RDL

3X Upgrade! Meet with VOOPOO's New Super Pods ARGUS P2&G2

Retrieved on: 
Friday, March 22, 2024
Tobacco, Retail, Longevity, Taste, MTL, Heat, RDL, ARGUS, Nicotine, P1, Multimedia, Video game

The two new super pods come with a 3X upgrade, fully upgrading the user's vaping experience.

Key Points: 
  • The two new super pods come with a 3X upgrade, fully upgrading the user's vaping experience.
  • View the full release here: https://www.businesswire.com/news/home/20240321764139/en/
    Recommended Retail Price: ARGUS P2:$34.99 ARGUS G2:$35.99 (Photo: Business Wire)
    ARGUS P2 and ARGUS G2 are the second generation of VOOPOO's flagship pods, ARGUS P1 and ARGUS G. Compared with the predecessors, the new two products feature higher power and larger screens.
  • The “3X upgrade” means that the new ARGUS top fill cartridge achieves comprehensive upgrades in three aspects: leakage, longevity and flavor.
  • Meet VOOPOO's new super pods ARGUS P2 & G2 with 3X upgrade.

Ellomay Capital Reports Results for the Fourth Quarter and Full Year of 2023

Retrieved on: 
Sunday, March 31, 2024
Shekel, Season, Tax, Agreement, Dorad Power Station, SWAP, Sale, P-50, Depreciation, Disclosure, Bank statement, RDL, Electricity, Klahim, Legislation, AMPA, Iron, Public expenditure, Good, Israeli new shekel, PPA, Zorlu, Komemiyut, Bank Mizrahi-Tefahot, Acquisition, PV, EBIDTA, Loss, D&O, Greenhouse, Government, Total, Renewable energy

•  Operating expenses were approximately €22.9 million for the year ended December 31, 2023, compared to approximately €23.7 million for the year ended December 31, 2022.

Key Points: 
  • •  Operating expenses were approximately €22.9 million for the year ended December 31, 2023, compared to approximately €23.7 million for the year ended December 31, 2022.
  • •  Project development costs were approximately €4.5 million for the year ended December 31, 2023, compared to approximately €3.8 million for the year ended December 31, 2022.
  • During 2023, the Ellomay Solar project (28 MW) produced revenues from the sale of electricity and green certificates of approximately €4 million.
  • The Company's EBITDA may not be indicative of the Company's historic operating results; nor is it meant to be predictive of potential future results.

IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging

Retrieved on: 
Wednesday, March 27, 2024
Temperature, Communication, Silicon dioxide, L/S, Polymer, Copper, CTE, Coefficient, CMP, TCB, Intermetallic, RDL, Miniaturization, Ecosystem, Young, Viscoelasticity, IMC, Printed circuit board

This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".

Key Points: 
  • This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".
  • However, traditional inorganic dielectric materials like SiO2, though capable of achieving fine L/S, suffer from high dielectric constants (Dk=3.9) and are tied to the Si manufacturing technique.
  • Organic dielectric materials emerge as promising alternatives for advanced semiconductor packaging, offering lower dielectric constants and cost advantages.
  • Finally, the report includes a 10-year market forecast for Organic Dielectric Advanced Semiconductor Packaging, providing industry perspectives on market growth and trends.

IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging

Retrieved on: 
Wednesday, March 27, 2024
Temperature, Communication, Silicon dioxide, L/S, Polymer, Copper, CTE, Coefficient, CMP, TCB, Intermetallic, RDL, Miniaturization, Ecosystem, Young, Viscoelasticity, IMC, Printed circuit board

This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".

Key Points: 
  • This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ".
  • However, traditional inorganic dielectric materials like SiO2, though capable of achieving fine L/S, suffer from high dielectric constants (Dk=3.9) and are tied to the Si manufacturing technique.
  • Organic dielectric materials emerge as promising alternatives for advanced semiconductor packaging, offering lower dielectric constants and cost advantages.
  • Finally, the report includes a 10-year market forecast for Organic Dielectric Advanced Semiconductor Packaging, providing industry perspectives on market growth and trends.

3X Upgrade - Meet with VOOPOO's New Super Pods ARGUS P2&G2

Retrieved on: 
Friday, March 15, 2024
Longevity, Taste, MTL, Heat, RDL, ARGUS, Nicotine, P1, Multimedia, Video game

The two new super pods come with a 3X upgrade, fully upgrading the user's vaping experience.

Key Points: 
  • The two new super pods come with a 3X upgrade, fully upgrading the user's vaping experience.
  • ARGUS P2 and ARGUS G2 are the second generation of VOOPOO's flagship pods, ARGUS P1 and ARGUS G. Compared with the predecessors, the new two products feature higher power and larger screens.
  • The "3X upgrade" means that the new ARGUS top fill cartridge achieves comprehensive upgrades in three aspects: leakage, longevity and flavor.
  • Meet VOOPOO's new super pods ARGUS P2 & G2 with 3X upgrade.

Onto Innovation Debuts Firefly® G3 Panel-level Packaging Inspection System

Retrieved on: 
Tuesday, January 16, 2024
Data Management, Technology, Manufacturing, Semiconductor, Other Manufacturing, Software, Artificial Intelligence, Packaging, Machinery, Hardware, Machine Tools, Metalworking & Metallurgy, Classification, GPU, Glass, RDL, Multimedia, G3, 3D, CCL, Firefly, Printed circuit board

Onto Innovation Inc. (NYSE: ONTO) today announced the launch of the new Firefly® G3 inspection and metrology system for automated process control during high volume production of panel-level substrates.

Key Points: 
  • Onto Innovation Inc. (NYSE: ONTO) today announced the launch of the new Firefly® G3 inspection and metrology system for automated process control during high volume production of panel-level substrates.
  • The Firefly G3 system was shipped to a tier one customer supporting a variety of AI chiplet based panel-level packages with several additional customers expected to take delivery in the first half of 2024.
  • This next-generation Firefly system goes beyond 2D inspection and metrology by supporting additional process control steps through the introduction of 3D metrology sensors.
  • To learn more about Onto’s Firefly G3 system, contact us or reach out to your local sales team .

ASE launches its Integrated Design EcosystemTM to enable silicon package design efficiencies that reduce cycle time by half

Retrieved on: 
Tuesday, October 3, 2023
Semiconductor, Manufacturing, Electronic Design Automation, Technology, Engineering, DRC, R&D, Magic, Workflow, EDA, Sales & Marketing Executives International, NDA, Integrated design, ASX, RDL, SOC, Machine learning, HPC, ASE, PDK, Architecture, Artificial intelligence, Silicon, IDE, Transport, Ecosystem, Integration, Substrate, Memory, NYSE, Software, Video game, Printed circuit board, TAIEX

ASE’s IDE enables design efficiencies up to 50% and sets new standards for quality and user experience.

Key Points: 
  • ASE’s IDE enables design efficiencies up to 50% and sets new standards for quality and user experience.
  • Integrating novel package design tool capabilities into ASE’s workflow has resulted in significant cycle time reduction while lowering customer costs.
  • Enhanced features of IDE include cross platform interaction encompassing layout and verification, advanced RDL and silicon interposer auto routing with embedded design rule checking (DRC), and Package Design Kit (PDK) implementation in the design workflow.
  • Today’s semiconductor technology roadmaps comprise complex performance requirements that are driving advanced packaging trends, yet present unique package design challenges.

Ellomay Capital Reports Results for the Three and Six Months Ended June 30, 2023

Retrieved on: 
Thursday, September 28, 2023
Shekel, Maintenance, Zorlu, Sale, Sharsheret, D&O, Electricity, Bank statement, Tax, Battery, Season, Bank Mizrahi-Tefahot, P-50, Talmei Yosef, RDL, PV, Israeli new shekel, Government, Kilowatt-hour, Public expenditure, Komemiyut, EBITDA, TASE, Depreciation, NIS, Dunam, PPA, Greenhouse, NYSE, Manara, Legislation, Klahim, Renewable energy, Cryptocurrency, Spanish, Dorad Power Station

Revenues were approximately €25.5 million for the six months ended June 30, 2023, compared to approximately €29.2 million for the six months ended June 30, 2022.

Key Points: 
  • Revenues were approximately €25.5 million for the six months ended June 30, 2023, compared to approximately €29.2 million for the six months ended June 30, 2022.
  • Operating expenses were approximately €12 million for the six months ended June 30, 2023, compared to approximately €13.1 million for the six months ended June 30, 2022.
  • General and administrative expenses were approximately €2.9 million for the six months ended June 30, 2023, compared to approximately €3.3 million for the six months ended June 30, 2022.
  • Profit for the six months ended June 30, 2023, was approximately €4.6 million, compared to a loss of approximately €0.6 million for the six months ended June 30, 2022.

Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging

Retrieved on: 
Friday, September 15, 2023
Hardness, Pressure, ECD, IMC, 3D, RDL, Intermetallic, Temperature, EMC, MUF, CMP, Miniaturization, Risk, Knowledge, Copper, Ecosystem, CU, TCB, Printed circuit board

Their reports, titled " Advanced Semiconductor Packaging 2023-2033 " and " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ", encapsulate their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.

Key Points: 
  • Their reports, titled " Advanced Semiconductor Packaging 2023-2033 " and " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ", encapsulate their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.
  • Challenges in Cu-Cu Hybrid Bonding Manufacturing:
    Cu-Cu hybrid bonding technology holds great promise for advanced semiconductor packaging, but it also presents a set of challenges that require innovative solutions for future development.
  • To learn more about 3D semiconductor packaging (Cu-Cu hybrid bonding), please refer to the IDTechEx report: "Materials and Processing for Advanced Semiconductor Packaging 2024-2034".
  • The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D semiconductor packaging (Cu-Cu hybrid bonding).

Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging

Retrieved on: 
Friday, September 15, 2023
Hardness, Pressure, ECD, IMC, 3D, RDL, Intermetallic, Temperature, EMC, MUF, CMP, Miniaturization, Risk, Knowledge, Copper, Ecosystem, CU, TCB, Printed circuit board

Their reports, titled " Advanced Semiconductor Packaging 2023-2033 " and " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ", encapsulate their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.

Key Points: 
  • Their reports, titled " Advanced Semiconductor Packaging 2023-2033 " and " Materials and Processing for Advanced Semiconductor Packaging 2024-2034 ", encapsulate their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.
  • Challenges in Cu-Cu Hybrid Bonding Manufacturing:
    Cu-Cu hybrid bonding technology holds great promise for advanced semiconductor packaging, but it also presents a set of challenges that require innovative solutions for future development.
  • To learn more about 3D semiconductor packaging (Cu-Cu hybrid bonding), please refer to the IDTechEx report: "Materials and Processing for Advanced Semiconductor Packaging 2024-2034".
  • The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D semiconductor packaging (Cu-Cu hybrid bonding).