Amkor Technology

New Study from StrategyR Highlights a $14.7 Billion Global Market for 3D Semiconductor Packaging by 2026

Retrieved on: 
Friday, February 18, 2022
Onto Innovation, Consumer electronics, Adoption, Tablet, Internet, Growth, Glass, GIA, SAN, Pop, Efficiency, Silicon, ASE, Amkor Technology, Original equipment manufacturer, Technology, TGV, Method, Geography, Marketing, Forecasting, 3D, Machine learning, CAGR, Investment, ICS, Research, COVID-19, Intelligence, ACE EV Group, Players, TSV, ODM, Video game, Video game console, Others, Telecommunication, Package

SAN FRANCISCO, Feb. 18, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, Feb. 18, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics" .
  • This segment currently accounts for a 24.7% share of the global 3D Semiconductor Packaging market.
  • The U.S. Market is Estimated at $1.2 Billion in 2022, While China is Forecast to Reach $4.6 Billion by 2026
    The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.2 Billion in the year 2022.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

Amkor Declares Quarterly Dividend

Retrieved on: 
Tuesday, February 8, 2022
Packaging, Semiconductor, Communications, Technology, Manufacturing, Public Relations, Investor Relations, Board of directors, Board, IC, Nasdaq, Amkor Technology, Original equipment manufacturer, Technology, Electronics, Semiconductor

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that its Board of Directors has approved a quarterly cash dividend of $0.05 per share on the companys common stock.

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that its Board of Directors has approved a quarterly cash dividend of $0.05 per share on the companys common stock.
  • The dividend will be payable on March 21, 2022 to stockholders of record as of the close of business on March 1, 2022.
  • Amkor Technology, Inc. is one of the worlds largest providers of outsourced semiconductor packaging and test services.
  • Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test services and is now a strategic manufacturing partner for the worlds leading semiconductor companies, foundries and electronics OEMs.

Amkor Technology to Announce Fourth Quarter and Full Year 2021 Financial Results on February 14, 2022

Retrieved on: 
Monday, January 24, 2022
Semiconductor, Data Management, Security, Technology, Software, Hardware, Original equipment manufacturer, Webcast, Technology, Electronics, Nasdaq, Amkor Technology, Investor relations, IC, Semiconductor

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the fourth quarter and full year of 2021 after the close of trading on the Nasdaq Global Select Market on Monday, February 14, 2022.

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the fourth quarter and full year of 2021 after the close of trading on the Nasdaq Global Select Market on Monday, February 14, 2022.
  • Amkor management will host a conference call and webcast to review the results on Monday, February 14, 2022, at 5:00 p.m. Eastern Time (ET).
  • To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkors website, located at ir.amkor.com .
  • Amkor Technology, Inc. is one of the worlds largest providers of outsourced semiconductor packaging and test services.

Global Interposer Market Report 2021: Analysis, Opportunities and Competitive Landscape 2015-2026 Featuring Murata, Amkor, AGC, Atomica, and TSMC - ResearchAndMarkets.com

Retrieved on: 
Tuesday, January 18, 2022
Technology, Other Technology, AGC, CAGR, SOC, RF, IOT, Murata, Competitive analysis, Atom (character), M&A, Miniaturization, Urbanization, Adoption, MEMS, TSMC, CIS, Forecast, Electronics, International Strategic Analysis, Industry, Amkor Technology, RDL, Artificial intelligence, Internet, 3D, Porter's five forces analysis, Growth, 2D, Machine learning, Retail, Video game console

The "Opportunities and Competitive Analysis of the Interposer Market" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Opportunities and Competitive Analysis of the Interposer Market" report has been added to ResearchAndMarkets.com's offering.
  • The global interposer market is expected to reach an estimated $639.2 million by 2026 with a CAGR of 18% from 2021 to 2026.
  • The future of the interposer market looks promising with opportunities in the CIS, CPU/GPU, MEMS 3D capping interposer, RF devices, logic SoC, and ASIC/FPGA markets.
  • Growth Opportunities: Analysis on growth opportunities in different applications and product types and regions for the interposer market.

New Study from StrategyR Highlights a $14.7 Billion Global Market for 3D Semiconductor Packaging by 2026

Retrieved on: 
Tuesday, January 18, 2022
Geography, Forecasting, CAGR, Research, Technology, Onto Innovation, SAN, TSV, Tablet, COVID-19, ODM, Adoption, Method, Growth, GIA, Consumer electronics, Intelligence, ICS, ACE EV Group, Glass, Silicon, Marketing, Internet, TGV, Efficiency, Players, Original equipment manufacturer, Pop, Amkor Technology, 3D, ASE, Investment, Machine learning, Video game, Video game console, Others, Telecommunication, Package

SAN FRANCISCO, Jan. 18, 2022 /PRNewswire/ --A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, Jan. 18, 2022 /PRNewswire/ --A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics" .
  • This segment currently accounts for a 24.7% share of the global 3D Semiconductor Packaging market.
  • The U.S. Market is Estimated at $1.1 Billion in 2021, While China is Forecast to Reach $4.6 Billion by 2026
    The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.1 Billion in the year 2021.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

Amkor Technology to Present at the Needham Virtual Growth Conference

Retrieved on: 
Tuesday, December 28, 2021
Packaging, Semiconductor, Technology, Manufacturing, Other Technology, Other Manufacturing, Hardware, Technology, Amkor Technology, Investor relations, Electronics, IC, Original equipment manufacturer, NASDAQ, Conference, Semiconductor

Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the 24th Annual Needham Virtual Growth Conference on Tuesday, January 11, 2022.

Key Points: 
  • Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the 24th Annual Needham Virtual Growth Conference on Tuesday, January 11, 2022.
  • Amkors presentation will occur at 3:30 pm Eastern Time (1:30 pm Mountain Time).
  • A webcast of the presentation will be made available, both live and by replay, on the Investor Relations section of Amkors website, located at ir.amkor.com .
  • Amkor Technology, Inc. is one of the worlds largest providers of outsourced semiconductor packaging and test services.

Outlook on the Organic Substrate Packaging Material Global Market to 2026 - by Technology, Application and Region

Retrieved on: 
Wednesday, November 24, 2021
Adoption, Amkor Technology, Technology, Coronavirus, Industry, CAGR, Health, NGK, Polychlorinated biphenyl, Active Intelligence Pte Ltd, Hitachi, COVID-19, Fujitsu, Mitsubishi Corporation, ASE Group, Efficiency, ICT, STATS, Kyocera, Animal, Printed circuit board, Adhesive, Potash

The global organic substrate packaging material market exhibited moderate growth during 2015-2020.

Key Points: 
  • The global organic substrate packaging material market exhibited moderate growth during 2015-2020.
  • Co.) and WUS Printed Circuit Co. Ltd.
    How has the global organic substrate packaging material market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global organic substrate packaging material market?
  • What is the structure of the global organic substrate packaging material market and who are the key players?

Amkor Announces 25% Increase in Quarterly Cash Dividend

Retrieved on: 
Tuesday, November 16, 2021
Semiconductor, Manufacturing, Other Technology, Technology, Packaging, Board of directors, Electronics, Board, IC, Amkor Technology, Nasdaq, Technology, Original equipment manufacturer, Semiconductor

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that its Board of Directors has approved a 25% increase in the companys quarterly cash dividend, from $0.04 per share to $0.05 per share, on the companys common stock.

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that its Board of Directors has approved a 25% increase in the companys quarterly cash dividend, from $0.04 per share to $0.05 per share, on the companys common stock.
  • This increase will be effective with the dividend payment to be distributed on December 28, 2021 to stockholders of record on December 7, 2021.
  • Based on our strong operating results and financial position, Amkor has increased its quarterly cash dividend by 25%, said Giel Rutten, Amkors president and chief executive officer.
  • Amkor Technology, Inc. is one of the worlds largest providers of outsourced semiconductor packaging and test services.

Amkor Technology to Present at the Bank of America Securities 2021 Virtual Leveraged Finance Conference

Retrieved on: 
Tuesday, November 16, 2021
Semiconductor, Hardware, Manufacturing, Technology, Packaging, NASDAQ, Electronics, Investor relations, IC, Bank, Amkor Technology, Conference, Technology, United States, Original equipment manufacturer, Semiconductor

Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the Bank of America Securities 2021 Virtual Leveraged Finance Conference on Tuesday, November 30, 2021.

Key Points: 
  • Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the Bank of America Securities 2021 Virtual Leveraged Finance Conference on Tuesday, November 30, 2021.
  • Amkors presentation will occur at 12:45 pm Eastern Time (10:45 am Mountain Time).
  • A webcast of the presentation will be made available, both live and by replay, on the Investor Relations section of Amkors website, located at https://ir.amkor.com .
  • Amkor Technology, Inc. is one of the worlds largest providers of outsourced semiconductor packaging and test services.

Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications

Retrieved on: 
Thursday, November 11, 2021
Networks, Semiconductor, Hardware, Data Management, Technology, Efficiency, News, Ecosystem, Electronics, Samsung Electronics, Technology, PCB, Television, Multimedia, Amkor Technology, AI, Partnership, Samsung, OSAT, Distortion, Semiconductor, Environment, Solution, HBM, Hay Group Global R&D Center for Strategy Execution, PST, SAFE, Memory, Tablet, Samsung Electro-Mechanics, LED, HDI, LSI, Silicon, HPC, Printed circuit board, Mobile phone

"By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."

Key Points: 
  • "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."
  • When integrating six or more HBMs, the difficulty in manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency.
  • Looking ahead, in cooperation with its ecosystem partners, Samsung will hold its 3rd Annual Samsung Advanced Foundry Ecosystem (SAFETM) Forum' virtually on November 17 (PST).
  • For pre-registration on the SAFE forum, please visit https://www.samsungfoundry.com
    Samsung inspires the world and shapes the future with transformative ideas and technologies.