Amkor Technology

Amkor Technology to Announce First Quarter 2024 Financial Results on April 29, 2024

Retrieved on: 
Tuesday, April 9, 2024
Technology, Hardware, Semiconductor, Webcast, Amkor Technology

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the first quarter of 2024 after the close of trading on the Nasdaq Global Select Market on Monday, April 29, 2024.

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the first quarter of 2024 after the close of trading on the Nasdaq Global Select Market on Monday, April 29, 2024.
  • Amkor management will host a conference call and webcast to review the results on Monday, April 29, 2024, at 5:00 p.m. Eastern Time (ET).
  • To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor’s website, located at ir.amkor.com .
  • An archived replay of the webcast will be available after completion of the call.

Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions

Retrieved on: 
Monday, April 8, 2024
Professional Services, Semiconductor, Consumer Electronics, Technology, Other Technology, Outsourcing Business, Hardware, Amkor Technology, Partnership, Internet of things, Automotive industry, Engineering

With this long-term agreement, Infineon and Amkor further strengthen their partnership, extending the classical outsourced semiconductor assembly and test (OSAT) business model.

Key Points: 
  • With this long-term agreement, Infineon and Amkor further strengthen their partnership, extending the classical outsourced semiconductor assembly and test (OSAT) business model.
  • The cooperation further strengthens the European semiconductor supply chain and contributes to making it more resilient – especially for automotive customers.
  • “Infineon and Amkor are jointly increasing geographical resilience and supply security for our customers.
  • This collaboration represents another milestone for both companies in enhancing supply chain resiliency for advanced products supporting Automotive & Industrial end markets.”

Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging

Retrieved on: 
Tuesday, March 19, 2024
CHIPS, Intel, Arizona State University, FOWLP, Development, Amkor Technology, Research, Electronics, Artificial intelligence, ASU, SWAP, Science, Faculty, Student, Heart, Deca, Machine learning, Government, TSMC, Telescopic sight

TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.

Key Points: 
  • TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.
  • The center will combine state-of-the-art advanced-packaging technology, equipment, processes, materials, expertise and training, fostering the development of new capabilities from proof of concept to pilot scale.
  • In collaboration with Deca, ASU is committed to establishing onshore access to these advanced-packaging capabilities.
  • The Gen 2 M-Series including Adaptive Patterning technology brings unprecedented scaling to higher densities for heterogeneous integration and chiplet applications.

Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, March 25, 2024
Polychlorinated biphenyl, Growth, Kyocera, IC, Amkor Technology, Internet of things, LG Chem, Tablet, Electronics, AI, Texas Instruments, SOP, SMT, PCB, Ceramic

They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.

Key Points: 
  • They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.
  • In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.
  • Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management.
  • This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics.

Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Monday, March 25, 2024
Polychlorinated biphenyl, Growth, Kyocera, IC, Amkor Technology, Internet of things, LG Chem, Tablet, Electronics, AI, Texas Instruments, SOP, SMT, PCB, Ceramic

They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.

Key Points: 
  • They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.
  • In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.
  • Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management.
  • This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics.

Amkor Technology to Present at Upcoming Conferences

Retrieved on: 
Tuesday, February 27, 2024
Apps, Applications, Technology, Mobile, Wireless, Semiconductor, Software, Networks, Internet, Hardware, Data Management, Kimpton Clocktower Hotel, KeyBank, Conference, Amkor Technology

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced its participation in the following upcoming investor conferences:

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced its participation in the following upcoming investor conferences:
    Morgan Stanley Technology, Media & Telecom Conference on Tuesday, March 5, 2024.
  • Amkor’s presentation will occur at 1:20 pm Pacific Time (4:20 pm Eastern Time) at The Palace Hotel in San Francisco, CA.
  • KeyBanc Capital Markets Emerging Technology Summit on Wednesday, March 6, 2024.
  • Live webcasts and replays of the presentations will be available on the Investor Relations section of Amkor’s website at ir.amkor.com.

Amkor Technology Declares Quarterly Dividend

Retrieved on: 
Tuesday, February 20, 2024
Electronic Design Automation, Semiconductor, Engineering, Technology, Manufacturing, Hardware, Amkor Technology

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that its Board of Directors has approved a quarterly cash dividend of $0.07875 per share on the company’s common stock.

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that its Board of Directors has approved a quarterly cash dividend of $0.07875 per share on the company’s common stock.
  • The dividend will be payable on April 1, 2024 to stockholders of record as of the close of business on March 12, 2024.

Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2023

Retrieved on: 
Monday, February 5, 2024
Semiconductor, Hardware, Manufacturing, Technology, Packaging, Investment, Amkor Technology, Communication, Automotive industry, Weakness, GAAP

The reconciliations to the comparable GAAP measures are included below under “Selected Operating Data.”

Key Points: 
  • The reconciliations to the comparable GAAP measures are included below under “Selected Operating Data.”
    At December 31, 2023, total cash and short-term investments was $1.59 billion, and total debt was $1.20 billion.
  • On November 14, 2023, Amkor’s Board of Directors announced a 5% increase in the company’s quarterly cash dividend, from $0.075 per share to $0.07875 per share, on the company’s common stock.
  • The increase was effective with the dividend paid on December 26, 2023.
  • To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor’s website, located at ir.amkor.com.

Amkor Technology to Announce Fourth Quarter and Full Year 2023 Financial Results on February 5, 2024

Retrieved on: 
Tuesday, January 16, 2024
Packaging, Semiconductor, Technology, Other Technology, Manufacturing, Hardware, Webcast, Amkor Technology

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the fourth quarter and full year of 2023 after the close of trading on the Nasdaq Global Select Market on Monday, February 5, 2024.

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the fourth quarter and full year of 2023 after the close of trading on the Nasdaq Global Select Market on Monday, February 5, 2024.
  • Amkor management will host a conference call and webcast to review the results on Monday, February 5, 2024, at 5:00 p.m. Eastern Time (ET).
  • To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor’s website, located at ir.amkor.com .
  • An archived replay of the webcast will be available after completion of the call.

Global Semiconductor Industry Insights: 2023 Research Value Pack Highlights IC Design, Manufacturing, and OSAT Sectors

Retrieved on: 
Friday, January 12, 2024
MediaTek, Research, IC, Memory, Research report, Frontrunners, Amkor Technology, Samsung, AMD, Qualcomm, TSMC, SMIC

DUBLIN, Jan. 12, 2024 /PRNewswire/ -- The "2023 Semiconductor Industry Research Value Pack" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Jan. 12, 2024 /PRNewswire/ -- The "2023 Semiconductor Industry Research Value Pack" report has been added to ResearchAndMarkets.com's offering.
  • The semiconductor industry stands as a pivotal contributor to technological advancements, shaping the trajectory of global innovation and economic growth.
  • A comprehensive research study, now available, delves into the intricate ecosystems of IC design, IC manufacturing, and OSAT sectors, providing a detailed overview for the period extending through 2022 and 2023, with a forward-looking perspective.
  • This investigation includes nuanced analyses of the markets in key regions, including global perspectives, Taiwan, and China, and their supply chains.