration across the ecosystem is advancing innovation to scale AI platforms.
Live demonstrations include:
Marvell® Teralynx® 10 , an ultra-low latency, programmable 51.2 Tbps switch chip optimized for multi-tenant AI and cloud architectures.
Marvell long-reach SerDes circuit for 64G PCIe Gen6 built on a 3nm process node and optimized for composable cloud infrastructure.
Marvell PAM4 DSP technology enabling 200 Gbps per lane over electrical channels for next-generation cloud data center and high-performance computing connectivity.

Molex Announces KickStart Connector System, First OCP-Compliant, All-in-One Boot-Drive Connectivity Solution with Integrated Power and Signal Circuits

Retrieved on:

Tuesday, October 17, 2023

An innovative, all-in-one system, KickStart is the first OCP-compliant solution that combines low-speed and high-speed signals, as well as power circuits, into a single cable assembly.

Key Points:

An innovative, all-in-one system, KickStart is the first OCP-compliant solution that combines low-speed and high-speed signals, as well as power circuits, into a single cable assembly.
"The KickStart Connector System reinforces our goal to remove complexity and drive increased standardization in modern data centers," said Bill Wilson, new product development manager for Datacom & Specialty Solutions, Molex.
As the only OCP-recommended internal I/O connectivity solution for boot-drive applications, KickStart empowers customers to address evolving storage-signal speeds.
Visit Molex at Booth B1 for a complete product showcase of the latest OCP-recommended and OCP-compliant connectivity solutions, including KickStart.

Data Center with Passive Direct Liquid Cooling Will Utilize a Heat Reuse Scheme to Warm Up a City in Poland

Retrieved on:

Tuesday, October 17, 2023

MTEC, Loop heat pipe, Modular data center, Ecosystem, Growth, SAN, OCP, MDC, PDLC, Green Loop, Water, Recycling

The planned data center will be built using 350kW Modular Data Centers with PDLC developed by Neurok Thermocon Inc.

Key Points:

The planned data center will be built using 350kW Modular Data Centers with PDLC developed by Neurok Thermocon Inc.
Passive Direct Liquid Cooling appeared recently on the crossroad of multiple trends in the data center industry.
Loop Heat Pipes based PDLC enables sustainable data center growth and maintains an ability of heat reuse with minimal efforts.
Neurok Thermocon Inc. provides Passive Direct Liquid Cooling (PDLC) systems for data centers all over the world under the brand Green Loop Cooling.

Celestica Launches its Next Generation 800G Switch, Powering Artificial Intelligence and Advancing Data Center Connectivity for the Future

Retrieved on:

Monday, October 16, 2023

Cloud, Silicon, NYSE, TSX, Engineering, SJCC, CLS, Sonic, TBPS, OSFP, Software, Head, Open Network Install Environment, OCP, HPS, ONIE, Celestica, Business development, ML, Video game, Broadcom Inc.

The DS5000 switch will be on display at this week’s 2023 OCP Global Summit .

Key Points:

The DS5000 switch will be on display at this week’s 2023 OCP Global Summit .
It is the newest addition to Celestica’s Hardware Platform Solutions (HPS) portfolio of cutting-edge storage, compute, networking, and webscale solutions.
It features 64 OSFP 800GbE ports, providing a 51.2 Tbps Ethernet-based fabric solution within a 2U form factor to deliver next-generation, high-performance networking.
In addition, the DS5000 enables next-gen power efficiency, offering more than 75% power reduction from previous generation 400G switches.

Micas Networks Partners with EPS Global to Deliver High-Performance, Scalable Open Network Solutions

Retrieved on:

Monday, October 16, 2023

Partnership, San Jose Convention Center, Sonic, EPS, Trust, SAN, Software, OCP

SAN JOSE, Calif., Oct. 16, 2023 (GLOBE NEWSWIRE) -- Micas Networks (Micas), an inventive open networking solutions provider, today kicked off its global channel program by signing a distribution agreement with EPS Global .

Key Points:

SAN JOSE, Calif., Oct. 16, 2023 (GLOBE NEWSWIRE) -- Micas Networks (Micas), an inventive open networking solutions provider, today kicked off its global channel program by signing a distribution agreement with EPS Global .
A value-added distributor, EPS Global is known for its expertise in open and traditional networking solutions, supporting service providers across the Americas, EMEA and Asia.
Focused on delivering network technology that is agile, reliable and cost-effective, Micas delivers a full portfolio of open networking switches for edge, core and cloud deployments.
“EPS Global is a highly collaborative distributor that brings strong technical competence to the table,” said Don Evans, senior director, channel sales for Micas Networks.

Micron Delivers Industry-Leading Mainstream PCIe® Gen4 Data Center SSD

Retrieved on:

Monday, October 16, 2023

BOISE, Idaho, Oct. 16, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc., (Nasdaq: MU), today announced the Micron 7500 NVMe SSD for data center workloads. The 7500 SSD is the world's only mainstream data center SSD to feature 200+ layer NAND, utilizing Micron's 232-layer NAND and enabling up to 242% better random write performance than competitive drives.1 The SSD also delivers sub-1 millisecond (1ms) latency for 6x9s quality-of-service (QoS) in mainstream drives, creating a new, industry-leading class of SSDs perfectly suited to deliver the consistency required in the cloud.2

Key Points:

Micron 7500 is the world’s first mainstream data center SSD with 200+ layer NAND, providing superior quality of service and delivering new benchmarks in performance
BOISE, Idaho, Oct. 16, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc., (Nasdaq: MU), today announced the Micron 7500 NVMe SSD for data center workloads.
For example, the drive improves RocksDB performance by up to 2.1 times versus competitive SSDs.3
“The Micron 7500 SSD is a game-changer for data center workloads, delivering blazing-fast performance, exceptional QoS reliability and advanced security unmatched by any other SSD in its class,” said Alvaro Toledo, vice president and general manager of Micron’s Data Center Storage group.
SSDs like the Micron 7500, which deliver low and consistent latency, are at the heart of it.”
The Micron 7500 SSD offers:
The Micron 7500 SSD offers broad support for the Open Compute Project (OCP) SSD 2.0 specification,5 which provides intelligent management, performance optimization, seamless integration, and error handling for data center environments.
To learn more about the Micron 7500 SSD and how it can power your data center workloads, visit micron.com/7500 .