STATS

ECS Named Prime on $500M ARPA-H IDIQ

Retrieved on: 
Monday, March 11, 2024
Software, Research, General Health, Data Management, Technology, Artificial Intelligence, Security, Health Technology, Science, Biotechnology, Other Science, Health, Financial management, DHA, Conditional sentence, STATS, HHS, ECS, IDIQ, Heart, ARPA, Bangladesh Technical Education Board, DARPA, Artificial intelligence, Medical device

ECS , a leader in advanced technology, science, and engineering solutions and an ASGN (NYSE: ASGN) brand, has been named a prime contractor on a five-year, $500M indefinite delivery/indefinite quality (IDIQ) contract from the Department of Health and Human Services (HHS) Advanced Research Projects Agency for Health (ARPA-H) .

Key Points: 
  • ECS , a leader in advanced technology, science, and engineering solutions and an ASGN (NYSE: ASGN) brand, has been named a prime contractor on a five-year, $500M indefinite delivery/indefinite quality (IDIQ) contract from the Department of Health and Human Services (HHS) Advanced Research Projects Agency for Health (ARPA-H) .
  • Under the contract, ECS will support ARPA-H in managing pivotal investments in breakthrough technologies and broadly applicable platforms, capabilities, resources, and solutions.
  • It will also enable ARPA-H to leverage ECS services and solutions across their forward-facing mission offices and support offices.
  • First, we’ve served as a prime contractor with the Defense Advanced Research Projects Agency, which pioneered the federal “ARPA Model” used by ARPA-H today.

ECS President John Heneghan Named Wash100 Award Winner

Retrieved on: 
Wednesday, February 21, 2024
Security, Government Technology, Defense, White House, Federal Government, State, Local, Other Technology, Contracts, Artificial Intelligence, Networks, Internet, Consulting, Homeland Security, Data Management, Professional Services, Technology, Public Policy, Government, Health, Health Technology, ECS, Intelligence, Digital, Risk, CNIC, IDIQ, ERG, Pathfinder, Machine learning, Science, Veterans' affairs, Environment, STATS, Commander, Navy Installations Command, Medical device

ECS , a leader in advanced technology, science, and engineering solutions and an ASGN (NYSE: ASGN) brand, announced today that President John Heneghan has been recognized as a 2024 Wash100 Award winner by Executive Mosaic, an international leadership organization and media company.

Key Points: 
  • ECS , a leader in advanced technology, science, and engineering solutions and an ASGN (NYSE: ASGN) brand, announced today that President John Heneghan has been recognized as a 2024 Wash100 Award winner by Executive Mosaic, an international leadership organization and media company.
  • This marks the third consecutive year that Heneghan has been recognized on the list.
  • Heneghan assumed the role of ECS president in 2022.
  • “I’m proud to be named to the Wash100 list once again, because it reflects the value of the work we do and the impact our teams make on government missions,” said Heneghan.

NOBLIS SELECTED FOR $500 MILLION CONTRACT TO HELP ADVANCE ARPA-H INITIATIVES

Retrieved on: 
Wednesday, February 7, 2024
STATS, Health policy, Federation, Noblis, ARPA, Science, Management

Under this contract, Noblis will work closely with ARPA-H program managers and senior leaders to refine and hone transformational ideas, address oversight and health policy requirements and bring medical breakthroughs and emerging technologies to the broader U.S. market.

Key Points: 
  • Under this contract, Noblis will work closely with ARPA-H program managers and senior leaders to refine and hone transformational ideas, address oversight and health policy requirements and bring medical breakthroughs and emerging technologies to the broader U.S. market.
  • “As a science and technology nonprofit focused on client missions, Noblis’ outlook aligns with the revolutionary ARPA model in innovation,” said Mile Corrigan , Noblis’ president and chief executive officer.
  • “Our culture of technology-based, solutions-oriented thinking is in sync with the bold ambition of ARPA-H.”
    “We are excited for the opportunity to help drive new ideas and solutions through ARPA-H,” said Lisa Gardner , vice president of Noblis’ Federal Civilian Solutions mission area.
  • “Noblis’ health domain and ARPA experts bring the know-how to apply innovation, data and science-based solutions now to address future public health challenges.”

TelcoBridges Announces Availability of ProSBC Session Border Controller as a Service

Retrieved on: 
Monday, January 22, 2024
Cloud, Denial-of-service attack, Chosen-ciphertext attack, Research, STATS, Ford Torino engine specifications, CMO, USD, Service, SBC, B2BUA, SIP

MONTREAL, Jan. 22, 2024 /PRNewswire-PRWeb/ -- TelcoBridges, a leading designer and manufacturer of carrier-grade session border controller software, today announced availability of its award-winning ProSBC session border controller software as a fully-managed service. ProSBC as a service includes a product license subscription with a bundle of professional service hours to instantiate, configure, integrate, test and monitor the client's SBC. The service is billed monthly with incentives for long duration contracts. Benefits include fast deployment, less time training, expert configuration, high reliability and peace of mind with 24x7 monitoring.

Key Points: 
  • Offered as a Fully Managed Service, ProSBC as a Service Meets the Needs of Growing Cloud-Based and xCaaS Service Providers
    MONTREAL, Jan. 22, 2024 /PRNewswire-PRWeb/ -- TelcoBridges , a leading designer and manufacturer of carrier-grade session border controller software, today announced availability of its award-winning ProSBC session border controller software as a fully-managed service.
  • Offering ProSBC as a Service fulfills the requests from service providers that would prefer to outsource the configuration and day-to-day management of SBC services.
  • ProSBC as a Service is targeted toward service provider use cases, including:
    DDOS Protection – blocking illicit call attempts designed to overwhelm service provider networks.
  • TelcoBridges' ProSBC is a virtual session border controller, that protects networks from attack while offering extensive SIP interoperability and routing features with outstanding session handling performance.

ViewLift Welcomes Two Industry Titans to its Board: John Rose and Steve Byrd

Retrieved on: 
Monday, January 22, 2024
EMI, Head, STATS, OTT, U.S. state, Friends, Business, BCG, Sport, Ted, Ted Leonsis, University, Telecommunications, Partnership, Global Media, Growth, Management

"I'm delighted to announce that Steve and John are joining our board," said Rick Allen, ViewLift's CEO and Board member.

Key Points: 
  • "I'm delighted to announce that Steve and John are joining our board," said Rick Allen, ViewLift's CEO and Board member.
  • Through my previous experience of working with John and Steve, I know that they have the right skills and experience that will help drive ViewLift forward."
  • John Rose brings over 30 years of experience in the media and entertainment industry.
  • Steve Byrd is a senior executive with decades of extensive experience in the sports industry.

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

Retrieved on: 
Monday, January 8, 2024
Dai, Architecture, QFN, Conference, Maverick Capital, LLM, ISSCC, AI, Lam Research, Marvell Technology, LAS, Chiplet, Hillhouse Capital Group, IP, Electronics, SOC, Silicon, STATS, Renewable energy

The company is already forecasting high demand on existing capacity and has successfully closed Series B funding to expand production rapidly.

Key Points: 
  • The company is already forecasting high demand on existing capacity and has successfully closed Series B funding to expand production rapidly.
  • Additionally, Silicon Box's large production format sets a new industry standard for large scale, high yield production especially for advanced chiplet-based designs.
  • Silicon Box announced a successful $200M Series B fundraising round, bringing the company to over a one-billion-dollar valuation.
  • Silicon Box and its technologies are extremely important for the semiconductor industry, and the digital world."

Silicon Box Accelerates Industry Leadership With Production Commencement at Its World Leading Advanced Packaging Facility and Series B Fundraising

Retrieved on: 
Monday, January 8, 2024
Dai, Architecture, QFN, Conference, Maverick Capital, LLM, ISSCC, AI, Lam Research, Marvell Technology, Chiplet, Hillhouse Capital Group, IP, Electronics, SOC, Silicon, STATS, Renewable energy

Company is leading the pack to bring affordable, high performance, power-optimized, scalable solutions that enable next-gen large language models (LLM), generative AI, automotive, data centers, and mobile computing

Key Points: 
  • The company is already forecasting high demand on existing capacity and has successfully closed Series B funding to expand production rapidly.
  • Additionally, Silicon Box's large production format sets a new industry standard for large scale, high yield production especially for advanced chiplet-based designs.
  • Silicon Box announced a successful $200M Series B fundraising round, bringing the company to over a one-billion-dollar valuation.
  • Silicon Box and its technologies are extremely important for the semiconductor industry, and the digital world."

TDK Ventures invests in Silicon Box and its revolutionary chiplet technology

Retrieved on: 
Thursday, January 4, 2024
Dai, Partnership, TDK, SAN, Head, Chiplet, Artificial intelligence, Machine learning, SOC, Silicon, Foot, STATS, Cassette tape

TDK Ventures looks to partner with this superstar team to accelerate the most recent semiconductor packaging innovations to market through Silicon Box.

Key Points: 
  • TDK Ventures looks to partner with this superstar team to accelerate the most recent semiconductor packaging innovations to market through Silicon Box.
  • Silicon Box is turning this approach on its head through its innovative semiconductor package design and fabrication method, which enables chiplets.
  • TDK Ventures' President Nicolas Sauvage commented, "TDK Ventures is excited to partner with the world-class team at Silicon Box.
  • To learn more about TDK Ventures, interested startups or investment partners should visit www.tdk-ventures.com or reach out at [email protected] .

TDK Ventures invests in Silicon Box and its revolutionary chiplet technology

Retrieved on: 
Thursday, January 4, 2024
Dai, Partnership, TDK, SAN, Head, Chiplet, Artificial intelligence, Machine learning, SOC, Silicon, Foot, STATS, Cassette tape

TDK Ventures looks to partner with this superstar team to accelerate the most recent semiconductor packaging innovations to market through Silicon Box.

Key Points: 
  • TDK Ventures looks to partner with this superstar team to accelerate the most recent semiconductor packaging innovations to market through Silicon Box.
  • Silicon Box is turning this approach on its head through its innovative semiconductor package design and fabrication method, which enables chiplets.
  • TDK Ventures' President Nicolas Sauvage commented, "TDK Ventures is excited to partner with the world-class team at Silicon Box.
  • To learn more about TDK Ventures, interested startups or investment partners should visit www.tdk-ventures.com or reach out at [email protected] .

Wire Bonder Equipment Market - 2022 to 2027 | The increasing number of OSAT companies drives market growth

Retrieved on: 
Tuesday, September 19, 2023
IDM, OSAT, Electronics, Compound annual growth rate, Wire, Retirement, Car, Investment, ASE, Growth, STATS, Geography, Semiconductor

NEW YORK, Sept. 19, 2023 /PRNewswire/ -- The Wire Bonder Equipment Market is projected to have remarkable growth, with a Compound Annual Growth Rate (CAGR) of 3.3% between 2022 and 2027.

Key Points: 
  • NEW YORK, Sept. 19, 2023 /PRNewswire/ -- The Wire Bonder Equipment Market is projected to have remarkable growth, with a Compound Annual Growth Rate (CAGR) of 3.3% between 2022 and 2027.
  • The wire bonder equipment market is seeing strong growth due to the increasing number of OSAT (Outsourced Semiconductor Assembly and Test) companies, particularly in the APAC region, notably China.
  • The dominant trend driving growth in the global wire bonder equipment market is the increasing popularity of flip-chip bonding technology.
  • For more information, get the free sample report here
    One of the challenges affecting wire bonder equipment market growth is the shortage of skilled personnel.